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SM671PEA-ADST Equivalent & Substitute Parts
Part Overview
The SM671PEA-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc. This component is a 128Gbit UFS3.1 non-volatile memory device housed in a 153-BGA package with dimensions of 11.5x13mm. The device operates across a temperature range of -40°C to 85°C and is classified as obsolete, necessitating identification of active equivalent components for ongoing design requirements and production continuity.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Type | Non-Volatile FLASH |
| Technology | FLASH - NAND (TLC) |
| Memory Size | 128Gbit |
| Memory Organization | 16G x 8 |
| Memory Interface | UFS3.1 |
| Package Type | 153-TFBGA (11.5x13mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the SM671PEA-ADST is determined by strict equivalence across the following critical parameters:
Memory Capacity and Organization: The substitute part must provide 128Gbit capacity with 16G x 8 memory organization to maintain functional compatibility with existing system architecture.
Interface Protocol: UFS3.1 interface compatibility is mandatory for seamless integration with host controllers and data transfer protocols.
Package Specification: The 153-TFBGA package with 11.5x13mm dimensions ensures mechanical and electrical compatibility with existing PCB layouts and solder reflow processes.
Temperature Range: Operating temperature specification of -40°C to 85°C must be maintained to support identical environmental deployment conditions.
Compliance Standards: RoHS3 compliance and MSL 3 (168 Hours) moisture sensitivity classification must be preserved for regulatory and manufacturing process alignment.
Base Product Series: Both components share the SM671 base product number and Ferri-UFS™ series designation, confirming architectural compatibility.
Parameter Comparison
| Parameter | SM671PEA-ADST (Main) | SM671PEA-AFST (Substitute) |
|---|---|---|
| Manufacturer | Silicon Motion, Inc. | Silicon Motion, Inc. |
| Memory Type | Non-Volatile FLASH | Non-Volatile FLASH |
| Technology | FLASH - NAND (TLC) | FLASH - NAND (TLC) |
| Memory Size | 128Gbit | 128Gbit |
| Memory Organization | 16G x 8 | 16G x 8 |
| Memory Interface | UFS3.1 | UFS3.1 |
| Package / Case | 153-TFBGA | 153-TFBGA |
| Supplier Device Package | 153-BGA (11.5x13) | 153-BGA (11.5x13) |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) | 3 (168 Hours) |
| Series | Ferri-UFS™ | Ferri-UFS™ |
| Base Product Number | SM671 | SM671 |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The SM671PEA-AFST serves as a direct functional equivalent to the SM671PEA-ADST. Both components are manufactured by Silicon Motion, Inc., and share identical electrical specifications, memory capacity, interface protocol, and physical packaging.
The primary distinction between these components is product status: the SM671PEA-ADST is classified as obsolete, while the SM671PEA-AFST maintains active product status. This status difference reflects manufacturing lifecycle positioning rather than technical capability divergence.
Both components maintain ROHS3 compliance and identical moisture sensitivity classification, ensuring regulatory alignment and manufacturing process compatibility. The SM671PEA-AFST is suitable for new designs, production continuity, and replacement applications where the SM671PEA-ADST is no longer available through standard distribution channels.
Frequently Asked Questions (FAQ)
Q: Can the SM671PEA-AFST directly replace the SM671PEA-ADST in existing designs?
A: Yes. The SM671PEA-AFST provides identical electrical and mechanical specifications, including memory capacity (128Gbit), interface protocol (UFS3.1), package type (153-TFBGA, 11.5x13mm), and operating temperature range (-40°C to 85°C). No design modifications are required.
Q: What is the significance of the product status difference between these components?
A: The SM671PEA-ADST is classified as obsolete, indicating it is no longer in active production or standard distribution. The SM671PEA-AFST maintains active status, ensuring continued availability and manufacturing support. For new production and long-term supply chain planning, the SM671PEA-AFST is the appropriate selection.
Q: Are there any compliance or certification differences between these parts?
A: No. Both components maintain identical RoHS3 compliance status and MSL 3 (168 Hours) moisture sensitivity classification. Regulatory and manufacturing process requirements are equivalent.
Q: Do these components share the same PCB footprint?
A: Yes. Both components utilize the 153-TFBGA package with identical 11.5x13mm dimensions. PCB layouts, solder reflow profiles, and assembly processes are interchangeable.
Q: What is the inventory status of the substitute part?
A: The SM671PEA-AFST has 883 pieces available as new original stock, providing adequate supply for production requirements.
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