SM671PBD-ADST Equivalent & Substitute Parts

Part Overview

The SM671PBD-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc. This device provides 1Tbit storage capacity with UFS3.1 interface in a 153-BGA surface mount package. The part is classified as obsolete, necessitating identification of active equivalent components for ongoing design support and procurement continuity.

Substiute Parts

SM671PBD-ADST

Silicon Motion, Inc.In Stock: 953SM671PBD-ADST Datasheet

Current PartRFQ

SM671PBD-AFST

Silicon Motion, Inc.In Stock: 1016SM671PBD-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM671PBD-ADST is determined by strict equivalence across the following critical parameters:

• Memory Capacity: 1Tbit storage requirement
• Memory Technology: FLASH - NAND (TLC) architecture
• Memory Organization: 128G x 8 configuration
• Interface Protocol: UFS3.1 compatibility
• Package Specification: 153-TFBGA (11.5x13) form factor
• Operating Temperature: -40°C ~ 105°C range
• Mounting Configuration: Surface Mount technology
• Regulatory Compliance: ROHS3 Compliant status
• Moisture Sensitivity: MSL 3 (168 Hours) classification

The SM671PBD-AFST meets all substitution criteria as an active product variant within the Ferri-UFS™ series, sharing identical electrical and mechanical specifications with the obsolete SM671PBD-ADST.

Parameter Comparison

Engineering Selection Recommendations

The SM671PBD-AFST is the direct functional equivalent for the obsolete SM671PBD-ADST. Both components share identical electrical specifications, memory capacity, interface protocol, and physical packaging. The SM671PBD-AFST maintains active product status with current manufacturing support and availability.

Selection of the SM671PBD-AFST is appropriate for new designs and production continuity where the SM671PBD-ADST is no longer procurable. Both parts satisfy ROHS3 compliance requirements and identical moisture sensitivity classifications, ensuring compatibility with existing assembly and storage protocols.

Frequently Asked Questions (FAQ)

Q: Can the SM671PBD-AFST directly replace the SM671PBD-ADST in existing designs?

A: Yes. The SM671PBD-AFST provides identical electrical and mechanical specifications, including memory capacity (1Tbit), interface protocol (UFS3.1), package configuration (153-TFBGA), and operating temperature range (-40°C ~ 105°C). No design modifications are required.

Q: What is the primary difference between these two part numbers?

A: The SM671PBD-ADST is classified as obsolete, while the SM671PBD-AFST maintains active product status. Both components are manufactured by Silicon Motion, Inc. within the Ferri-UFS™ series and share identical technical specifications.

Q: Are there any compliance or regulatory differences?

A: No. Both parts are ROHS3 compliant and classified as MSL 3 (168 Hours) for moisture sensitivity. No additional compliance considerations apply to substitution.

Q: What is the significance of the 153-BGA (11.5x13) package specification?

A: This specification defines the physical form factor and pin configuration. Both the SM671PBD-ADST and SM671PBD-AFST utilize identical 153-pin ball grid array packaging with 11.5mm x 13mm dimensions, ensuring mechanical and electrical compatibility on printed circuit boards designed for either component.

Q: Is the UFS3.1 interface identical between both parts?

A: Yes. Both components implement the UFS3.1 protocol with 128G x 8 memory organization, providing equivalent data transfer rates and protocol compatibility with host systems designed for UFS3.1 interface standards.