SM671PEB-ADSS Equivalent & Substitute Parts

Part Overview

The SM671PEB-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., designed for non-volatile storage applications. This device features 80Gbit capacity with UFS3.1 interface protocol, housed in a 153-BGA (11.5x13mm) surface mount package. The SM671PEB-ADSS is classified as obsolete, necessitating identification of active equivalent components for new designs and ongoing production requirements. Substitute parts must maintain identical electrical specifications, memory capacity, interface protocol, and physical packaging to ensure direct compatibility.

Substiute Parts

SM671PEB-ADSS
Silicon Motion, Inc.In Stock: 984SM671PEB-ADSS Datasheet
SM671PEB-ADSS
Current Part
SM671PEB-AFSS
Silicon Motion, Inc.In Stock: 1128SM671PEB-AFSS Datasheet
SM671PEB-AFSS
Similar

Key Parameters

Parameter Value
Memory Type Non-Volatile FLASH
Technology FLASH - NAND (SLC)
Memory Size 80Gbit
Memory Organization 10G x 8
Memory Interface UFS3.1
Package / Case 153-TFBGA
Supplier Device Package 153-BGA (11.5x13)
Operating Temperature Range -40°C ~ 85°C
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitute parts for the SM671PEB-ADSS are identified based on strict equivalence across the following critical parameters:

Memory Capacity & Organization: 80Gbit capacity with 10G x 8 organization ensures identical data storage and access characteristics.

Interface Protocol: UFS3.1 interface specification maintains compatibility with host controllers and system architecture.

Physical Package: 153-TFBGA (11.5x13mm) package dimensions and ball grid array configuration enable direct PCB footprint compatibility.

Technology & Memory Type: FLASH - NAND (SLC) technology classification ensures consistent performance characteristics and reliability profiles.

Environmental & Compliance Specifications: Operating temperature range (-40°C ~ 85°C), RoHS3 compliance, and MSL rating (3, 168 Hours) must remain constant across substitute selections.

Mounting Configuration: Surface mount technology with identical package specifications ensures manufacturing process compatibility.

Parameter Comparison

Parameter SM671PEB-ADSS (Main Part) SM671PEB-AFSS (Substitute) Match Status
Manufacturer Silicon Motion, Inc. Silicon Motion, Inc. Identical
Memory Type Non-Volatile FLASH Non-Volatile FLASH Identical
Technology FLASH - NAND (SLC) FLASH - NAND (SLC) Identical
Memory Size 80Gbit 80Gbit Identical
Memory Organization 10G x 8 10G x 8 Identical
Memory Interface UFS3.1 UFS3.1 Identical
Package / Case 153-TFBGA 153-TFBGA Identical
Supplier Device Package 153-BGA (11.5x13) 153-BGA (11.5x13) Identical
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C Identical
Mounting Type Surface Mount Surface Mount Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) Identical
Product Status Obsolete Active Substitute is Active
Series Ferri-UFS ™ Ferri-UFS ™ Identical

Engineering Selection Recommendations

The SM671PEB-AFSS serves as the direct equivalent substitute for the obsolete SM671PEB-ADSS. Both components are manufactured by Silicon Motion, Inc., within the Ferri-UFS™ series and share identical electrical, mechanical, and environmental specifications.

Product Status Consideration: The SM671PEB-ADSS is classified as obsolete, while the SM671PEB-AFSS maintains active product status. This distinction is critical for procurement planning and long-term supply chain management. The active status of SM671PEB-AFSS ensures continued availability and manufacturer support.

Compliance & Certification: Both parts maintain ROHS3 compliance and identical MSL ratings (3, 168 Hours), ensuring equivalent handling and storage requirements. The SM671PEB-AFSS includes documented REACH Unaffected status, providing additional regulatory clarity for international applications.

Direct Substitution Capability: All critical parameters—memory capacity (80Gbit), interface protocol (UFS3.1), package configuration (153-BGA 11.5x13mm), and operating temperature range (-40°C ~ 85°C)—are identical between the main part and substitute. This equivalence permits direct component replacement without design modification or system re-qualification.

Frequently Asked Questions (FAQ)

Q: Can SM671PEB-AFSS replace SM671PEB-ADSS in existing designs?

A: Yes. The SM671PEB-AFSS is a direct equivalent substitute. All electrical specifications, memory capacity, interface protocol, package dimensions, and environmental operating parameters are identical. No design changes are required.

Q: What is the primary difference between these two part numbers?

A: The SM671PEB-ADSS is classified as obsolete, while the SM671PEB-AFSS maintains active product status. Both components are functionally and electrically equivalent. The active status of SM671PEB-AFSS ensures ongoing availability and manufacturer support.

Q: Are the physical packages identical?

A: Yes. Both components use the 153-TFBGA package with dimensions of 11.5x13mm. PCB footprints, solder ball configurations, and mounting requirements are identical, enabling direct board-level substitution.

Q: Do these parts have the same moisture sensitivity requirements?

A: Yes. Both the SM671PEB-ADSS and SM671PEB-AFSS carry MSL rating 3 (168 Hours), requiring identical handling, storage, and reflow procedures.

Q: Are both parts RoHS3 compliant?

A: Yes. Both components meet ROHS3 compliance requirements. The SM671PEB-AFSS additionally carries REACH Unaffected status.

Q: What is the operating temperature range for these devices?

A: Both parts operate across the identical temperature range of -40°C to 85°C, suitable for industrial and commercial applications.

Q: Can these parts be used interchangeably in production?

A: Yes. The SM671PEB-AFSS can be used as a direct replacement for SM671PEB-ADSS in manufacturing. The active product status of SM671PEB-AFSS provides supply chain continuity for ongoing production requirements.

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