SM671PBC-ADST Equivalent & Substitute Parts

Part Overview

The SM671PBC-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 512Gbit organized as 64G x 8. This component features a UFS3.1 interface and is packaged in a 153-TFBGA form factor measuring 11.5x13mm. The device is classified as obsolete, necessitating identification of active equivalent parts for ongoing design support and procurement continuity.

Substiute Parts

SM671PBC-ADST

Silicon Motion, Inc.In Stock: 1174SM671PBC-ADST Datasheet

Current PartRFQ

SM671PBC-AFST

Silicon Motion, Inc.In Stock: 1026SM671PBC-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM671PBC-ADST is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: The substitute part must provide 512Gbit capacity with 64G x 8 organization to maintain functional compatibility with existing system architecture.

Interface Protocol: UFS3.1 interface compatibility is mandatory for seamless integration with host controllers and data transfer protocols.

Package Specification: The 153-TFBGA package with dimensions 11.5x13mm is required for mechanical fit and PCB layout compatibility.

Operating Temperature Range: The -40°C ~ 105°C specification must be maintained to ensure reliability across the intended thermal operating envelope.

Technology & Memory Type: FLASH NAND (TLC) non-volatile memory technology is the baseline requirement for functional equivalence.

Compliance Standards: RoHS3 compliance and MSL 3 (168 Hours) rating must be preserved for regulatory and manufacturing process compatibility.

The SM671PBC-AFST meets all these criteria while offering the advantage of active product status.

Parameter Comparison

Engineering Selection Recommendations

The SM671PBC-AFST serves as a direct functional equivalent to the SM671PBC-ADST. Both components are manufactured by Silicon Motion, Inc., within the Ferri-UFS™ series and share identical electrical and mechanical specifications across all critical parameters.

The primary distinction between these parts is product lifecycle status. The SM671PBC-ADST is classified as obsolete, while the SM671PBC-AFST maintains active product status. This status difference reflects manufacturing availability and long-term supply chain viability.

Both parts maintain ROHS3 compliance and identical MSL ratings, ensuring compatibility with current manufacturing processes and environmental regulations. The electrical interface, memory capacity, package form factor, and thermal operating range are identical, supporting direct substitution in system designs.

For new designs or ongoing production requiring 512Gbit UFS3.1 NAND flash memory in 153-TFBGA packaging, the SM671PBC-AFST is the appropriate selection due to its active product status and assured supply continuity.

Frequently Asked Questions (FAQ)

Q: Can the SM671PBC-AFST replace the SM671PBC-ADST in existing designs?

A: Yes. The SM671PBC-AFST is electrically and mechanically equivalent to the SM671PBC-ADST. Both components feature identical memory capacity (512Gbit), organization (64G x 8), interface protocol (UFS3.1), package specification (153-TFBGA, 11.5x13mm), and operating temperature range (-40°C ~ 105°C). Direct substitution is supported without design modification.

Q: What is the significance of the product status difference?

A: The SM671PBC-ADST is classified as obsolete, indicating discontinued manufacturing and limited availability. The SM671PBC-AFST maintains active product status, ensuring ongoing manufacturing support, supply chain availability, and long-term procurement viability. For new designs or production continuity, the active part is the appropriate selection.

Q: Are there compliance or regulatory differences between these parts?

A: No. Both the SM671PBC-ADST and SM671PBC-AFST maintain identical ROHS3 compliance status and MSL 3 (168 Hours) ratings. They are equivalent from regulatory and manufacturing process perspectives.

Q: What are the critical parameters that define substitution eligibility?

A: Substitution eligibility is determined by equivalence across memory capacity (512Gbit), memory organization (64G x 8), interface protocol (UFS3.1), package form factor (153-TFBGA, 11.5x13mm), technology (FLASH NAND TLC), operating temperature range (-40°C ~ 105°C), and compliance certifications (ROHS3, MSL 3). Deviation in any of these parameters disqualifies a part from direct substitution.

Q: Is the 153-BGA package compatible with existing PCB layouts designed for the SM671PBC-ADST?

A: Yes. Both parts use the identical 153-TFBGA package with dimensions 11.5x13mm. PCB layouts, footprints, and assembly processes designed for the SM671PBC-ADST are directly compatible with the SM671PBC-AFST without modification.

Q: What is the difference between UFS3.1 interface specifications in these parts?

A: Both the SM671PBC-ADST and SM671PBC-AFST implement the UFS3.1 interface protocol identically. No functional or protocol differences exist between these components in this regard.