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SM671PAC-ADST Equivalent & Substitute Parts
Part Overview
The SM671PAC-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc. This device provides 512Gbit storage capacity with UFS3.1 interface in a 153-BGA surface mount package. The SM671PAC-ADST is classified as obsolete product status, necessitating identification of active equivalent components for ongoing design requirements and procurement needs.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Type | Non-Volatile FLASH |
| Technology | FLASH - NAND (TLC) |
| Memory Size | 512Gbit |
| Memory Organization | 64G x 8 |
| Memory Interface | UFS3.1 |
| Package Type | 153-TFBGA (11.5x13) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40°C ~ 85°C |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the SM671PAC-ADST is determined by strict equivalence across the following critical parameters:
Memory Capacity & Organization: Both the main part and substitute maintain 512Gbit capacity with 64G x 8 organization, ensuring identical storage density and data width compatibility.
Interface Standard: UFS3.1 interface specification is maintained across all equivalent parts, guaranteeing protocol-level compatibility with host controllers and system architectures.
Package Specification: The 153-TFBGA (11.5x13) package dimensions and ball grid array configuration remain constant, ensuring mechanical fit and PCB layout compatibility.
Technology Node: FLASH NAND (TLC) technology is consistent across substitutes, maintaining equivalent performance characteristics and reliability profiles.
Environmental Specifications: Operating temperature range (-40°C ~ 85°C) and moisture sensitivity level (MSL 3) are identical, confirming equivalent thermal and handling requirements.
Compliance Standards: ROHS3 compliance is maintained across all equivalent parts, satisfying regulatory requirements for hazardous substance restrictions.
Parameter Comparison
| Parameter | SM671PAC-ADST (Main) | SM671PAC-AFST (Substitute) |
|---|---|---|
| Manufacturer | Silicon Motion, Inc. | Silicon Motion, Inc. |
| Memory Type | Non-Volatile FLASH | Non-Volatile FLASH |
| Technology | FLASH - NAND (TLC) | FLASH - NAND (TLC) |
| Memory Size | 512Gbit | 512Gbit |
| Memory Organization | 64G x 8 | 64G x 8 |
| Memory Interface | UFS3.1 | UFS3.1 |
| Package / Case | 153-TFBGA | 153-TFBGA |
| Supplier Device Package | 153-BGA (11.5x13) | 153-BGA (11.5x13) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The SM671PAC-AFST serves as the direct equivalent substitute for the obsolete SM671PAC-ADST. Both components share identical electrical specifications, memory capacity, interface protocol, and physical packaging. The primary distinction is product status: SM671PAC-ADST is classified as obsolete, while SM671PAC-AFST maintains active status with current manufacturing availability.
For applications currently specified with SM671PAC-ADST, transition to SM671PAC-AFST is supported by complete parameter equivalence. Both devices maintain ROHS3 compliance and identical environmental operating specifications. The substitute part is available in production quantities, addressing supply chain continuity for designs requiring 512Gbit UFS3.1 NAND flash memory in 153-BGA packaging.
Frequently Asked Questions (FAQ)
Q: Can SM671PAC-AFST directly replace SM671PAC-ADST in existing designs?
A: Yes. Both parts are electrically and mechanically equivalent across all specified parameters including memory capacity, interface standard, package dimensions, and environmental ratings. No design modifications are required for substitution.
Q: Are there differences in the UFS interface implementation between these parts?
A: No. Both SM671PAC-ADST and SM671PAC-AFST implement UFS3.1 interface specification identically. Host controller compatibility and protocol requirements remain unchanged.
Q: What is the significance of the product status difference?
A: SM671PAC-ADST is classified as obsolete, indicating discontinued manufacturing. SM671PAC-AFST maintains active status with ongoing production and availability. For new designs and procurement, SM671PAC-AFST is the appropriate selection.
Q: Are PCB layout modifications necessary when substituting these parts?
A: No. Both components use identical 153-TFBGA (11.5x13) packaging. PCB footprints, ball grid array patterns, and mounting requirements are equivalent. Existing layouts require no modification.
Q: Do these parts have identical moisture handling requirements?
A: Yes. Both SM671PAC-ADST and SM671PAC-AFST specify MSL 3 (168 Hours) moisture sensitivity level. Storage, handling, and reflow procedures are identical.
Q: Is ROHS3 compliance maintained with the substitute part?
A: Yes. SM671PAC-AFST maintains ROHS3 compliance equivalent to SM671PAC-ADST, satisfying regulatory requirements for hazardous substance restrictions.
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