SMS130 Schottky Diode Equivalent & Substitute Parts

Part Overview

The SMS130 is an active Schottky rectifier diode manufactured by Diotec Semiconductor, designed for surface mount applications in the DO-213AB MELF package. This component operates at 30 V DC reverse voltage with 1 A average rectified current and features fast recovery characteristics suitable for high-frequency switching applications. The SMS130 is specified for junction temperatures from -50°C to 150°C.

Substitute parts are identified to address inventory availability, supply chain continuity, or specific application requirements while maintaining electrical and mechanical compatibility within the defined parameter envelope.

Substiute Parts

SMS130
Diotec SemiconductorIn Stock: 1031SMS130 Datasheet
SMS130
Current Part
BYM13-30-E3/96
Vishay General Semiconductor - Diodes DivisionIn Stock: 4838BYM13-30-E3/96 Datasheet
BYM13-30-E3/96
Similar

Key Parameters

Parameter Value Unit
Technology Schottky
Voltage - DC Reverse (Vr) (Max) 30 V
Current - Average Rectified (Io) 1 A
Voltage - Forward (Vf) (Max) @ If 500 mV @ 1 A
Speed Fast Recovery ≤ 500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr 500 µA @ 30 V
Package / Case DO-213AB, MELF
Mounting Type Surface Mount
Operating Temperature - Junction -50°C ~ 150°C

Substitute Part Grouping Explanation

Substitution of the SMS130 is based on strict electrical and mechanical parameter matching within the Schottky diode category. The following criteria determine substitute eligibility:

Critical Matching Parameters:

  • Voltage rating: 30 V DC reverse voltage (Vr) maximum
  • Current rating: 1 A average rectified current (Io)
  • Forward voltage: 500 mV maximum at 1 A forward current
  • Recovery speed: Fast recovery ≤ 500ns at > 200mA
  • Reverse leakage: 500 µA at 30 V
  • Package: DO-213AB MELF surface mount configuration
  • Technology: Schottky rectifier diode

The BYM13-30-E3/96 manufactured by Vishay General Semiconductor meets all critical electrical parameters and shares the identical DO-213AB MELF package footprint, enabling direct substitution in surface mount applications.

Parameter Comparison

Parameter SMS130 (Diotec) BYM13-30-E3/96 (Vishay) Match Status
Technology Schottky Schottky Identical
Voltage - DC Reverse (Vr) (Max) 30 V 30 V Identical
Current - Average Rectified (Io) 1 A 1 A Identical
Voltage - Forward (Vf) (Max) @ If 500 mV @ 1 A 500 mV @ 1 A Identical
Speed Fast Recovery ≤ 500ns, > 200mA (Io) Fast Recovery ≤ 500ns, > 200mA (Io) Identical
Current - Reverse Leakage @ Vr 500 µA @ 30 V 500 µA @ 30 V Identical
Package / Case DO-213AB, MELF DO-213AB, MELF Identical
Mounting Type Surface Mount Surface Mount Identical
Operating Temperature - Junction -50°C ~ 150°C -55°C ~ 125°C Overlapping Range
Product Status Active Active Identical

Engineering Selection Recommendations

SMS130 (Diotec Semiconductor): Select this part when the extended upper junction temperature rating of 150°C is required for high-temperature applications. The SMS130 maintains active product status with established supply channels.

BYM13-30-E3/96 (Vishay General Semiconductor): This substitute part is ROHS3 compliant and REACH unaffected, providing regulatory compliance advantages for applications subject to environmental directives. The Tape & Reel packaging format supports automated assembly processes. The BYM13-30-E3/96 operates within the overlapping temperature range of -55°C to 125°C, suitable for applications not requiring the extended upper temperature limit of the SMS130.

Both parts share identical electrical specifications and DO-213AB MELF package geometry, enabling direct substitution at the circuit board level. Selection between these parts depends on application temperature requirements, regulatory compliance needs, and supply chain availability.

Frequently Asked Questions (FAQ)

Q: Can the BYM13-30-E3/96 replace the SMS130 in all applications?

A: The BYM13-30-E3/96 is electrically and mechanically compatible with the SMS130 for applications operating within the junction temperature range of -55°C to 125°C. Applications requiring sustained operation above 125°C junction temperature must use the SMS130, which is rated to 150°C.

Q: Are the package footprints identical?

A: Yes. Both the SMS130 and BYM13-30-E3/96 use the DO-213AB MELF surface mount package, providing identical PCB footprints and reflow soldering profiles.

Q: What are the key electrical parameters that must match for substitution?

A: Substitution requires matching of voltage rating (30 V), current rating (1 A), forward voltage (500 mV @ 1 A), recovery speed (≤ 500ns), and reverse leakage current (500 µA @ 30 V). All these parameters are identical between the SMS130 and BYM13-30-E3/96.

Q: Does the BYM13-30-E3/96 offer any compliance advantages?

A: The BYM13-30-E3/96 is ROHS3 compliant and REACH unaffected, providing regulatory compliance for applications subject to European environmental directives. The SMS130 has undefined REACH status.

Q: What is the difference in packaging format?

A: The SMS130 is supplied in standard packaging, while the BYM13-30-E3/96 is supplied in Tape & Reel (TR) format, which is optimized for automated pick-and-place assembly processes.

Q: Can these parts be used interchangeably on the same PCB assembly?

A: Yes. The identical DO-213AB MELF package, matching electrical specifications, and overlapping operating temperature ranges enable direct interchangeability on the same PCB assembly without design modifications.

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