SM671PBE-ADSS Equivalent & Substitute Parts

Part Overview

The SM671PBE-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 640Gbit organized as 80G x 8. This component features a UFS3.1 interface and is packaged in a 153-TFBGA (11.5x13mm) surface mount configuration. The part is classified as obsolete product status, necessitating identification of active equivalent alternatives for ongoing design support and procurement continuity.

Substiute Parts

SM671PBE-ADSS
Silicon Motion, Inc.In Stock: 936SM671PBE-ADSS Datasheet
SM671PBE-ADSS
Current Part
SM671PBE-AFSS
Silicon Motion, Inc.In Stock: 1048SM671PBE-AFSS Datasheet
SM671PBE-AFSS
Similar

Key Parameters

Parameter Value
Memory Type Non-Volatile FLASH
Technology FLASH - NAND (SLC)
Memory Size 640Gbit
Memory Organization 80G x 8
Memory Interface UFS3.1
Package Type 153-TFBGA (11.5x13mm)
Operating Temperature Range -40°C ~ 105°C
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the SM671PBE-ADSS is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: The substitute part must maintain 640Gbit capacity with 80G x 8 organization to ensure functional compatibility with existing circuit designs and firmware implementations.

Interface Protocol: UFS3.1 interface compatibility is mandatory. This protocol specification defines the electrical and logical communication requirements between the memory controller and the IC.

Package Configuration: The 153-TFBGA (11.5x13mm) package specification is fixed. Substitutes must use identical ball grid array dimensions and pin assignments to ensure PCB layout compatibility without redesign.

Operating Temperature Range: The -40°C ~ 105°C operating range must be maintained to support the intended application environment.

Compliance Standards: RoHS3 compliance and MSL 3 (168 Hours) moisture sensitivity level must be preserved to meet regulatory and manufacturing process requirements.

Manufacturer & Series: All substitute parts are from Silicon Motion, Inc., within the Ferri-UFS™ series, ensuring consistent design philosophy and support infrastructure.

Parameter Comparison

Parameter SM671PBE-ADSS (Main Part) SM671PBE-AFSS (Substitute)
Manufacturer Silicon Motion, Inc. Silicon Motion, Inc.
Series Ferri-UFS™ Ferri-UFS™
Memory Type Non-Volatile FLASH Non-Volatile FLASH
Technology FLASH - NAND (SLC) FLASH - NAND (SLC)
Memory Size 640Gbit 640Gbit
Memory Organization 80G x 8 80G x 8
Memory Interface UFS3.1 UFS3.1
Package / Case 153-TFBGA 153-TFBGA
Supplier Device Package 153-BGA (11.5x13) 153-BGA (11.5x13)
Operating Temperature -40°C ~ 105°C -40°C ~ 105°C
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active

Engineering Selection Recommendations

The SM671PBE-AFSS is a direct functional equivalent to the SM671PBE-ADSS. Both parts share identical electrical specifications, memory capacity, interface protocol, and physical packaging. The primary distinction is product status: the SM671PBE-ADSS is classified as obsolete, while the SM671PBE-AFSS maintains active product status with current manufacturing support.

For new designs and ongoing procurement, the SM671PBE-AFSS is the appropriate selection. This part maintains full compliance with ROHS3 regulations and carries equivalent moisture sensitivity specifications. The active status ensures continued availability, technical support, and supply chain reliability.

Both parts are manufactured by Silicon Motion, Inc., within the Ferri-UFS™ series, providing consistent design characteristics and performance profiles. No circuit modifications, firmware updates, or PCB layout changes are required when transitioning from the obsolete part number to the active equivalent.

Frequently Asked Questions (FAQ)

Q: Can SM671PBE-AFSS be used as a direct replacement for SM671PBE-ADSS in existing designs?

A: Yes. The SM671PBE-AFSS is electrically and mechanically equivalent to the SM671PBE-ADSS. Both parts feature identical memory capacity (640Gbit), organization (80G x 8), UFS3.1 interface, 153-TFBGA packaging, and operating temperature range (-40°C ~ 105°C). No design modifications are required.

Q: What is the difference between these two part numbers?

A: The SM671PBE-ADSS is classified as obsolete product status, while the SM671PBE-AFSS is active. The functional specifications, memory architecture, and physical packaging are identical. The product status difference reflects manufacturing lifecycle positioning rather than technical capability.

Q: Are there any compliance or certification differences?

A: Both parts maintain ROHS3 compliance and identical MSL 3 (168 Hours) moisture sensitivity levels. No compliance gaps exist between the two part numbers.

Q: Is the 153-TFBGA package identical between both parts?

A: Yes. Both parts use the 153-TFBGA (11.5x13mm) package with identical ball grid array configuration, pin assignments, and mechanical dimensions. PCB layouts designed for one part are directly compatible with the other.

Q: Why should I transition from SM671PBE-ADSS to SM671PBE-AFSS?

A: The SM671PBE-ADSS is obsolete, indicating discontinued manufacturing and limited future availability. The SM671PBE-AFSS is an active product with ongoing manufacturing support, ensuring supply chain continuity and technical support for current and future applications.

Q: Are the UFS3.1 interface specifications identical?

A: Yes. Both parts implement UFS3.1 interface protocol with identical electrical and logical specifications. No firmware or controller modifications are necessary.

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