SMP-PL-P-HG-ST-TH2 Equivalent & Substitute Parts

Part Overview

The SMP-PL-P-HG-ST-TH2 is a 50 Ohm SMP plug connector with male pin configuration, designed for through-hole solder mounting. This coaxial RF connector operates at frequencies up to 40 GHz and is manufactured by Samtec Inc. The part maintains active product status and is ROHS3 compliant. Substitute parts are identified when equivalent electrical and mechanical parameters align with the original specification, enabling component interchangeability in RF circuit applications where connector performance and impedance matching are critical.

Substiute Parts

SMP-PL-P-HG-ST-TH2
Samtec Inc.In Stock: 1134SMP-PL-P-HG-ST-TH2 Datasheet
SMP-PL-P-HG-ST-TH2
Current Part
SMP-PL-P-GF-ST-TH2
Samtec Inc.In Stock: 1027SMP-PL-P-GF-ST-TH2 Datasheet
SMP-PL-P-GF-ST-TH2
Parametric Equivalent
CONSMP001-2-G
TE Connectivity LinxIn Stock: 1311CONSMP001-2-G Datasheet
CONSMP001-2-G
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Part Number SMP-PL-P-HG-ST-TH2
Manufacturer Samtec Inc.
Category Coaxial Connectors (RF)
Connector Style SMP
Connector Type Plug, Male Pin
Impedance 50 Ohms
Mounting Type Through Hole
Contact Termination Solder
Shield Termination Solder
Frequency - Max 40 GHz
Operating Temperature -65°C ~ 165°C
Voltage Rating 335 V
Product Status Active
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the SMP-PL-P-HG-ST-TH2 are qualified based on the following critical parameters that determine functional equivalence:

Primary Equivalence Criteria:

  • Connector Style: SMP
  • Connector Type: Plug, Male Pin
  • Impedance: 50 Ohms
  • Mounting Type: Through Hole
  • Contact Termination: Solder
  • Shield Termination: Solder
  • Frequency - Max: 40 GHz
  • Fastening Type: Snap-On
  • Number of Ports: 1

Secondary Compatibility Parameters:

  • Operating Temperature Range: -65°C minimum, 165°C maximum
  • Voltage Rating: 335 V minimum
  • Dielectric Material: PTFE or equivalent RF-grade material
  • Body Material: Brass or equivalent conductive material
  • Center Contact Material: Brass or equivalent
  • Body Finish: Gold
  • Center Contact Plating: Gold
  • Features: Limited Detent
  • RoHS Status: ROHS3 Compliant

Parts meeting all primary criteria and maintaining compatibility within secondary parameter ranges are classified as parametric equivalents suitable for direct substitution.

Parameter Comparison

Parameter SMP-PL-P-HG-ST-TH2 SMP-PL-P-GF-ST-TH2 CONSMP001-2-G
Manufacturer Samtec Inc. Samtec Inc. TE Connectivity Linx
Connector Style SMP SMP SMP
Connector Type Plug, Male Pin Plug, Male Pin Plug, Male Pin
Impedance 50 Ohms 50 Ohms 50 Ohms
Mounting Type Through Hole Through Hole Through Hole
Contact Termination Solder Solder Solder
Shield Termination Solder Solder Solder
Frequency - Max 40 GHz 40 GHz 40 GHz
Fastening Type Snap-On Snap-On Snap-On
Number of Ports 1 1 1
Operating Temperature -65°C ~ 165°C -65°C ~ 165°C -65°C ~ 155°C
Voltage Rating 335 V 335 V 500 V
Center Contact Material Brass Brass Beryllium Copper
Body Material Brass Brass Beryllium Copper
Dielectric Material PTFE PTFE PAI
Body Finish Gold Gold Gold
Center Contact Plating Gold Gold Gold
Features Limited Detent Limited Detent Limited Detent
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Mating Cycles - - 100

Engineering Selection Recommendations

SMP-PL-P-GF-ST-TH2 (Samtec Inc.)

This substitute maintains identical electrical and mechanical specifications to the primary part. Both components share the same base product number (SMP-PL), manufacturer, and all critical RF parameters including 50 Ohm impedance, 40 GHz frequency capability, and PTFE dielectric material. Operating temperature range, voltage rating, and material composition are equivalent. ROHS3 compliance is maintained. This part is suitable for direct substitution in applications where the original SMP-PL-P-HG-ST-TH2 is specified.

CONSMP001-2-G (TE Connectivity Linx)

This substitute meets all primary equivalence criteria for SMP plug connector functionality at 50 Ohms and 40 GHz. Material composition differs, utilizing Beryllium Copper for body and center contact instead of Brass, with Polyamide-Imide (PAI) dielectric instead of PTFE. Operating temperature maximum is reduced to 155°C compared to 165°C. Voltage rating is elevated to 500 V. Mating cycle specification of 100 cycles is provided. ROHS3 compliance is confirmed. Selection of this part requires verification that the reduced maximum operating temperature and alternative dielectric material are compatible with the application environment and RF performance requirements.

Frequently Asked Questions (FAQ)

Q: Can SMP-PL-P-GF-ST-TH2 be used as a direct replacement for SMP-PL-P-HG-ST-TH2?

A: Yes. Both parts are SMP plug connectors with identical 50 Ohm impedance, 40 GHz frequency rating, through-hole solder mounting, and PTFE dielectric material. Electrical and mechanical parameters are equivalent, supporting direct substitution.

Q: What are the key differences between SMP-PL-P-HG-ST-TH2 and CONSMP001-2-G?

A: The primary differences are material composition and operating temperature range. CONSMP001-2-G uses Beryllium Copper body and center contact with PAI dielectric, compared to Brass with PTFE in the original part. Maximum operating temperature is 155°C versus 165°C. Voltage rating is higher at 500 V. RF performance at 50 Ohms and 40 GHz remains equivalent.

Q: Is CONSMP001-2-G suitable for applications requiring 165°C operation?

A: No. CONSMP001-2-G is rated to 155°C maximum. Applications requiring operation at 165°C must use SMP-PL-P-HG-ST-TH2 or SMP-PL-P-GF-ST-TH2.

Q: Are all three parts ROHS3 compliant?

A: Yes. SMP-PL-P-HG-ST-TH2, SMP-PL-P-GF-ST-TH2, and CONSMP001-2-G are all ROHS3 compliant.

Q: What does the SMP connector style indicate?

A: SMP designates the SubMiniature Push-on connector style, a standardized RF connector format used in high-frequency applications up to 40 GHz with snap-on fastening and 50 Ohm impedance.

Q: Can these connectors be used interchangeably in PCB through-hole applications?

A: Yes, all three parts support through-hole solder mounting on printed circuit boards. Physical footprint compatibility should be verified during design integration.

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