SM671PAE-ADSS Equivalent & Substitute Parts

Part Overview

The SM671PAE-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 640Gbit organized as 80G x 8. This component features UFS3.1 interface technology and is packaged in a 153-TFBGA form factor measuring 11.5x13mm. The device is classified as obsolete, necessitating identification of active equivalent components to support ongoing design requirements and procurement needs.

Substiute Parts

SM671PAE-ADSS
Silicon Motion, Inc.In Stock: 1059SM671PAE-ADSS Datasheet
SM671PAE-ADSS
Current Part
SM671PAE-AFSS
Silicon Motion, Inc.In Stock: 734SM671PAE-AFSS Datasheet
SM671PAE-AFSS
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Key Parameters

Parameter Value
Memory Type Non-Volatile FLASH
Technology FLASH - NAND (SLC)
Memory Size 640Gbit
Memory Organization 80G x 8
Memory Interface UFS3.1
Package Type 153-TFBGA (11.5x13mm)
Operating Temperature Range -40°C ~ 85°C
Mounting Type Surface Mount
RoHS Compliance ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the SM671PAE-ADSS is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: The substitute part must maintain 640Gbit capacity with 80G x 8 organization to ensure functional compatibility with existing memory addressing schemes and data bandwidth requirements.

Interface Protocol: UFS3.1 interface compatibility is mandatory. This protocol defines the electrical signaling, timing, and command structure for memory access operations.

Package & Form Factor: The 153-TFBGA package with 11.5x13mm dimensions establishes the physical and electrical footprint. Pin count, pitch, and ball layout must be identical for PCB-level compatibility.

Operating Temperature Range: The -40°C ~ 85°C specification defines the thermal operating envelope. Substitute parts must support this full range without derating.

Compliance Standards: RoHS3 compliance and MSL 3 rating must be maintained to satisfy regulatory and manufacturing process requirements.

Base Product Series: Both components share the SM671 base product number and Ferri-UFS™ series designation, confirming design-level equivalence.

Parameter Comparison

Parameter SM671PAE-ADSS (Main) SM671PAE-AFSS (Substitute)
Manufacturer Silicon Motion, Inc. Silicon Motion, Inc.
Memory Type Non-Volatile FLASH Non-Volatile FLASH
Technology FLASH - NAND (SLC) FLASH - NAND (SLC)
Memory Size 640Gbit 640Gbit
Memory Organization 80G x 8 80G x 8
Memory Interface UFS3.1 UFS3.1
Package / Case 153-TFBGA 153-TFBGA
Supplier Device Package 153-BGA (11.5x13) 153-BGA (11.5x13)
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active

Engineering Selection Recommendations

The SM671PAE-AFSS serves as a direct functional equivalent to the SM671PAE-ADSS. Both components are manufactured by Silicon Motion, Inc., and share identical electrical specifications, memory capacity, interface protocol, and physical packaging.

The primary distinction between these components is product lifecycle status. The SM671PAE-ADSS is classified as obsolete, indicating discontinued manufacturing and limited availability. The SM671PAE-AFSS maintains active product status, ensuring ongoing manufacturing support and supply chain availability.

Both components satisfy ROHS3 compliance requirements and maintain equivalent moisture sensitivity ratings. The SM671PAE-AFSS is suitable for direct substitution in applications currently specified for the SM671PAE-ADSS, with no design modifications required at the component level.

Frequently Asked Questions (FAQ)

Q: Can the SM671PAE-AFSS replace the SM671PAE-ADSS in existing designs?

A: Yes. The SM671PAE-AFSS is electrically and mechanically equivalent to the SM671PAE-ADSS. All critical parameters including memory capacity, interface protocol, package dimensions, and operating temperature range are identical. No circuit modifications are required.

Q: Are the pin assignments identical between these two parts?

A: Yes. Both components use the 153-TFBGA package with 11.5x13mm dimensions. Pin count, ball layout, and electrical assignments are identical.

Q: What is the significance of the product status difference?

A: The SM671PAE-ADSS is obsolete, meaning Silicon Motion, Inc., has discontinued manufacturing. The SM671PAE-AFSS is active, indicating current production and availability. For new designs or ongoing procurement, the SM671PAE-AFSS is the appropriate selection.

Q: Do both parts meet the same compliance standards?

A: Yes. Both the SM671PAE-ADSS and SM671PAE-AFSS are ROHS3 compliant and carry MSL 3 (168 Hours) moisture sensitivity ratings.

Q: Are there any thermal or electrical performance differences?

A: No. Both components operate across the identical temperature range of -40°C ~ 85°C and support the same UFS3.1 interface specifications.

Q: What is the difference between the part numbers SM671PAE-ADSS and SM671PAE-AFSS?

A: The suffix designations (ADSS vs. AFSS) indicate internal configuration or manufacturing revision codes assigned by Silicon Motion, Inc. The functional specifications and performance characteristics remain equivalent.

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