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SM671PBB-ADSS Equivalent & Substitute Parts
Part Overview
The SM671PBB-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 80Gbit and UFS3.1 interface. This component is packaged in a 153-TFBGA (11.5x13mm) surface mount configuration and operates across the temperature range of -40°C to 105°C. The SM671PBB-ADSS is classified as obsolete product status. Identification of equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this memory technology.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Type | Non-Volatile FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 80Gbit |
| Memory Organization | 10G x 8 |
| Memory Interface | UFS3.1 |
| Package / Case | 153-TFBGA |
| Supplier Device Package | 153-BGA (11.5x13) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 105°C |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Series | Ferri-UFS™ |
| Base Product Number | SM671 |
Substitute Part Grouping Explanation
Substitution of the SM671PBB-ADSS is determined by strict equivalence across the following critical parameters:
Memory Capacity and Organization: The substitute part must provide 80Gbit capacity with 10G x 8 memory organization to maintain functional compatibility with existing circuit designs and firmware implementations.
Interface Specification: UFS3.1 interface compatibility is mandatory. The memory interface defines the communication protocol between the host controller and the memory device; any deviation results in incompatibility.
Package and Mounting: The 153-TFBGA (11.5x13mm) surface mount package is a physical requirement. Substitute parts must utilize identical package dimensions and pin configuration to ensure PCB layout compatibility without redesign.
Operating Temperature Range: The -40°C to 105°C operating temperature specification must be maintained to ensure reliable operation across the intended application environment.
Compliance Standards: RoHS3 compliance and MSL 3 (168 Hours) moisture sensitivity level must be preserved to meet regulatory and manufacturing process requirements.
The SM671PBB-AFSS meets all these criteria and is classified as an active product, providing supply continuity for the obsolete SM671PBB-ADSS.
Parameter Comparison
| Parameter | SM671PBB-ADSS (Main Part) | SM671PBB-AFSS (Substitute) |
|---|---|---|
| Manufacturer | Silicon Motion, Inc. | Silicon Motion, Inc. |
| Memory Type | Non-Volatile FLASH | Non-Volatile FLASH |
| Technology | FLASH - NAND (SLC) | FLASH - NAND (SLC) |
| Memory Size | 80Gbit | 80Gbit |
| Memory Organization | 10G x 8 | 10G x 8 |
| Memory Interface | UFS3.1 | UFS3.1 |
| Package / Case | 153-TFBGA | 153-TFBGA |
| Supplier Device Package | 153-BGA (11.5x13) | 153-BGA (11.5x13) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C | -40°C ~ 105°C |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Series | Ferri-UFS™ | Ferri-UFS™ |
| Base Product Number | SM671 | SM671 |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The SM671PBB-AFSS is the direct substitute for the SM671PBB-ADSS. Both components share identical electrical and mechanical specifications across all critical parameters: memory capacity, interface protocol, package configuration, operating temperature range, and compliance certifications.
The primary distinction between these parts is product status. The SM671PBB-ADSS is classified as obsolete, indicating discontinued manufacturing and limited availability. The SM671PBB-AFSS maintains active product status, ensuring ongoing supply chain availability and manufacturer support.
Both parts are ROHS3 compliant and carry identical MSL 3 (168 Hours) moisture sensitivity ratings, confirming equivalent handling and storage requirements.
For new designs or production continuity, the SM671PBB-AFSS is the appropriate selection. For existing applications currently utilizing the SM671PBB-ADSS, direct substitution with the SM671PBB-AFSS is electrically and mechanically valid without circuit modification or PCB redesign.
Frequently Asked Questions (FAQ)
Q: Can the SM671PBB-AFSS be used as a direct replacement for the SM671PBB-ADSS?
A: Yes. The SM671PBB-AFSS is a direct substitute. Both components share identical memory capacity (80Gbit), memory organization (10G x 8), interface specification (UFS3.1), package configuration (153-TFBGA, 11.5x13mm), operating temperature range (-40°C to 105°C), and compliance certifications (ROHS3, MSL 3). No circuit modification or PCB redesign is required.
Q: What is the primary reason for substitution?
A: The SM671PBB-ADSS is classified as obsolete product status. The SM671PBB-AFSS is an active product offering equivalent functionality with assured supply chain availability.
Q: Are the package dimensions identical?
A: Yes. Both parts utilize the 153-TFBGA package with dimensions of 11.5x13mm. Pin configuration and footprint are identical, ensuring PCB compatibility without layout modification.
Q: Do both parts meet the same compliance standards?
A: Yes. Both the SM671PBB-ADSS and SM671PBB-AFSS are ROHS3 compliant and carry MSL 3 (168 Hours) moisture sensitivity level ratings. Handling, storage, and manufacturing process requirements are equivalent.
Q: Is the UFS3.1 interface specification identical between both parts?
A: Yes. Both components implement UFS3.1 interface protocol. Host controller compatibility and firmware requirements remain unchanged.
Q: What is the operating temperature range for both parts?
A: Both the SM671PBB-ADSS and SM671PBB-AFSS operate across -40°C to 105°C. Thermal performance and environmental specifications are equivalent.
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