SM671PBB-ADST Equivalent & Substitute Parts

Part Overview

The SM671PBB-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc. This device provides 256Gbit storage capacity with UFS3.1 interface support in a 153-BGA surface mount package. The part is classified as obsolete, necessitating identification of active equivalent alternatives for ongoing design requirements and procurement needs.

Substiute Parts

SM671PBB-ADST

Silicon Motion, Inc.In Stock: 698SM671PBB-ADST Datasheet

Current PartRFQ

SM671PBB-AFST

Silicon Motion, Inc.In Stock: 970SM671PBB-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM671PBB-ADST is determined by strict equivalence across the following critical parameters:

• Memory Capacity: 256Gbit capacity requirement
• Memory Technology: FLASH NAND (TLC) architecture
• Memory Organization: 32G x 8 configuration
• Interface Protocol: UFS3.1 compatibility
• Package Specification: 153-TFBGA (11.5x13) form factor
• Mounting Configuration: Surface mount technology
• Thermal Range: -40°C to 105°C operating specification
• Environmental Compliance: ROHS3 certification and MSL 3 rating

The SM671PBB-AFST meets all these parameters while maintaining active product status from the same manufacturer and series.

Parameter Comparison

Engineering Selection Recommendations

The SM671PBB-AFST serves as a direct functional equivalent to the SM671PBB-ADST. Both devices share identical electrical specifications, memory architecture, interface protocol, and physical packaging. The primary distinction is product lifecycle status: the SM671PBB-ADST is obsolete while the SM671PBB-AFST maintains active status.

For new designs and ongoing procurement, the SM671PBB-AFST is the appropriate selection. Both parts maintain ROHS3 compliance and identical environmental specifications, ensuring regulatory alignment. The SM671PBB-AFST currently maintains higher inventory availability (864 Pcs versus 675 Pcs), supporting supply chain continuity.

Frequently Asked Questions (FAQ)

Q: Can the SM671PBB-AFST directly replace the SM671PBB-ADST in existing designs?

A: Yes. The SM671PBB-AFST is electrically and mechanically equivalent across all specified parameters. No design modifications are required for substitution.

Q: Are there differences in memory performance between these parts?

A: No differences exist in the provided specifications. Both devices feature identical 256Gbit capacity, UFS3.1 interface, memory organization, and operating temperature range.

Q: What is the significance of the product status difference?

A: The SM671PBB-ADST is classified as obsolete, indicating discontinued manufacturing. The SM671PBB-AFST maintains active status, ensuring ongoing availability and manufacturer support.

Q: Are both parts compatible with the same PCB footprint?

A: Yes. Both parts use the identical 153-TFBGA (11.5x13) package specification, requiring no PCB layout modifications.

Q: Do both parts meet the same environmental and compliance standards?

A: Yes. Both parts are ROHS3 compliant with MSL 3 rating (168 Hours) and operate across the identical -40°C to 105°C temperature range.

Q: Why would a design require substitution of the SM671PBB-ADST?

A: Obsolete product status necessitates substitution for new production runs, long-term supply assurance, and manufacturer support continuity. The SM671PBB-AFST provides equivalent functionality with active lifecycle status.