SMP18FPZ Equivalent & Substitute Parts

Part Overview

The SMP18FPZ is a Sample and Hold integrated circuit manufactured by Analog Devices Inc., designed for data acquisition applications. This 16-pin DIP package device integrates eight operational amplifier circuits with sample-and-hold functionality. The SMP18FPZ is classified as an obsolete product, necessitating identification of active equivalent alternatives for new designs and ongoing system support. Substitute parts must maintain functional equivalence in sample-and-hold operation while accommodating different packaging and mounting technologies.

Substiute Parts

SMP18FPZ

Analog Devices Inc.In Stock: 1181SMP18FPZ Datasheet

Current PartRFQ

SMP18FSZ

Analog Devices Inc.In Stock: 1858SMP18FSZ Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SMP18FPZ is determined by equivalence across the following parameters:

Functional Equivalence: Both the main part and substitute share the same base product number (SMP18), indicating identical internal circuit architecture and operational characteristics for sample-and-hold data acquisition.

Manufacturer Consistency: Both parts are manufactured by Analog Devices Inc., ensuring design continuity and technical support consistency.

Regulatory and Compliance Alignment: Both parts carry identical ECCN (EAR99) and HTSUS (8542.33.0001) classifications, confirming equivalent export control and tariff treatment.

Moisture Sensitivity: Both parts maintain MSL Level 1 (Unlimited), indicating identical moisture handling requirements and storage conditions.

Primary Differentiation: The substitution relationship is based on packaging and mounting technology transition from through-hole (16-DIP) to surface-mount (16-SOIC) form factors, with the substitute representing the active product line continuation.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The SMP18FPZ is classified as obsolete, while the SMP18FSZ maintains active product status. For new designs and long-term system support, the SMP18FSZ is the appropriate selection.

Compliance and Certification: Both parts share identical regulatory classifications (ECCN: EAR99, HTSUS: 8542.33.0001) and moisture sensitivity levels, confirming equivalent compliance profiles. The SMP18FSZ carries RoHS3 compliance and REACH Unaffected status, providing additional regulatory alignment for current manufacturing standards.

Packaging and Integration: Selection between these parts depends on circuit board design requirements. The SMP18FPZ utilizes through-hole mounting (16-DIP), while the SMP18FSZ employs surface-mount technology (16-SOIC). Through-hole designs require PCB via holes and manual or wave soldering processes. Surface-mount designs enable automated assembly and reduced board space. Pin-to-pin functional equivalence is maintained across both package types.

Inventory and Availability: The SMP18FSZ demonstrates higher current inventory levels (1831 pcs) compared to the SMP18FPZ (1108 pcs), reflecting its active product status and continued manufacturing support.

Frequently Asked Questions (FAQ)

Q: Can the SMP18FSZ directly replace the SMP18FPZ in existing designs?

A: Functional replacement is possible due to identical internal circuit architecture and pin configuration. However, physical board layout modifications are required. The SMP18FPZ uses through-hole mounting (16-DIP package), while the SMP18FSZ uses surface-mount technology (16-SOIC package). PCB redesign is necessary to accommodate the different package footprint and soldering method.

Q: What are the key differences between the 16-DIP and 16-SOIC packages?

A: The 16-DIP package measures 0.300" (7.62mm) in width and uses through-hole mounting with wire leads inserted into PCB holes. The 16-SOIC package measures 0.154" (3.90mm) in width and uses surface-mount technology with leads soldered directly to PCB pads. The SOIC package provides reduced board space and enables automated assembly processes.

Q: Are there any compliance or regulatory differences between these parts?

A: Both parts carry identical ECCN (EAR99) and HTSUS (8542.33.0001) classifications. The SMP18FSZ includes RoHS3 compliance and REACH Unaffected status, reflecting current regulatory standards. Both parts maintain MSL Level 1 (Unlimited) moisture sensitivity classification.

Q: Why is the SMP18FPZ classified as obsolete?

A: The SMP18FPZ represents an earlier through-hole technology generation. Analog Devices Inc. has transitioned the SMP18 product line to surface-mount packaging (SMP18FSZ) to align with modern manufacturing processes and market demand for compact, automated assembly solutions.

Q: What is the pin count for both parts?

A: Both the SMP18FPZ and SMP18FSZ are 16-pin devices. Pin configuration and functional assignment remain identical between the two packages, ensuring circuit-level compatibility when PCB layout is adapted to the new package footprint.

Q: Can I use the SMP18FSZ in a through-hole PCB design without modification?

A: No. The SMP18FSZ requires surface-mount PCB design with appropriate pad patterns and soldering processes. Through-hole PCB designs cannot accommodate surface-mount components without significant board redesign.