SM671PBC-ADSS Equivalent & Substitute Parts

Part Overview

The SM671PBC-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., featuring 160Gbit capacity with UFS3.1 interface in a 153-BGA package. This component is classified as obsolete, necessitating identification of active equivalent alternatives for ongoing design requirements and production continuity. The part operates across an industrial temperature range of -40°C to 105°C and complies with ROHS3 standards.

Substiute Parts

SM671PBC-ADSS

Silicon Motion, Inc.In Stock: 1071SM671PBC-ADSS Datasheet

Current PartRFQ

SM671PBC-AFSS

Silicon Motion, Inc.In Stock: 1022SM671PBC-AFSS Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM671PBC-ADSS is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: The substitute part must maintain 160Gbit capacity with 20G x 8 organization to ensure functional compatibility with existing circuit designs and firmware implementations.

Interface Protocol: UFS3.1 interface compatibility is mandatory for data transfer protocol alignment and system integration.

Package Specification: The 153-TFBGA (11.5x13) package specification must be identical to ensure PCB layout compatibility, solder joint reliability, and thermal management characteristics.

Operating Temperature Range: The -40°C to 105°C operating range must be maintained for environmental specification compliance.

Compliance Standards: ROHS3 compliance and MSL 3 rating must be preserved for regulatory and manufacturing process requirements.

Base Product Series: Both parts share the SM671 base product number and Ferri-UFS™ series designation, confirming architectural compatibility.

Parameter Comparison

Engineering Selection Recommendations

The SM671PBC-AFSS serves as a direct functional equivalent to the SM671PBC-ADSS. The primary distinction between these parts is product lifecycle status: the SM671PBC-ADSS is classified as obsolete, while the SM671PBC-AFSS maintains active product status with current manufacturing support.

All electrical, mechanical, and thermal parameters are identical between the two parts. Both components comply with ROHS3 standards and maintain equivalent moisture sensitivity specifications. The 153-TFBGA package geometry, solder ball configuration, and thermal characteristics are unchanged.

For new designs or production continuity planning, the SM671PBC-AFSS is the appropriate selection due to its active status and ongoing availability from Silicon Motion, Inc. Existing designs utilizing the SM671PBC-ADSS can transition to the SM671PBC-AFSS without circuit modification or PCB redesign.

Frequently Asked Questions (FAQ)

Q: Can SM671PBC-AFSS be used as a direct replacement for SM671PBC-ADSS in existing designs?

A: Yes. The SM671PBC-AFSS is electrically and mechanically identical to the SM671PBC-ADSS. No circuit modifications, firmware changes, or PCB layout adjustments are required for substitution.

Q: What is the primary reason for substituting SM671PBC-ADSS?

A: The SM671PBC-ADSS is classified as obsolete. The SM671PBC-AFSS provides equivalent functionality with active product status and ongoing manufacturing availability.

Q: Are the package dimensions and ball grid array configurations identical?

A: Yes. Both parts use the 153-TFBGA package with dimensions of 11.5x13mm. PCB footprints, solder joint spacing, and thermal interface requirements are identical.

Q: Do both parts support the same UFS interface protocol?

A: Yes. Both the SM671PBC-ADSS and SM671PBC-AFSS implement UFS3.1 interface protocol with identical electrical signaling and timing specifications.

Q: Are there any compliance or regulatory differences between these parts?

A: No. Both parts maintain ROHS3 compliance and identical Moisture Sensitivity Level 3 (168 Hours) ratings. No additional compliance documentation or handling procedures are required for substitution.

Q: What is the memory capacity and organization of both parts?

A: Both parts provide 160Gbit total capacity organized as 20G x 8, ensuring identical data storage and access characteristics.

Q: Are the operating temperature ranges the same?

A: Yes. Both parts operate across the identical temperature range of -40°C to 105°C, supporting equivalent environmental specifications for industrial and commercial applications.