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SM671PAC-ADSS Equivalent & Substitute Parts
Part Overview
The SM671PAC-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 160Gbit organized as 20G x 8. This component features a UFS3.1 interface and is packaged in a 153-TFBGA (11.5x13mm) surface mount configuration. The part operates across an industrial temperature range of -40°C to 85°C and maintains ROHS3 compliance with MSL 3 moisture sensitivity rating.
The SM671PAC-ADSS is currently classified as obsolete. Identifying equivalent substitute parts is necessary to support ongoing design requirements, system maintenance, and production continuity where this component was previously specified.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Type | Non-Volatile FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 160Gbit |
| Memory Organization | 20G x 8 |
| Memory Interface | UFS3.1 |
| Package Type | 153-TFBGA (11.5x13mm) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40°C to 85°C |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitute parts for the SM671PAC-ADSS are identified based on strict electrical and mechanical parameter matching. The following criteria determine substitution eligibility:
Critical Matching Parameters:
- Memory capacity: 160Gbit
- Memory organization: 20G x 8
- Memory interface: UFS3.1
- Package type: 153-TFBGA (11.5x13mm)
- Operating temperature range: -40°C to 85°C
- Mounting type: Surface Mount
- Technology: FLASH - NAND (SLC)
- RoHS compliance: ROHS3 Compliant
- Moisture sensitivity level: 3 (168 Hours)
Parts meeting all these parameters are classified as direct substitutes. The SM671PAC-AFSS satisfies all specified electrical and mechanical requirements and is therefore qualified as an equivalent substitute.
Parameter Comparison
| Parameter | SM671PAC-ADSS (Main Part) | SM671PAC-AFSS (Substitute) |
|---|---|---|
| Manufacturer | Silicon Motion, Inc. | Silicon Motion, Inc. |
| Memory Type | Non-Volatile FLASH | Non-Volatile FLASH |
| Technology | FLASH - NAND (SLC) | FLASH - NAND (SLC) |
| Memory Size | 160Gbit | 160Gbit |
| Memory Organization | 20G x 8 | 20G x 8 |
| Memory Interface | UFS3.1 | UFS3.1 |
| Package / Case | 153-TFBGA | 153-TFBGA |
| Supplier Device Package | 153-BGA (11.5x13) | 153-BGA (11.5x13) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The SM671PAC-AFSS is a qualified substitute for the SM671PAC-ADSS based on complete parameter equivalence across all electrical and mechanical specifications. Both components share identical memory capacity, organization, interface protocol, package configuration, and environmental operating parameters.
The primary distinction between these parts is product status: the SM671PAC-ADSS is obsolete, while the SM671PAC-AFSS maintains active production status. This status difference makes the SM671PAC-AFSS the appropriate selection for new designs, production continuity, and system maintenance applications.
Both parts maintain ROHS3 compliance and identical moisture sensitivity ratings, ensuring equivalent handling and storage requirements. The SM671PAC-AFSS is available with 730 pieces in current inventory, supporting immediate procurement needs.
Frequently Asked Questions (FAQ)
Q: Can the SM671PAC-AFSS directly replace the SM671PAC-ADSS in existing designs?
A: Yes. The SM671PAC-AFSS meets all electrical and mechanical specifications of the SM671PAC-ADSS, including memory capacity, interface protocol, package dimensions, and operating temperature range. No design modifications are required for substitution.
Q: What is the significance of the product status difference between these parts?
A: The SM671PAC-ADSS is classified as obsolete, indicating discontinued production and limited availability. The SM671PAC-AFSS maintains active production status, ensuring long-term supply availability and support for ongoing manufacturing requirements.
Q: Are the package dimensions identical between these parts?
A: Yes. Both parts use the 153-TFBGA package with dimensions of 11.5x13mm. PCB footprint, solder pad configuration, and mounting requirements are identical.
Q: Do these parts have the same moisture sensitivity requirements?
A: Yes. Both parts carry MSL 3 rating with a 168-hour floor life. Identical handling, storage, and reflow procedures apply to both components.
Q: Is the UFS3.1 interface specification identical for both parts?
A: Yes. Both the SM671PAC-ADSS and SM671PAC-AFSS implement UFS3.1 interface protocol with identical electrical and timing characteristics.
Q: What compliance certifications apply to the SM671PAC-AFSS?
A: The SM671PAC-AFSS maintains ROHS3 compliance. REACH status is listed as unaffected, indicating no restrictions under REACH regulations.
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