SM668PX8-AC Equivalent & Substitute Parts

Part Overview

The SM668PX8-AC is a Ferri-eMMC BGA 153-B eMMC 5.0 SL memory IC manufactured by Silicon Motion, Inc. This component is classified as obsolete, making identification of suitable substitute parts essential for ongoing system support and component procurement. The part operates within the eMMC memory interface standard and is packaged in a 153-ball BGA configuration. Due to its obsolete status, alternative components meeting equivalent electrical and mechanical specifications are required for design continuity and production support.

Substiute Parts

SM668PX8-AC

Silicon Motion, Inc.In Stock: 737SM668PX8-AC Datasheet

Current PartRFQ

SM662PXB BESS

Silicon Motion, Inc.In Stock: 854SM662PXB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM668PX8-AC is determined by the following critical parameters:

• Memory Interface Standard: eMMC compatibility
• Package Configuration: 153-BGA form factor
• Manufacturer: Silicon Motion, Inc. (Ferri-eMMC series)
• Compliance Requirements: ROHS3 compliance, REACH unaffected status, matching ECCN classification
• Moisture Sensitivity: MSL 3 rating (168 Hours)

The SM662PXB BESS qualifies as a substitute based on matching package geometry (153-BGA), identical manufacturer origin, equivalent compliance certifications, and compatible eMMC memory interface architecture. Both components share the same base product family lineage and regulatory compliance framework.

Parameter Comparison

Engineering Selection Recommendations

The SM662PXB BESS is the designated substitute for the obsolete SM668PX8-AC based on the following engineering criteria:

• Regulatory Compliance: Both components maintain ROHS3 compliance and REACH unaffected status, ensuring equivalent environmental and safety standards.
• Export Classification: Identical ECCN coding (3A991B1A) confirms equivalent export control treatment.
• Packaging Compatibility: Both components utilize 153-BGA surface mount packaging with matching MSL 3 moisture sensitivity ratings, supporting identical PCB assembly and handling procedures.
• Product Availability: The SM662PXB BESS maintains active product status with confirmed inventory availability, providing supply chain continuity for the obsolete SM668PX8-AC.
• Manufacturer Continuity: Both components originate from Silicon Motion, Inc., within the Ferri-eMMC product series, ensuring design family consistency.

Frequently Asked Questions (FAQ)

Q: Why is the SM668PX8-AC classified as obsolete? A: The SM668PX8-AC has reached end-of-life status within Silicon Motion's product portfolio. Substitute components are required for ongoing system support and new production builds.

Q: What are the primary compatibility criteria for substituting the SM668PX8-AC? A: Substitutes must maintain eMMC memory interface compatibility, 153-BGA package configuration, ROHS3 compliance, MSL 3 moisture sensitivity rating, and identical ECCN export classification.

Q: Is the SM662PXB BESS a direct pin-for-pin replacement? A: Both components share the 153-BGA package configuration with matching ball grid layout (11.5x13mm). Electrical and mechanical compatibility is established through identical package geometry and eMMC interface standards.

Q: What is the significance of matching ECCN codes? A: Identical ECCN classification (3A991B1A) ensures equivalent export control treatment and regulatory compliance for international distribution and supply chain operations.

Q: How does MSL 3 rating affect component handling? A: MSL 3 rating specifies a moisture sensitivity level requiring controlled storage conditions (168 hours maximum floor life at specified humidity). Both components require identical handling, storage, and assembly procedures.

Q: Is the SM662PXB BESS available in production quantities? A: The SM662PXB BESS maintains active product status with confirmed inventory availability, supporting both prototype and production-volume requirements.