SM671PBD-ADSS Equivalent & Substitute Parts

Part Overview

The SM671PBD-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc. This device provides 320Gbit storage capacity with UFS3.1 interface protocol, packaged in a 153-TFBGA form factor measuring 11.5x13mm. The component is classified as non-volatile memory suitable for surface mount applications requiring high-density flash storage.

The SM671PBD-ADSS carries an Obsolete product status, indicating that this part number is no longer in active production. Identifying equivalent substitute parts is necessary to maintain design continuity, support existing inventory management, and ensure availability for applications currently utilizing this component.

Substiute Parts

SM671PBD-ADSS
Silicon Motion, Inc.In Stock: 1013SM671PBD-ADSS Datasheet
SM671PBD-ADSS
Current Part
SM671PBD-AFSS
Silicon Motion, Inc.In Stock: 911SM671PBD-AFSS Datasheet
SM671PBD-AFSS
Similar

Key Parameters

Parameter Value
Memory Type Non-Volatile FLASH
Technology FLASH - NAND (SLC)
Memory Size 320Gbit
Memory Organization 40G x 8
Memory Interface UFS3.1
Package Type 153-TFBGA (11.5x13mm)
Mounting Type Surface Mount
Operating Temperature Range -40°C ~ 105°C
RoHS Compliance ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)
Series Ferri-UFS™

Substitute Part Grouping Explanation

Substitution eligibility for the SM671PBD-ADSS is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: The substitute part must provide identical 320Gbit capacity with 40G x 8 memory organization to ensure functional compatibility with existing firmware and system architecture.

Interface Protocol: UFS3.1 interface specification is mandatory. This protocol defines the electrical and logical communication between the memory device and the host controller.

Package & Form Factor: The 153-TFBGA package with 11.5x13mm dimensions establishes the physical and electrical footprint. Substitutes must match this specification for PCB layout compatibility.

Environmental & Compliance Specifications: Operating temperature range of -40°C to 105°C, RoHS3 compliance, and MSL rating of 3 (168 Hours) establish the reliability and regulatory framework for substitution.

Manufacturer & Series: Silicon Motion, Inc. Ferri-UFS™ series components maintain consistent design architecture and performance characteristics within this product family.

The SM671PBD-AFSS meets all substitution criteria through identical electrical specifications, package configuration, and compliance certifications, with the distinction of Active product status versus the Obsolete status of the primary part.

Parameter Comparison

Parameter SM671PBD-ADSS (Main) SM671PBD-AFSS (Substitute)
Manufacturer Silicon Motion, Inc. Silicon Motion, Inc.
Memory Type Non-Volatile FLASH Non-Volatile FLASH
Technology FLASH - NAND (SLC) FLASH - NAND (SLC)
Memory Size 320Gbit 320Gbit
Memory Organization 40G x 8 40G x 8
Memory Interface UFS3.1 UFS3.1
Package / Case 153-TFBGA 153-TFBGA
Supplier Device Package 153-BGA (11.5x13) 153-BGA (11.5x13)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 105°C -40°C ~ 105°C
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
Series Ferri-UFS™ Ferri-UFS™
Product Status Obsolete Active

Engineering Selection Recommendations

The SM671PBD-AFSS is a direct functional equivalent to the SM671PBD-ADSS. Both components share identical electrical specifications, memory capacity, interface protocol, and physical packaging. The primary distinction is product lifecycle status: the SM671PBD-ADSS is Obsolete while the SM671PBD-AFSS maintains Active status.

For applications currently specified with SM671PBD-ADSS, the SM671PBD-AFSS provides continued design support with equivalent performance characteristics. Both parts maintain ROHS3 compliance and identical environmental operating parameters, ensuring regulatory and thermal compatibility.

The Active status of SM671PBD-AFSS provides supply chain continuity and ongoing manufacturer support, addressing the obsolescence constraint of the primary part number.

Frequently Asked Questions (FAQ)

Q: Can SM671PBD-AFSS be used as a direct replacement for SM671PBD-ADSS?

A: Yes. The SM671PBD-AFSS provides identical memory capacity (320Gbit), memory organization (40G x 8), interface protocol (UFS3.1), package configuration (153-TFBGA, 11.5x13mm), and operating temperature range (-40°C to 105°C). Both components are manufactured by Silicon Motion, Inc. within the Ferri-UFS™ series and maintain ROHS3 compliance with MSL rating 3 (168 Hours).

Q: What is the significance of the Obsolete status for SM671PBD-ADSS?

A: Obsolete status indicates the part is no longer manufactured or supported by Silicon Motion, Inc. This affects long-term availability, technical support, and supply chain reliability. The SM671PBD-AFSS, with Active status, provides equivalent functionality with ongoing manufacturer support.

Q: Are there any package or footprint differences between these parts?

A: No. Both parts utilize the 153-TFBGA package with identical 11.5x13mm dimensions. PCB layout, solder pad configuration, and mounting requirements are equivalent.

Q: Do both parts meet the same compliance requirements?

A: Yes. Both SM671PBD-ADSS and SM671PBD-AFSS are ROHS3 compliant with identical Moisture Sensitivity Level rating of 3 (168 Hours). Environmental operating specifications are identical across both components.

Q: What distinguishes the part numbers SM671PBD-ADSS and SM671PBD-AFSS?

A: The suffix designations (ADSS versus AFSS) indicate different product lifecycle phases within the SM671 base product family. Both maintain identical core specifications, with the primary difference being product status and supply availability.

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