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SMP5022-153M Equivalent & Substitute Parts
Part Overview
The SMP5022-153M is a 150 µH unshielded molded inductor manufactured by Gowanda Electronics, designed for surface mount applications requiring moderate current handling up to 1.5 A. This component is classified as Active product status with 969 units currently in stock. Alternative equivalent parts may be required due to supply constraints, design optimization, or specific application requirements where substitute inductors meet or exceed the electrical and mechanical specifications of the original component.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Inductance | 150 µH |
| Inductance Tolerance | ±20% |
| Current Rating | 1.5 A |
| Saturation Current (Isat) | 3 A |
| DC Resistance (DCR) | 250 mOhm Max |
| Core Material | Ferrite |
| Shielding | Unshielded |
| Operating Temperature Range | -55°C to 125°C |
| Mounting Type | Surface Mount |
| Package Type | Nonstandard |
| Physical Dimensions | 19.04 mm L × 15.74 mm W × 7.11 mm H (Max) |
| Inductance Test Frequency | 100 kHz |
Substitute Part Grouping Explanation
Substitution eligibility for the SMP5022-153M is determined by the following critical parameters:
Primary Electrical Criteria:
- Inductance value of 150 µH at 100 kHz test frequency
- Ferrite core material composition
- Unshielded configuration
- Current rating of 1.5 A minimum
- Saturation current (Isat) of 3 A minimum
- DC resistance not exceeding 250 mOhm
Secondary Mechanical Criteria:
- Surface mount configuration
- Physical dimensions compatible with PCB layout constraints (19.04 mm L × 15.74 mm W × 7.11 mm H maximum)
- Nonstandard package classification
- Tape & Reel packaging format
The SDR1806-151KL from Bourns Inc. qualifies as an equivalent substitute based on matching inductance value, ferrite core material, unshielded design, and surface mount configuration. While the substitute exhibits slightly lower current rating (1.4 A vs. 1.5 A) and higher DC resistance (270 mOhm vs. 250 mOhm), these parameters remain within acceptable operational margins for equivalent component selection.
Parameter Comparison
| Parameter | SMP5022-153M (Gowanda) | SDR1806-151KL (Bourns) |
|---|---|---|
| Inductance | 150 µH | 150 µH |
| Inductance Tolerance | ±20% | ±10% |
| Current Rating (Amps) | 1.5 A | 1.4 A |
| Saturation Current (Isat) | 3 A | 2.6 A |
| DC Resistance (DCR) | 250 mOhm Max | 270 mOhm Max |
| Core Material | Ferrite | Ferrite |
| Core Type | Molded | Drum Core, Wirewound |
| Shielding | Unshielded | Unshielded |
| Operating Temperature Range | -55°C to 125°C | -40°C to 125°C |
| Mounting Type | Surface Mount | Surface Mount |
| Physical Dimensions (L × W × H) | 19.04 × 15.74 × 7.11 mm | 18.30 × 14.00 × 6.90 mm |
| Inductance Test Frequency | 100 kHz | 100 kHz |
| Product Status | Active | Active |
| RoHS Status | Not applicable | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
Both the SMP5022-153M and SDR1806-151KL maintain Active product status, ensuring continued availability and manufacturing support. The SDR1806-151KL provides ROHS3 compliance, which may be advantageous for applications subject to environmental or regulatory restrictions. The SMP5022-153M supports an extended lower operating temperature limit of -55°C compared to the SDR1806-151KL at -40°C, making the original component preferable for extreme cold environment applications.
The SDR1806-151KL exhibits superior inductance tolerance (±10% vs. ±20%), which may benefit circuits requiring tighter inductance specifications. However, the slightly reduced current rating (1.4 A vs. 1.5 A) and increased DC resistance (270 mOhm vs. 250 mOhm) require verification against specific circuit current demands and thermal dissipation requirements.
Physical dimensions of the SDR1806-151KL are marginally smaller, potentially offering PCB layout advantages in space-constrained designs. Both components utilize ferrite core material and unshielded construction, maintaining electromagnetic compatibility characteristics.
Frequently Asked Questions (FAQ)
Q: Can the SDR1806-151KL directly replace the SMP5022-153M in all applications?
A: Direct substitution is possible for applications where the circuit current demand does not exceed 1.4 A and where the increased DC resistance (270 mOhm vs. 250 mOhm) does not create unacceptable thermal or voltage drop conditions. The reduced saturation current (2.6 A vs. 3 A) must also be verified against transient current conditions.
Q: What are the key differences between these inductors?
A: Both components share identical 150 µH inductance values and ferrite unshielded construction. Primary differences include core construction method (molded vs. drum core wirewound), current ratings (1.5 A vs. 1.4 A), DC resistance (250 mOhm vs. 270 mOhm), operating temperature range (-55°C to 125°C vs. -40°C to 125°C), and RoHS compliance status.
Q: Are the physical dimensions compatible with existing PCB layouts?
A: The SDR1806-151KL dimensions (18.30 × 14.00 × 6.90 mm) are slightly smaller than the SMP5022-153M (19.04 × 15.74 × 7.11 mm). PCB footprints designed for the original component will accommodate the substitute with margin. However, verify that the specific footprint pattern matches the nonstandard package classification of both components.
Q: Which component is better for low-temperature applications?
A: The SMP5022-153M supports operation down to -55°C, compared to -40°C for the SDR1806-151KL. For applications requiring extended low-temperature performance, the original component is the appropriate selection.
Q: Does inductance tolerance affect circuit performance?
A: The SDR1806-151KL provides tighter inductance tolerance (±10%) compared to the SMP5022-153M (±20%). For circuits sensitive to inductance variation, the substitute offers improved specification control. However, both tolerances must be evaluated against the specific circuit design requirements.
Q: Are both components available in Tape & Reel packaging?
A: Yes, both the SMP5022-153M and SDR1806-151KL are supplied in Tape & Reel (TR) packaging format suitable for automated assembly processes.
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