SM671PAE-ADST Equivalent & Substitute Parts

Part Overview

The SM671PAE-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc. This device provides 2Tbit storage capacity with UFS3.1 interface support in a 153-BGA package configuration. The part is classified as obsolete, necessitating identification of active equivalent components for ongoing design support and procurement continuity. Substitute parts must maintain electrical and mechanical compatibility across memory capacity, interface protocol, package geometry, and thermal operating range.

Substiute Parts

SM671PAE-ADST

Silicon Motion, Inc.In Stock: 804SM671PAE-ADST Datasheet

Current PartRFQ

SM671PAE-AFST

Silicon Motion, Inc.In Stock: 883SM671PAE-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM671PAE-ADST is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: The substitute part must provide identical 2Tbit capacity with 256G x 8 organization to ensure data storage compatibility and system memory mapping.

Interface Protocol: UFS3.1 interface specification is mandatory for electrical and protocol-level compatibility with host controllers and system architecture.

Package Geometry: The 153-TFBGA (11.5x13) package footprint and ball grid array configuration must match exactly to ensure PCB layout compatibility and assembly process alignment.

Thermal Operating Range: The -40°C ~ 85°C operating temperature specification must be maintained to ensure device functionality across specified environmental conditions.

Compliance Standards: RoHS3 compliance and MSL 3 rating must be preserved to meet regulatory requirements and handling specifications.

Manufacturer Consistency: Parts from Silicon Motion, Inc. within the Ferri-UFS™ series maintain design and performance consistency.

Parameter Comparison

Engineering Selection Recommendations

The SM671PAE-AFST serves as a direct functional equivalent to the obsolete SM671PAE-ADST. Both components share identical electrical specifications, memory capacity, interface protocol, and package configuration. The primary distinction is product lifecycle status: SM671PAE-ADST is classified as obsolete, while SM671PAE-AFST maintains active production status.

For new designs and ongoing procurement, SM671PAE-AFST is the appropriate selection. This substitute provides equivalent performance characteristics while ensuring supply chain continuity and manufacturer support. Both parts maintain ROHS3 compliance and identical thermal operating specifications, eliminating the need for design modification or system re-qualification.

The substitute part is available in higher inventory quantity (841 Pcs versus 712 Pcs), supporting production scheduling and supply chain planning requirements.

Frequently Asked Questions (FAQ)

Q: Can SM671PAE-AFST be used as a direct replacement for SM671PAE-ADST in existing designs?

A: Yes. Both parts are electrically and mechanically identical across all specified parameters. No design modification, PCB layout changes, or firmware updates are required for substitution.

Q: Are there differences in memory capacity or interface protocol between these parts?

A: No. Both components provide 2Tbit capacity with 256G x 8 organization and UFS3.1 interface specification. Memory performance and data transfer characteristics are equivalent.

Q: Do both parts use the same package footprint?

A: Yes. Both components use the 153-TFBGA package with 11.5x13 millimeter dimensions. PCB assembly processes and land pattern designs are identical.

Q: What is the significance of the product status difference?

A: SM671PAE-ADST is obsolete and no longer manufactured. SM671PAE-AFST is in active production, ensuring long-term availability and manufacturer support. For new designs and production builds, SM671PAE-AFST is the recommended selection.

Q: Are compliance certifications identical between both parts?

A: Yes. Both parts maintain ROHS3 compliance and MSL 3 (168 Hours) moisture sensitivity rating. Regulatory and handling requirements are equivalent.

Q: Does the substitute part require different handling or storage procedures?

A: No. Both parts share identical MSL 3 classification, requiring equivalent moisture control, storage temperature, and handling protocols during manufacturing and assembly.

Q: Are there any electrical parameter differences in supply voltage or operating temperature?

A: No differences are specified in the provided parameters. Both components operate across the -40°C ~ 85°C temperature range with identical electrical specifications.