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SM671PAB-ADSS Equivalent & Substitute Parts
Part Overview
The SM671PAB-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 80Gbit and UFS3.1 interface. This component is packaged in a 153-TFBGA (11.5x13mm) surface mount configuration and operates across the temperature range of -40°C to 85°C. The part is classified as obsolete, necessitating identification of equivalent substitute components for ongoing design requirements and procurement needs.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Type | Non-Volatile FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 80Gbit |
| Memory Organization | 10G x 8 |
| Memory Interface | UFS3.1 |
| Package Type | 153-TFBGA (11.5x13mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C to 85°C |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the SM671PAB-ADSS is determined by strict equivalence across the following critical parameters:
Memory Capacity and Organization: The substitute part must provide 80Gbit capacity with 10G x 8 memory organization to maintain functional compatibility with existing circuit designs.
Interface Standard: UFS3.1 interface compatibility is mandatory for proper communication protocol alignment with host controllers and system architecture.
Package Configuration: The 153-TFBGA (11.5x13mm) surface mount package ensures mechanical and electrical compatibility with printed circuit board layouts and assembly processes.
Operating Temperature Range: The -40°C to 85°C operating range must be maintained to support the intended application environment.
Compliance Standards: ROHS3 compliance and MSL 3 (168 Hours) moisture sensitivity level must be preserved for regulatory and manufacturing process requirements.
Manufacturer Consistency: Silicon Motion, Inc. as the original manufacturer ensures design continuity and technical support alignment.
Parameter Comparison
| Parameter | SM671PAB-ADSS (Main Part) | SM671PAB-AFSS (Substitute) | Match Status |
|---|---|---|---|
| Manufacturer | Silicon Motion, Inc. | Silicon Motion, Inc. | Identical |
| Memory Type | Non-Volatile FLASH | Non-Volatile FLASH | Identical |
| Technology | FLASH - NAND (SLC) | FLASH - NAND (SLC) | Identical |
| Memory Size | 80Gbit | 80Gbit | Identical |
| Memory Organization | 10G x 8 | 10G x 8 | Identical |
| Memory Interface | UFS3.1 | UFS3.1 | Identical |
| Package Type | 153-TFBGA (11.5x13mm) | 153-TFBGA (11.5x13mm) | Identical |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Operating Temperature | -40°C to 85°C | -40°C to 85°C | Identical |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| Moisture Sensitivity Level | 3 (168 Hours) | 3 (168 Hours) | Identical |
| Product Status | Obsolete | Active | Different |
Engineering Selection Recommendations
The SM671PAB-AFSS serves as a direct functional equivalent to the SM671PAB-ADSS. Both components share identical electrical specifications, memory capacity, interface protocol, package configuration, and compliance certifications.
The primary distinction between these parts is product status: the SM671PAB-ADSS is classified as obsolete, while the SM671PAB-AFSS maintains active status. This status difference reflects manufacturing lifecycle positioning and supply chain availability rather than technical capability differences.
For new designs or component replenishment, the SM671PAB-AFSS is the appropriate selection due to its active product status and confirmed availability. The SM671PAB-AFSS provides equivalent performance and maintains full compatibility with applications originally designed for the SM671PAB-ADSS.
Frequently Asked Questions (FAQ)
Q: Can the SM671PAB-AFSS replace the SM671PAB-ADSS in existing designs?
A: Yes. The SM671PAB-AFSS is electrically and mechanically equivalent to the SM671PAB-ADSS. All critical parameters including memory capacity, interface standard, package configuration, and operating temperature range are identical.
Q: What is the significance of the product status difference?
A: Product status indicates manufacturing lifecycle stage. The SM671PAB-ADSS is obsolete, meaning it is no longer in active production. The SM671PAB-AFSS is active, indicating current manufacturing and supply availability. For procurement purposes, the active part is the appropriate selection.
Q: Are the package dimensions identical?
A: Yes. Both parts use the 153-TFBGA package with dimensions of 11.5x13mm. PCB layout and assembly processes require no modification.
Q: Do both parts meet the same compliance requirements?
A: Yes. Both the SM671PAB-ADSS and SM671PAB-AFSS are ROHS3 compliant and carry MSL 3 (168 Hours) moisture sensitivity level ratings.
Q: Is the UFS3.1 interface identical between both parts?
A: Yes. Both components implement the UFS3.1 interface standard with identical electrical and protocol specifications.
Q: What is the memory organization specification?
A: Both parts feature 10G x 8 memory organization, providing 80Gbit total capacity in an 8-bit data width configuration.
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