SM671PAB-ADST Equivalent & Substitute Parts

Part Overview

The SM671PAB-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 256Gbit and UFS3.1 interface. This component is packaged in a 153-TFBGA configuration with dimensions of 11.5x13mm and operates across a temperature range of -40°C to 85°C. The part is classified as obsolete, necessitating identification of active equivalent components to support ongoing design requirements and procurement needs.

Substiute Parts

SM671PAB-ADST

Silicon Motion, Inc.In Stock: 937SM671PAB-ADST Datasheet

Current PartRFQ

SM671PAB-AFST

Silicon Motion, Inc.In Stock: 1125SM671PAB-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM671PAB-ADST is determined by strict equivalence across the following critical parameters:

Memory Capacity and Organization: The substitute part must maintain 256Gbit capacity with 32G x 8 organization to ensure functional compatibility with existing system architecture.

Interface Protocol: UFS3.1 interface specification is mandatory for electrical and protocol compatibility with host controllers designed for the original component.

Package Configuration: The 153-TFBGA package with 11.5x13mm dimensions is required for mechanical fit within existing PCB layouts and assembly processes.

Temperature Range: Operating temperature specification of -40°C to 85°C must be maintained to ensure reliability across the intended application environment.

Technology Node: FLASH NAND (TLC) technology classification ensures equivalent performance characteristics and data retention properties.

Compliance Standards: RoHS3 compliance and MSL 3 rating must be preserved to meet regulatory and manufacturing requirements.

The SM671PAB-AFST meets all these criteria and qualifies as a direct substitute for the obsolete SM671PAB-ADST.

Parameter Comparison

Engineering Selection Recommendations

The SM671PAB-AFST is the qualified substitute for the obsolete SM671PAB-ADST. Both components are manufactured by Silicon Motion, Inc., and share identical electrical specifications, memory capacity, interface protocol, and physical packaging.

The primary distinction between these parts is product status: the SM671PAB-ADST is classified as obsolete, while the SM671PAB-AFST maintains active production status. This transition ensures continued availability and supply chain reliability for new designs and production runs.

Both parts maintain ROHS3 compliance and identical moisture sensitivity ratings, confirming equivalent environmental and regulatory suitability. The SM671PAB-AFST is available in higher inventory quantities (1058 pieces versus 869 pieces), supporting procurement requirements for volume production.

Selection of the SM671PAB-AFST eliminates obsolescence risk while maintaining complete functional and mechanical compatibility with systems originally specified for the SM671PAB-ADST.

Frequently Asked Questions (FAQ)

Q: Can the SM671PAB-AFST be used as a direct replacement for the SM671PAB-ADST in existing designs?

A: Yes. Both components share identical memory capacity (256Gbit), interface specification (UFS3.1), package configuration (153-TFBGA, 11.5x13mm), operating temperature range (-40°C to 85°C), and compliance certifications (ROHS3, MSL 3). No design modifications are required.

Q: What is the primary reason for substituting the SM671PAB-ADST?

A: The SM671PAB-ADST is classified as obsolete. The SM671PAB-AFST is the active equivalent that maintains all functional and mechanical specifications while ensuring ongoing supply availability.

Q: Are there any differences in electrical performance between these two parts?

A: No electrical performance differences exist. Both components utilize identical FLASH NAND (TLC) technology, memory organization (32G x 8), and UFS3.1 interface protocol.

Q: Do these parts require different PCB layout or assembly processes?

A: No. Both parts use the same 153-TFBGA package with identical 11.5x13mm dimensions and surface mount configuration. Existing PCB layouts and assembly procedures remain unchanged.

Q: Are both parts compliant with current regulatory standards?

A: Yes. Both the SM671PAB-ADST and SM671PAB-AFST are ROHS3 compliant and carry identical Moisture Sensitivity Level 3 ratings (168 hours), meeting current environmental and manufacturing standards.

Q: Which part should be specified for new production designs?

A: The SM671PAB-AFST should be specified for new designs due to its active product status and assured long-term availability. The SM671PAB-ADST is obsolete and should not be used for new production.