SM671PAA-ADST Equivalent & Substitute Parts

Part Overview

The SM671PAA-ADST is a FLASH NAND (TLC) memory integrated circuit manufactured by Silicon Motion, Inc. This device provides 128Gbit storage capacity with UFS3.1 interface in a 153-BGA surface mount package. The part is classified as obsolete, necessitating identification of active equivalent components for ongoing design requirements and procurement needs.

Substiute Parts

SM671PAA-ADST

Silicon Motion, Inc.In Stock: 1068SM671PAA-ADST Datasheet

Current PartRFQ

SM671PAA-AFST

Silicon Motion, Inc.In Stock: 1116SM671PAA-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM671PAA-ADST is determined by equivalence across the following critical parameters:

Memory Capacity & Organization: 128Gbit capacity with 16G x 8 organization ensures functional compatibility at the system level.

Interface Standard: UFS3.1 protocol compatibility maintains electrical and logical interface requirements.

Package Specification: 153-TFBGA (11.5x13) package dimensions and ball grid array configuration ensure mechanical and thermal compatibility with existing PCB layouts.

Environmental & Compliance Requirements: Operating temperature range of -40°C ~ 85°C, ROHS3 compliance, and MSL 3 rating establish the environmental and regulatory baseline for substitution.

Manufacturer & Series: Silicon Motion, Inc. Ferri-UFS™ series components maintain design consistency and supply chain alignment.

Parameter Comparison

Engineering Selection Recommendations

The SM671PAA-AFST serves as a direct functional equivalent to the SM671PAA-ADST. Both components share identical electrical specifications, memory capacity, interface protocol, and physical packaging. The primary distinction is product status: SM671PAA-ADST is classified as obsolete, while SM671PAA-AFST maintains active status with confirmed inventory availability.

For new designs and ongoing procurement, SM671PAA-AFST is the appropriate selection. Both parts maintain ROHS3 compliance and identical environmental operating parameters, ensuring regulatory and thermal compatibility with existing system requirements.

Frequently Asked Questions (FAQ)

Q: Can SM671PAA-AFST replace SM671PAA-ADST in existing designs?

A: Yes. Both components are electrically and mechanically equivalent across all specified parameters, including memory capacity (128Gbit), interface standard (UFS3.1), package configuration (153-TFBGA 11.5x13), and operating temperature range (-40°C ~ 85°C).

Q: What is the primary reason for substitution?

A: SM671PAA-ADST is classified as obsolete. SM671PAA-AFST is the active equivalent component from the same manufacturer and series, ensuring continued availability and supply chain continuity.

Q: Are there any differences in compliance or environmental ratings?

A: No. Both components maintain identical ROHS3 compliance status, MSL 3 rating (168 Hours), and operating temperature specifications.

Q: Does the package footprint remain the same?

A: Yes. Both components use the 153-TFBGA package with dimensions of 11.5x13mm, ensuring direct compatibility with existing PCB layouts and assembly processes.

Q: Are there any differences in memory organization or interface protocol?

A: No. Both components provide 128Gbit capacity with 16G x 8 organization and UFS3.1 interface compatibility.