SM671PAB-ADSS Equivalent & Substitute Parts

Part Overview

The SM671PAB-ADSS is a FLASH NAND (SLC) memory integrated circuit manufactured by Silicon Motion, Inc., with a capacity of 80Gbit and UFS3.1 interface. This component is packaged in a 153-TFBGA (11.5x13mm) surface mount configuration and operates across the temperature range of -40°C to 85°C. The part is classified as obsolete, necessitating identification of equivalent substitute components for ongoing design requirements and procurement needs.

Substiute Parts

SM671PAB-ADSS
Silicon Motion, Inc.In Stock: 770SM671PAB-ADSS Datasheet
SM671PAB-ADSS
Current Part
SM671PAB-AFSS
Silicon Motion, Inc.In Stock: 880SM671PAB-AFSS Datasheet
SM671PAB-AFSS
Similar

Key Parameters

Parameter Value
Memory Type Non-Volatile FLASH
Technology FLASH - NAND (SLC)
Memory Size 80Gbit
Memory Organization 10G x 8
Memory Interface UFS3.1
Package Type 153-TFBGA (11.5x13mm)
Mounting Type Surface Mount
Operating Temperature -40°C to 85°C
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the SM671PAB-ADSS is determined by strict equivalence across the following critical parameters:

Memory Capacity and Organization: The substitute part must provide 80Gbit capacity with 10G x 8 memory organization to maintain functional compatibility with existing circuit designs.

Interface Standard: UFS3.1 interface compatibility is mandatory for proper communication protocol alignment with host controllers and system architecture.

Package Configuration: The 153-TFBGA (11.5x13mm) surface mount package ensures mechanical and electrical compatibility with printed circuit board layouts and assembly processes.

Operating Temperature Range: The -40°C to 85°C operating range must be maintained to support the intended application environment.

Compliance Standards: ROHS3 compliance and MSL 3 (168 Hours) moisture sensitivity level must be preserved for regulatory and manufacturing process requirements.

Manufacturer Consistency: Silicon Motion, Inc. as the original manufacturer ensures design continuity and technical support alignment.

Parameter Comparison

Parameter SM671PAB-ADSS (Main Part) SM671PAB-AFSS (Substitute) Match Status
Manufacturer Silicon Motion, Inc. Silicon Motion, Inc. Identical
Memory Type Non-Volatile FLASH Non-Volatile FLASH Identical
Technology FLASH - NAND (SLC) FLASH - NAND (SLC) Identical
Memory Size 80Gbit 80Gbit Identical
Memory Organization 10G x 8 10G x 8 Identical
Memory Interface UFS3.1 UFS3.1 Identical
Package Type 153-TFBGA (11.5x13mm) 153-TFBGA (11.5x13mm) Identical
Mounting Type Surface Mount Surface Mount Identical
Operating Temperature -40°C to 85°C -40°C to 85°C Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours) Identical
Product Status Obsolete Active Different

Engineering Selection Recommendations

The SM671PAB-AFSS serves as a direct functional equivalent to the SM671PAB-ADSS. Both components share identical electrical specifications, memory capacity, interface protocol, package configuration, and compliance certifications.

The primary distinction between these parts is product status: the SM671PAB-ADSS is classified as obsolete, while the SM671PAB-AFSS maintains active status. This status difference reflects manufacturing lifecycle positioning and supply chain availability rather than technical capability differences.

For new designs or component replenishment, the SM671PAB-AFSS is the appropriate selection due to its active product status and confirmed availability. The SM671PAB-AFSS provides equivalent performance and maintains full compatibility with applications originally designed for the SM671PAB-ADSS.

Frequently Asked Questions (FAQ)

Q: Can the SM671PAB-AFSS replace the SM671PAB-ADSS in existing designs?

A: Yes. The SM671PAB-AFSS is electrically and mechanically equivalent to the SM671PAB-ADSS. All critical parameters including memory capacity, interface standard, package configuration, and operating temperature range are identical.

Q: What is the significance of the product status difference?

A: Product status indicates manufacturing lifecycle stage. The SM671PAB-ADSS is obsolete, meaning it is no longer in active production. The SM671PAB-AFSS is active, indicating current manufacturing and supply availability. For procurement purposes, the active part is the appropriate selection.

Q: Are the package dimensions identical?

A: Yes. Both parts use the 153-TFBGA package with dimensions of 11.5x13mm. PCB layout and assembly processes require no modification.

Q: Do both parts meet the same compliance requirements?

A: Yes. Both the SM671PAB-ADSS and SM671PAB-AFSS are ROHS3 compliant and carry MSL 3 (168 Hours) moisture sensitivity level ratings.

Q: Is the UFS3.1 interface identical between both parts?

A: Yes. Both components implement the UFS3.1 interface standard with identical electrical and protocol specifications.

Q: What is the memory organization specification?

A: Both parts feature 10G x 8 memory organization, providing 80Gbit total capacity in an 8-bit data width configuration.

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