SM671PXE-ADSS Equivalent & Substitute Parts

Part Overview

The SM671PXE-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 640Gbit organized as 80G x 8. This component features UFS3.1 interface technology and is packaged in a 153-TFBGA form factor measuring 11.5x13mm. The device operates across a temperature range of -25°C to 85°C and is classified as non-volatile memory suitable for high-capacity storage applications.

The SM671PXE-ADSS currently holds an Obsolete product status. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for systems utilizing this memory architecture.

Key Parameters

Parameter	Value
Memory Type	Non-Volatile FLASH
Technology	FLASH - NAND (SLC)
Memory Size	640Gbit
Memory Organization	80G x 8
Memory Interface	UFS3.1
Package / Case	153-TFBGA (11.5x13mm)
Mounting Type	Surface Mount
Operating Temperature	-25°C ~ 85°C
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the SM671PXE-ADSS is determined by strict alignment across the following critical parameters:

Memory Capacity & Organization: The substitute part must provide 640Gbit capacity with 80G x 8 organization to ensure functional equivalence in storage applications.

Interface Specification: UFS3.1 interface compatibility is mandatory for electrical and protocol-level compatibility with host systems designed for the original component.

Package & Form Factor: The 153-TFBGA package measuring 11.5x13mm is required to maintain mechanical compatibility with existing PCB layouts and assembly processes.

Memory Technology: FLASH - NAND (SLC) technology classification must be preserved to maintain performance characteristics and data retention properties.

Environmental & Compliance Specifications: Operating temperature range of -25°C to 85°C, RoHS3 compliance, and MSL 3 rating must be maintained to ensure reliability in specified operating conditions and regulatory adherence.

Manufacturer Consistency: Silicon Motion, Inc. as the manufacturer ensures design continuity and technical support alignment.

Parameter Comparison

Parameter	SM671PXE-ADSS (Main Part)	SM671PXE-AFSS (Substitute)
Manufacturer	Silicon Motion, Inc.	Silicon Motion, Inc.
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NAND (SLC)	FLASH - NAND (SLC)
Memory Size	640Gbit	640Gbit
Memory Organization	80G x 8	80G x 8
Memory Interface	UFS3.1	UFS3.1
Package / Case	153-TFBGA	153-TFBGA
Supplier Device Package	153-BGA (11.5x13)	153-BGA (11.5x13)
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-25°C ~ 85°C	-25°C ~ 85°C
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)	3 (168 Hours)
Product Status	Obsolete	Active

Engineering Selection Recommendations

The SM671PXE-AFSS serves as a direct functional equivalent to the SM671PXE-ADSS. Both components share identical electrical specifications, memory capacity, interface protocol, and physical packaging requirements. The primary distinction is product lifecycle status: the SM671PXE-ADSS is classified as Obsolete, while the SM671PXE-AFSS maintains Active status.

For new designs or ongoing production requiring 640Gbit UFS3.1 NAND flash memory in 153-TFBGA packaging, the SM671PXE-AFSS is the appropriate selection. This substitute part maintains full compliance with RoHS3 regulations and preserves all environmental operating parameters specified for the original component.

Both parts are manufactured by Silicon Motion, Inc., ensuring consistent design architecture, firmware compatibility, and technical support continuity. The Active product status of the SM671PXE-AFSS provides extended supply availability and manufacturing support compared to the Obsolete SM671PXE-ADSS.

Frequently Asked Questions (FAQ)

Q: Can the SM671PXE-AFSS be used as a direct replacement for the SM671PXE-ADSS in existing designs?

A: Yes. The SM671PXE-AFSS is electrically and mechanically equivalent to the SM671PXE-ADSS. Both components feature identical memory capacity (640Gbit), organization (80G x 8), interface specification (UFS3.1), package type (153-TFBGA 11.5x13mm), and operating temperature range (-25°C to 85°C). No design modifications are required for substitution.

Q: Are there differences in compliance certifications between these parts?

A: Both the SM671PXE-ADSS and SM671PXE-AFSS are RoHS3 compliant and carry identical Moisture Sensitivity Level 3 ratings. The SM671PXE-AFSS includes documented REACH Unaffected status, providing additional regulatory clarity for supply chain applications.

Q: What is the significance of the product status difference?

A: The SM671PXE-ADSS is classified as Obsolete, indicating discontinued manufacturing and limited availability. The SM671PXE-AFSS maintains Active status, ensuring ongoing production, supply chain availability, and manufacturer technical support. For new procurement or production planning, the Active-status SM671PXE-AFSS is the recommended selection.

Q: Are the package dimensions identical between these components?

A: Yes. Both parts utilize the 153-TFBGA package with dimensions of 11.5x13mm. PCB footprints, assembly processes, and thermal management considerations remain unchanged between the two components.

Q: What memory technology is used in both parts?

A: Both the SM671PXE-ADSS and SM671PXE-AFSS employ FLASH - NAND (SLC) technology. Single-Level Cell (SLC) architecture provides consistent performance characteristics and data retention properties across both components.

Q: Is the UFS3.1 interface specification identical for both parts?

A: Yes. Both components implement UFS3.1 (Universal Flash Storage 3.1) interface protocol. Host system compatibility, command sets, and electrical signaling requirements are identical between the SM671PXE-ADSS and SM671PXE-AFSS.

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