SM671PEE-ADST Equivalent & Substitute Parts

Part Overview

The SM671PEE-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc. This device provides 2Tbit storage capacity with UFS3.1 interface in a 153-BGA surface mount package. The SM671PEE-ADST is classified as obsolete product status, necessitating identification of active equivalent components for ongoing design requirements and production continuity.

Substiute Parts

SM671PEE-ADST

Silicon Motion, Inc.In Stock: 1079SM671PEE-ADST Datasheet

Current PartRFQ

SM671PEE-AFST

Silicon Motion, Inc.In Stock: 1099SM671PEE-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM671PEE-ADST is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: Both the main part and substitute maintain identical 2Tbit capacity with 256G x 8 organization, ensuring data storage compatibility.

Interface Standard: UFS3.1 interface specification is maintained across all equivalent parts, guaranteeing protocol-level compatibility with host systems.

Package Specification: The 153-TFBGA (11.5x13) package dimensions and ball grid array configuration remain constant, ensuring mechanical and electrical compatibility with existing PCB layouts.

Technology Node: FLASH NAND (TLC) technology is consistent across all parts, maintaining performance characteristics and reliability profiles.

Environmental Specifications: Operating temperature range of -40°C ~ 85°C and Moisture Sensitivity Level 3 (168 Hours) are preserved across substitute components.

Compliance Standards: RoHS3 compliance is maintained for all equivalent parts.

Parameter Comparison

Engineering Selection Recommendations

The SM671PEE-AFST serves as the direct equivalent substitute for the obsolete SM671PEE-ADST. Both components share identical electrical specifications, memory capacity, interface protocol, and physical packaging. The primary distinction is product status: SM671PEE-ADST is classified as obsolete, while SM671PEE-AFST maintains active status with confirmed inventory availability (1035 Pcs New Original In Stock).

For applications currently utilizing SM671PEE-ADST, transition to SM671PEE-AFST is supported by complete parameter equivalence. Both components are manufactured by Silicon Motion, Inc. within the Ferri-UFS™ series and maintain ROHS3 compliance and identical moisture sensitivity specifications.

The SM671PEE-AFST is suitable for direct replacement in existing designs without modification to PCB layouts, firmware, or system-level interface protocols.

Frequently Asked Questions (FAQ)

Q: Can SM671PEE-AFST replace SM671PEE-ADST in existing designs?

A: Yes. Both components are electrically and mechanically equivalent. Identical memory capacity (2Tbit), interface standard (UFS3.1), package specification (153-TFBGA 11.5x13), and operating parameters ensure direct compatibility without design modification.

Q: Are there differences in the package footprint between these parts?

A: No. Both SM671PEE-ADST and SM671PEE-AFST utilize the identical 153-BGA (11.5x13) package specification. PCB layouts and assembly processes require no adjustment.

Q: What is the significance of the product status difference?

A: SM671PEE-ADST is classified as obsolete, indicating discontinued manufacturing and limited availability. SM671PEE-AFST maintains active status with current production and confirmed inventory. For new designs and production continuity, SM671PEE-AFST is the appropriate selection.

Q: Are compliance certifications identical between these parts?

A: Yes. Both components maintain ROHS3 compliance and identical Moisture Sensitivity Level 3 (168 Hours) specifications. Environmental and regulatory requirements are equivalent.

Q: What is the memory interface compatibility?

A: Both parts implement UFS3.1 interface standard. Host systems designed for UFS3.1 protocol operation are compatible with either component without firmware or driver modification.

Q: Are there any differences in memory organization?

A: No. Both components maintain 256G x 8 memory organization with 2Tbit total capacity. Data addressing and access patterns are identical.