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SM671PBE-ADST Equivalent & Substitute Parts
Part Overview
The SM671PBE-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc. This device provides 2Tbit storage capacity with UFS3.1 interface support in a 153-BGA surface mount package. The part is classified as obsolete, necessitating identification of active equivalent components for ongoing design support and procurement continuity.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Type | Non-Volatile FLASH |
| Technology | FLASH - NAND (TLC) |
| Memory Size | 2Tbit |
| Memory Organization | 256G x 8 |
| Memory Interface | UFS3.1 |
| Package Type | 153-TFBGA (11.5x13) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40°C ~ 105°C |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) |
| Series | Ferri-UFS™ |
Substitute Part Grouping Explanation
Substitution of the SM671PBE-ADST is determined by strict equivalence across the following critical parameters:
Memory Capacity & Organization: Both the main part and substitute maintain identical 2Tbit capacity with 256G x 8 organization, ensuring data storage compatibility.
Interface Protocol: UFS3.1 interface specification is maintained across all equivalent parts, guaranteeing protocol-level compatibility with host controllers.
Package Specification: The 153-TFBGA (11.5x13) package dimensions and ball grid array configuration remain constant, ensuring PCB layout and mechanical fit compatibility.
Operating Conditions: Identical temperature range (-40°C ~ 105°C) and moisture sensitivity level (MSL 3, 168 Hours) confirm environmental and handling compatibility.
Compliance Standards: ROHS3 compliance is maintained across all parts, meeting regulatory requirements for hazardous substance restrictions.
Manufacturer & Series: All parts originate from Silicon Motion, Inc. within the Ferri-UFS™ series, maintaining design consistency and firmware compatibility.
Parameter Comparison
| Parameter | SM671PBE-ADST (Main) | SM671PBE-AFST (Substitute) |
|---|---|---|
| Manufacturer | Silicon Motion, Inc. | Silicon Motion, Inc. |
| Memory Type | Non-Volatile FLASH | Non-Volatile FLASH |
| Technology | FLASH - NAND (TLC) | FLASH - NAND (TLC) |
| Memory Size | 2Tbit | 2Tbit |
| Memory Organization | 256G x 8 | 256G x 8 |
| Memory Interface | UFS3.1 | UFS3.1 |
| Package / Case | 153-TFBGA | 153-TFBGA |
| Supplier Device Package | 153-BGA (11.5x13) | 153-BGA (11.5x13) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C | -40°C ~ 105°C |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) | 3 (168 Hours) |
| Series | Ferri-UFS™ | Ferri-UFS™ |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The SM671PBE-AFST serves as the direct equivalent substitute for the obsolete SM671PBE-ADST. Selection of the SM671PBE-AFST is supported by the following engineering criteria:
Product Status Alignment: The SM671PBE-AFST maintains active product status with Silicon Motion, Inc., ensuring ongoing availability, technical support, and supply chain continuity compared to the obsolete SM671PBE-ADST.
Electrical & Mechanical Equivalence: All critical parameters including memory capacity (2Tbit), interface protocol (UFS3.1), package configuration (153-TFBGA), and operating temperature range (-40°C ~ 105°C) are identical between the main part and substitute.
Regulatory Compliance: Both parts maintain ROHS3 compliance, satisfying hazardous substance restriction requirements. The substitute part includes documented REACH Unaffected status, providing additional regulatory clarity.
Inventory Availability: The SM671PBE-AFST demonstrates higher inventory availability (872 Pcs) compared to the main part (720 Pcs), supporting procurement reliability.
Series Consistency: Both parts belong to the Ferri-UFS™ series from Silicon Motion, Inc., maintaining design ecosystem compatibility and firmware consistency.
Frequently Asked Questions (FAQ)
Q: What determines whether SM671PBE-AFST can substitute for SM671PBE-ADST?
A: Substitution is valid when memory capacity (2Tbit), memory organization (256G x 8), interface protocol (UFS3.1), package type (153-TFBGA 11.5x13), operating temperature range (-40°C ~ 105°C), and moisture sensitivity level (MSL 3) are identical. All these parameters match between the two parts.
Q: Are there any differences in package dimensions between these parts?
A: No. Both the SM671PBE-ADST and SM671PBE-AFST use the identical 153-TFBGA package with dimensions of 11.5x13mm. PCB layout and mechanical mounting are fully compatible.
Q: Does the UFS3.1 interface specification remain constant across both parts?
A: Yes. Both parts implement UFS3.1 interface protocol. Host controller compatibility and protocol-level communication are identical.
Q: What is the significance of the product status difference between these parts?
A: The SM671PBE-ADST is classified as obsolete, indicating discontinued production and limited long-term availability. The SM671PBE-AFST maintains active status, ensuring ongoing manufacturing, technical support, and supply chain access.
Q: Are the operating temperature ranges identical?
A: Yes. Both parts operate across the identical temperature range of -40°C to 105°C, ensuring thermal compatibility in equivalent applications.
Q: What does ROHS3 compliance indicate for both parts?
A: ROHS3 compliance confirms that both parts meet Restriction of Hazardous Substances Directive requirements, restricting lead, mercury, cadmium, and other specified hazardous materials.
Q: Is the moisture sensitivity level the same for both parts?
A: Yes. Both parts have MSL 3 rating with 168-hour floor life, requiring identical handling, storage, and reflow procedures.
Q: Can these parts be used interchangeably in existing designs?
A: Yes. The SM671PBE-AFST provides complete electrical and mechanical equivalence to the SM671PBE-ADST, supporting direct substitution in existing circuit designs without modification.
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