SM671PXC-ADST Equivalent & Substitute Parts

Part Overview

The SM671PXC-ADST is a FLASH NAND (TLC) memory IC manufactured by Silicon Motion, Inc., with 512Gbit capacity and UFS3.1 interface in a 153-BGA package. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and procurement planning. The part operates across an industrial temperature range of -25°C to 85°C and complies with ROHS3 standards.

Substiute Parts

SM671PXC-ADST

Silicon Motion, Inc.In Stock: 1001SM671PXC-ADST Datasheet

Current PartRFQ

SM671PXC-AFST

Silicon Motion, Inc.In Stock: 1128SM671PXC-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM671PXC-ADST is determined by the following critical parameters:

• Memory Capacity: 512Gbit (exact match required)
• Memory Organization: 64G x 8 (exact match required)
• Memory Interface: UFS3.1 (exact match required)
• Package Type: 153-TFBGA with dimensions 11.5x13mm (exact match required)
• Memory Technology: FLASH - NAND (TLC) (exact match required)
• Operating Temperature Range: -25°C ~ 85°C (exact match required)
• Mounting Type: Surface Mount (exact match required)

The SM671PXC-AFST meets all substitution criteria as it maintains identical specifications across memory capacity, organization, interface protocol, package configuration, and thermal operating range.

Parameter Comparison

Engineering Selection Recommendations

The SM671PXC-AFST is a direct functional equivalent to the SM671PXC-ADST. Both components share identical electrical and mechanical specifications, including memory capacity, interface protocol, package configuration, and thermal characteristics. The primary distinction is product status: the SM671PXC-ADST is obsolete while the SM671PXC-AFST maintains active production status. For new designs or ongoing procurement, the SM671PXC-AFST is the appropriate selection. Both parts maintain ROHS3 compliance and identical moisture sensitivity ratings, ensuring compatibility with existing assembly and storage protocols.

Frequently Asked Questions (FAQ)

Q: Can SM671PXC-AFST directly replace SM671PXC-ADST in existing designs?

A: Yes. Both parts are identical in memory capacity (512Gbit), organization (64G x 8), interface (UFS3.1), package type (153-TFBGA 11.5x13mm), and operating temperature range (-25°C ~ 85°C). No design modifications are required.

Q: What is the significance of the product status difference?

A: SM671PXC-ADST is classified as obsolete, indicating discontinued production. SM671PXC-AFST maintains active status, ensuring ongoing availability and supply chain continuity.

Q: Are there any compliance or certification differences?

A: Both parts maintain ROHS3 compliance and identical Moisture Sensitivity Level (MSL) ratings of 3 (168 Hours). No compliance adjustments are necessary when substituting between these parts.

Q: Does the package configuration remain identical?

A: Yes. Both parts use the 153-TFBGA package with dimensions of 11.5x13mm. PCB footprints, solder reflow profiles, and assembly procedures remain unchanged.

Q: Are there inventory considerations for this substitution?

A: SM671PXC-AFST has higher current inventory availability (1050 Pcs) compared to SM671PXC-ADST (978 Pcs), supporting improved procurement lead times and supply reliability.