SM671PEB-ADST Equivalent & Substitute Parts Reference

Part Overview

The SM671PEB-ADST is a FLASH NAND (TLC) memory IC manufactured by Silicon Motion, Inc., featuring 256Gbit capacity with UFS3.1 interface in a 153-BGA package. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and procurement planning. The part operates across the industrial temperature range of -40°C to 85°C and complies with ROHS3 standards.

Substiute Parts

SM671PEB-ADST

Silicon Motion, Inc.In Stock: 1140SM671PEB-ADST Datasheet

Current PartRFQ

SM671PEB-AFST

Silicon Motion, Inc.In Stock: 719SM671PEB-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM671PEB-ADST is determined by the following critical parameters:

• Memory Capacity: 256Gbit (exact match required)
• Memory Technology: FLASH - NAND (TLC) (exact match required)
• Memory Organization: 32G x 8 (exact match required)
• Memory Interface: UFS3.1 (exact match required)
• Package Type: 153-TFBGA / 153-BGA (11.5x13) (exact match required)
• Operating Temperature Range: -40°C ~ 85°C (exact match required)
• Mounting Type: Surface Mount (exact match required)
• RoHS Compliance: ROHS3 Compliant (exact match required)
• Moisture Sensitivity Level: 3 (168 Hours) (exact match required)

The SM671PEB-AFST meets all substitution criteria as a functionally equivalent alternative within the Ferri-UFS™ series.

Parameter Comparison

Engineering Selection Recommendations

The SM671PEB-AFST is the qualified substitute for the obsolete SM671PEB-ADST. Both components share identical electrical and mechanical specifications across all critical parameters. The primary distinction is product status: SM671PEB-ADST is obsolete while SM671PEB-AFST maintains active status, ensuring continued availability and manufacturing support. Both components comply with ROHS3 standards and are manufactured by Silicon Motion, Inc. within the Ferri-UFS™ series. Selection of SM671PEB-AFST is appropriate for new designs and replacement applications requiring 256Gbit UFS3.1 memory in 153-BGA packaging.

Frequently Asked Questions (FAQ)

Q: Can SM671PEB-AFST directly replace SM671PEB-ADST in existing designs?

A: Yes. Both components are electrically and mechanically identical across all specified parameters, including memory capacity, interface protocol, package type, and operating temperature range. No design modifications are required.

Q: What is the significance of the product status difference?

A: SM671PEB-ADST is classified as obsolete, indicating discontinued manufacturing. SM671PEB-AFST maintains active status, ensuring ongoing availability from suppliers and manufacturing support from Silicon Motion, Inc.

Q: Are there any compliance differences between these parts?

A: No. Both components comply with ROHS3 standards and share identical moisture sensitivity levels (MSL 3, 168 Hours).

Q: What determines substitution eligibility for this memory IC?

A: Substitution requires exact matching of memory capacity (256Gbit), technology (FLASH - NAND TLC), organization (32G x 8), interface (UFS3.1), package type (153-BGA 11.5x13), operating temperature range (-40°C to 85°C), and compliance certifications (ROHS3).

Q: Is the 153-BGA package compatible with existing PCB designs for SM671PEB-ADST?

A: Yes. Both components use identical 153-TFBGA packaging with 11.5x13mm dimensions, ensuring mechanical and electrical compatibility with existing board layouts and assembly processes.