SM671PXD-ADSS Equivalent & Substitute Parts

Part Overview

The SM671PXD-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 320Gbit and UFS3.1 interface. This component is packaged in a 153-TFBGA (11.5x13mm) surface mount configuration and operates across the temperature range of -25°C to 85°C. The part is classified as obsolete, necessitating identification of equivalent substitute components for ongoing design requirements and procurement needs.

Substiute Parts

SM671PXD-ADSS

Silicon Motion, Inc.In Stock: 941SM671PXD-ADSS Datasheet

Current PartRFQ

SM671PXD-AFSS

Silicon Motion, Inc.In Stock: 1187SM671PXD-AFSS Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM671PXD-ADSS is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: The substitute part must provide 320Gbit capacity with 40G x 8 memory organization to maintain functional compatibility with existing system architecture.

Interface Standard: UFS3.1 interface compatibility is mandatory for data transfer protocol alignment with host controllers and system firmware.

Package Configuration: The 153-TFBGA (11.5x13mm) surface mount package ensures mechanical and electrical compatibility with PCB layouts and reflow soldering processes.

Operating Temperature Range: The -25°C to 85°C specification must be maintained to ensure reliable operation across specified environmental conditions.

Compliance Standards: ROHS3 compliance and MSL 3 (168 Hours) rating are required for regulatory adherence and moisture handling during manufacturing and storage.

Manufacturer Consistency: Silicon Motion, Inc. as the original manufacturer ensures design continuity and firmware compatibility within the Ferri-UFS™ series.

Parameter Comparison

Engineering Selection Recommendations

The SM671PXD-AFSS serves as a direct functional equivalent to the SM671PXD-ADSS. Both components share identical electrical and mechanical specifications across all critical parameters: 320Gbit capacity, UFS3.1 interface, 153-TFBGA package, and operating temperature range.

The primary distinction between these parts is product status. The SM671PXD-ADSS is classified as obsolete, while the SM671PXD-AFSS maintains active product status with confirmed inventory availability (1158 pieces in stock versus 831 pieces for the obsolete variant). Both parts maintain ROHS3 compliance and identical MSL ratings, ensuring regulatory and manufacturing process compatibility.

For new designs and ongoing procurement, the SM671PXD-AFSS is the appropriate selection due to its active status and sustained supply chain availability. For legacy system maintenance where the SM671PXD-ADSS is currently deployed, the SM671PXD-AFSS provides direct substitution without design modification or system re-qualification.

Frequently Asked Questions (FAQ)

Q: Can the SM671PXD-AFSS replace the SM671PXD-ADSS in existing designs?

A: Yes. Both parts are electrically and mechanically identical across all specified parameters. The SM671PXD-AFSS provides direct substitution without PCB layout changes or firmware modifications.

Q: What is the significance of the product status difference?

A: The SM671PXD-ADSS is classified as obsolete, indicating discontinued manufacturing and limited long-term availability. The SM671PXD-AFSS maintains active status with ongoing production and supply chain support.

Q: Are there any compliance or certification differences between these parts?

A: No. Both components maintain identical ROHS3 compliance status and MSL 3 (168 Hours) moisture sensitivity ratings. No additional certifications or compliance documentation changes are required for substitution.

Q: Does the package configuration remain identical?

A: Yes. Both parts utilize the 153-TFBGA (11.5x13mm) surface mount package. PCB footprints, reflow profiles, and assembly processes remain unchanged.

Q: Is the UFS3.1 interface specification identical between both parts?

A: Yes. Both components implement UFS3.1 interface with identical protocol support and data transfer specifications. Host controller compatibility is maintained without firmware updates.

Q: What is the memory organization specification, and is it consistent?

A: Both parts feature 40G x 8 memory organization, providing 320Gbit total capacity. This organization ensures compatibility with existing system memory mapping and addressing schemes.

Q: Are there any thermal or environmental operating differences?

A: No. Both components operate across the identical temperature range of -25°C to 85°C. Thermal management requirements and environmental specifications remain unchanged.