SM671PEC-ADSS Equivalent & Substitute Parts

Part Overview

The SM671PEC-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., featuring 160Gbit capacity with UFS3.1 interface in a 153-BGA package. This component is classified as obsolete, necessitating identification of active equivalent parts for ongoing design requirements and procurement planning. The part operates across an industrial temperature range of -40°C to 85°C and complies with ROHS3 standards.

Substiute Parts

SM671PEC-ADSS

Silicon Motion, Inc.In Stock: 973SM671PEC-ADSS Datasheet

Current PartRFQ

SM671PEC-AFSS

Silicon Motion, Inc.In Stock: 1082SM671PEC-AFSS Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM671PEC-ADSS is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: The substitute part must provide identical 160Gbit capacity with 20G x 8 organization to ensure functional compatibility at the system level.

Interface Protocol: UFS3.1 interface specification is mandatory for electrical and protocol compatibility with host controllers and system architecture.

Package Specification: The 153-TFBGA (11.5x13) package defines mechanical fit, thermal characteristics, and PCB layout requirements. Substitutes must match this exact package specification.

Technology Node: FLASH - NAND (SLC) technology classification ensures consistent performance characteristics and reliability profiles.

Temperature Range: Operating range of -40°C to 85°C establishes the thermal envelope for system deployment.

Compliance Standards: ROHS3 compliance and MSL 3 rating are regulatory and handling requirements that must be maintained.

The SM671PEC-AFSS meets all these criteria as an active equivalent part within the Ferri-UFS™ series from Silicon Motion, Inc.

Parameter Comparison

Engineering Selection Recommendations

The SM671PEC-AFSS is the direct equivalent substitute for the obsolete SM671PEC-ADSS. Both parts are manufactured by Silicon Motion, Inc., within the Ferri-UFS™ series and share identical electrical specifications, memory capacity, interface protocol, and package configuration.

The primary distinction is product status: SM671PEC-ADSS is classified as obsolete, while SM671PEC-AFSS maintains active status with confirmed inventory availability (1014 pieces in stock). This status difference reflects manufacturing lifecycle positioning rather than functional or performance divergence.

Both parts maintain ROHS3 compliance and identical MSL 3 ratings, ensuring regulatory and handling requirements are preserved across substitution. The operating temperature range, package dimensions, and all electrical parameters remain constant between the two part numbers.

For new designs or ongoing production requiring 160Gbit UFS3.1 NAND flash memory in 153-BGA packaging, SM671PEC-AFSS is the appropriate selection due to active product status and supply availability.

Frequently Asked Questions (FAQ)

Q: Can SM671PEC-AFSS be used as a direct replacement for SM671PEC-ADSS in existing designs?

A: Yes. Both parts are functionally equivalent across all specified electrical and mechanical parameters. The 153-TFBGA package, UFS3.1 interface, 160Gbit capacity, and operating temperature range are identical. PCB layouts and system integration require no modification.

Q: What is the significance of the product status difference between these parts?

A: Product status indicates manufacturing lifecycle position. SM671PEC-ADSS is obsolete, meaning Silicon Motion, Inc., has discontinued production and support. SM671PEC-AFSS is active, indicating ongoing manufacturing and supply availability. For procurement and long-term supply chain planning, the active part is the appropriate selection.

Q: Are there any compliance or certification differences between these parts?

A: No. Both parts maintain identical ROHS3 compliance status and MSL 3 moisture sensitivity ratings. Regulatory and handling requirements are equivalent.

Q: Does the package specification remain unchanged between these parts?

A: Yes. Both parts use the 153-TFBGA package with dimensions of 11.5x13mm. Surface mount assembly processes, thermal management, and PCB layout considerations are identical.

Q: What is the memory interface specification for these parts?

A: Both parts implement UFS3.1 (Universal Flash Storage 3.1) interface protocol. This specification defines electrical signaling, command structure, and data transfer protocols for host controller communication.

Q: Are there any temperature or environmental operating differences?

A: No. Both parts operate across the identical temperature range of -40°C to 85°C, supporting industrial and extended commercial applications without thermal performance variation.