SM671PEC-ADST Equivalent & Substitute Parts

Part Overview

The SM671PEC-ADST is a FLASH NAND (TLC) Memory IC manufactured by Silicon Motion, Inc., with 512Gbit capacity and UFS3.1 interface in a 153-BGA package. This component is classified as Obsolete, making identification of functionally equivalent alternatives necessary for ongoing system support and procurement planning. The part operates across the industrial temperature range of -40°C to 85°C and complies with ROHS3 standards.

Substiute Parts

SM671PEC-ADST

Silicon Motion, Inc.In Stock: 837SM671PEC-ADST Datasheet

Current PartRFQ

SM671PEC-AFST

Silicon Motion, Inc.In Stock: 845SM671PEC-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM671PEC-ADST is determined by the following critical parameters:

• Memory Capacity: 512Gbit (exact match required)
• Memory Organization: 64G x 8 (exact match required)
• Memory Interface: UFS3.1 (exact match required)
• Package Type: 153-TFBGA with dimensions 11.5x13mm (exact match required)
• Technology: FLASH - NAND (TLC) (exact match required)
• Operating Temperature Range: -40°C ~ 85°C (exact match required)
• Mounting Type: Surface Mount (exact match required)

The SM671PEC-AFST meets all substitution criteria as it maintains identical specifications across memory capacity, organization, interface protocol, package configuration, and thermal operating range. Both parts are from the Ferri-UFS™ series and share the same base product number (SM671).

Parameter Comparison

Engineering Selection Recommendations

The SM671PEC-AFST is a direct functional equivalent to the SM671PEC-ADST. Both components share identical electrical and mechanical specifications, including memory capacity, interface protocol, package configuration, and thermal operating range. The primary distinction is product lifecycle status: the SM671PEC-ADST is classified as Obsolete, while the SM671PEC-AFST maintains Active status with current inventory availability (751 pcs). Both parts maintain ROHS3 compliance and equivalent moisture sensitivity ratings. Selection of the SM671PEC-AFST is supported by its active product status and confirmed stock availability.

Frequently Asked Questions (FAQ)

Q: Can SM671PEC-AFST replace SM671PEC-ADST in existing designs?

A: Yes. Both parts are electrically and mechanically identical across all specified parameters: 512Gbit capacity, UFS3.1 interface, 153-BGA package (11.5x13mm), FLASH NAND (TLC) technology, and -40°C to 85°C operating range. No design modifications are required.

Q: What is the difference between these two part numbers?

A: The parts differ only in product lifecycle status. SM671PEC-ADST is Obsolete; SM671PEC-AFST is Active. All functional and compliance specifications are identical.

Q: Are there any package or pinout differences?

A: No. Both parts use the identical 153-TFBGA package with 11.5x13mm dimensions. Pinout and mechanical footprint are identical.

Q: Do both parts meet the same compliance standards?

A: Yes. Both SM671PEC-ADST and SM671PEC-AFST are ROHS3 compliant with MSL rating of 3 (168 Hours).

Q: Which part should be selected for new procurement?

A: SM671PEC-AFST should be selected for new procurement due to its Active product status and current inventory availability.