SM668PEB-ACS Equivalent & Substitute Parts

Part Overview

The SM668PEB-ACS is a Ferri-eMMC BGA 153-B eMMC 5.0 memory IC manufactured by Silicon Motion, Inc. This component is classified as obsolete, making identification of functionally equivalent substitute parts essential for ongoing system support and component procurement. The SM668PEB-ACS serves as a non-volatile flash memory solution in embedded applications requiring eMMC interface compatibility.

Substiute Parts

SM668PEB-ACS

Silicon Motion, Inc.In Stock: 978SM668PEB-ACS Datasheet

Current PartRFQ

SM662PED BESS

Silicon Motion, Inc.In Stock: 815SM662PED BESS Datasheet

MFR RecommendedRFQ

SM662PED BFSS

Silicon Motion, Inc.In Stock: 1059SM662PED BFSS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the SM668PEB-ACS are identified based on the following critical parameters:

• Manufacturer: Silicon Motion, Inc. (same manufacturer ensures design compatibility)
• Memory Type: Non-Volatile FLASH
• Memory Format: FLASH - NAND (SLC)
• Memory Interface: eMMC
• RoHS Compliance: ROHS3 Compliant
• Moisture Sensitivity Level: 3 (168 Hours)
• ECCN Classification: 3A991B1A
• Operating Temperature Range: -40°C ~ 85°C

The substitute parts SM662PED BESS and SM662PED BFSS share identical memory technology, interface protocol, and regulatory compliance with the SM668PEB-ACS. Both substitutes are manufactured by Silicon Motion, Inc. and maintain active product status, ensuring continued availability and support.

Parameter Comparison

Engineering Selection Recommendations

Both SM662PED BESS and SM662PED BFSS are suitable substitutes for the obsolete SM668PEB-ACS based on functional equivalence and regulatory compliance alignment. Both substitute parts maintain ROHS3 compliance, identical moisture sensitivity specifications, and matching ECCN classifications.

SM662PED BFSS is the preferred substitute when package footprint compatibility is a primary consideration, as it utilizes a 153-BGA package matching the original SM668PEB-ACS form factor. This minimizes potential PCB redesign requirements.

SM662PED BESS offers an alternative with a 100-BGA package configuration. Selection of this part requires PCB layout evaluation to confirm compatibility with existing board designs.

Both substitutes are currently in active production status with confirmed inventory availability, ensuring long-term supply chain stability compared to the obsolete original part.

Frequently Asked Questions (FAQ)

Q: Can SM662PED BESS and SM662PED BFSS be used interchangeably with SM668PEB-ACS?

A: Both parts share identical memory technology, interface protocol, and regulatory compliance. However, package differences require evaluation. SM662PED BFSS maintains the 153-BGA footprint of the original part. SM662PED BESS uses a 100-BGA package and requires PCB compatibility assessment.

Q: What is the primary difference between the two substitute parts?

A: The primary difference is package configuration. SM662PED BESS uses a 100-BGA (14x18) package, while SM662PED BFSS uses a 153-BGA (11.5x13) package. Both contain identical 320Gbit FLASH memory with 40G x 8 organization and eMMC interface.

Q: Are the substitute parts RoHS compliant?

A: Yes, both SM662PED BESS and SM662PED BFSS are ROHS3 compliant, matching the compliance status of the original SM668PEB-ACS.

Q: What is the moisture sensitivity level for these parts?

A: All three parts, including the original and both substitutes, have a Moisture Sensitivity Level of 3 (168 Hours), requiring identical handling and storage protocols.

Q: Are these parts available for immediate procurement?

A: Yes, both substitute parts are in active production status with confirmed inventory. SM662PED BESS has 768 units in stock, and SM662PED BFSS has 1015 units in stock.

Q: Does REACH compliance differ between the substitutes?

A: SM662PED BESS maintains REACH Unaffected status. SM662PED BFSS shows Vendor Undefined REACH status. Verify REACH requirements with your specific application before final selection.