SM671PBE-ADST Equivalent & Substitute Parts

Part Overview

The SM671PBE-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc. This device provides 2Tbit storage capacity with UFS3.1 interface support in a 153-BGA surface mount package. The part is classified as obsolete, necessitating identification of active equivalent components for ongoing design support and procurement continuity.

Substiute Parts

SM671PBE-ADST
Silicon Motion, Inc.In Stock: 775SM671PBE-ADST Datasheet
SM671PBE-ADST
Current Part
SM671PBE-AFST
Silicon Motion, Inc.In Stock: 934SM671PBE-AFST Datasheet
SM671PBE-AFST
Similar

Key Parameters

Parameter Value
Memory Type Non-Volatile FLASH
Technology FLASH - NAND (TLC)
Memory Size 2Tbit
Memory Organization 256G x 8
Memory Interface UFS3.1
Package Type 153-TFBGA (11.5x13)
Mounting Type Surface Mount
Operating Temperature Range -40°C ~ 105°C
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)
Series Ferri-UFS™

Substitute Part Grouping Explanation

Substitution of the SM671PBE-ADST is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: Both the main part and substitute maintain identical 2Tbit capacity with 256G x 8 organization, ensuring data storage compatibility.

Interface Protocol: UFS3.1 interface specification is maintained across all equivalent parts, guaranteeing protocol-level compatibility with host controllers.

Package Specification: The 153-TFBGA (11.5x13) package dimensions and ball grid array configuration remain constant, ensuring PCB layout and mechanical fit compatibility.

Operating Conditions: Identical temperature range (-40°C ~ 105°C) and moisture sensitivity level (MSL 3, 168 Hours) confirm environmental and handling compatibility.

Compliance Standards: ROHS3 compliance is maintained across all parts, meeting regulatory requirements for hazardous substance restrictions.

Manufacturer & Series: All parts originate from Silicon Motion, Inc. within the Ferri-UFS™ series, maintaining design consistency and firmware compatibility.

Parameter Comparison

Parameter SM671PBE-ADST (Main) SM671PBE-AFST (Substitute)
Manufacturer Silicon Motion, Inc. Silicon Motion, Inc.
Memory Type Non-Volatile FLASH Non-Volatile FLASH
Technology FLASH - NAND (TLC) FLASH - NAND (TLC)
Memory Size 2Tbit 2Tbit
Memory Organization 256G x 8 256G x 8
Memory Interface UFS3.1 UFS3.1
Package / Case 153-TFBGA 153-TFBGA
Supplier Device Package 153-BGA (11.5x13) 153-BGA (11.5x13)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 105°C -40°C ~ 105°C
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
Series Ferri-UFS™ Ferri-UFS™
Product Status Obsolete Active

Engineering Selection Recommendations

The SM671PBE-AFST serves as the direct equivalent substitute for the obsolete SM671PBE-ADST. Selection of the SM671PBE-AFST is supported by the following engineering criteria:

Product Status Alignment: The SM671PBE-AFST maintains active product status with Silicon Motion, Inc., ensuring ongoing availability, technical support, and supply chain continuity compared to the obsolete SM671PBE-ADST.

Electrical & Mechanical Equivalence: All critical parameters including memory capacity (2Tbit), interface protocol (UFS3.1), package configuration (153-TFBGA), and operating temperature range (-40°C ~ 105°C) are identical between the main part and substitute.

Regulatory Compliance: Both parts maintain ROHS3 compliance, satisfying hazardous substance restriction requirements. The substitute part includes documented REACH Unaffected status, providing additional regulatory clarity.

Inventory Availability: The SM671PBE-AFST demonstrates higher inventory availability (872 Pcs) compared to the main part (720 Pcs), supporting procurement reliability.

Series Consistency: Both parts belong to the Ferri-UFS™ series from Silicon Motion, Inc., maintaining design ecosystem compatibility and firmware consistency.

Frequently Asked Questions (FAQ)

Q: What determines whether SM671PBE-AFST can substitute for SM671PBE-ADST?

A: Substitution is valid when memory capacity (2Tbit), memory organization (256G x 8), interface protocol (UFS3.1), package type (153-TFBGA 11.5x13), operating temperature range (-40°C ~ 105°C), and moisture sensitivity level (MSL 3) are identical. All these parameters match between the two parts.

Q: Are there any differences in package dimensions between these parts?

A: No. Both the SM671PBE-ADST and SM671PBE-AFST use the identical 153-TFBGA package with dimensions of 11.5x13mm. PCB layout and mechanical mounting are fully compatible.

Q: Does the UFS3.1 interface specification remain constant across both parts?

A: Yes. Both parts implement UFS3.1 interface protocol. Host controller compatibility and protocol-level communication are identical.

Q: What is the significance of the product status difference between these parts?

A: The SM671PBE-ADST is classified as obsolete, indicating discontinued production and limited long-term availability. The SM671PBE-AFST maintains active status, ensuring ongoing manufacturing, technical support, and supply chain access.

Q: Are the operating temperature ranges identical?

A: Yes. Both parts operate across the identical temperature range of -40°C to 105°C, ensuring thermal compatibility in equivalent applications.

Q: What does ROHS3 compliance indicate for both parts?

A: ROHS3 compliance confirms that both parts meet Restriction of Hazardous Substances Directive requirements, restricting lead, mercury, cadmium, and other specified hazardous materials.

Q: Is the moisture sensitivity level the same for both parts?

A: Yes. Both parts have MSL 3 rating with 168-hour floor life, requiring identical handling, storage, and reflow procedures.

Q: Can these parts be used interchangeably in existing designs?

A: Yes. The SM671PBE-AFST provides complete electrical and mechanical equivalence to the SM671PBE-ADST, supporting direct substitution in existing circuit designs without modification.

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