SM668GEA-AC Equivalent & Substitute Parts

Part Overview

The SM668GEA-AC is a Ferri-eMMC BGA 100-B eMMC 5.0 memory IC manufactured by Silicon Motion, Inc. This component is classified as obsolete, making equivalent substitute parts necessary for ongoing design support and procurement. The part is a NAND flash memory device in 100-BGA packaging, designed for embedded multimedia card applications requiring high-density non-volatile storage.

Substiute Parts

SM668GEA-AC

Silicon Motion, Inc.In Stock: 989SM668GEA-AC Datasheet

Current PartRFQ

SM662GEC BESS

Silicon Motion, Inc.In Stock: 1202SM662GEC BESS Datasheet

MFR RecommendedRFQ

SM662GEC BFSS

Silicon Motion, Inc.In Stock: 1167SM662GEC BFSS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the SM668GEA-AC is based on the following critical parameters that must remain consistent:

• Manufacturer: Silicon Motion, Inc. (same manufacturer ensures design compatibility)
• Memory Interface: eMMC (functional requirement for system integration)
• Package Type: 100-BGA (14x18) (mechanical and electrical compatibility)
• Memory Technology: FLASH - NAND (SLC) (functional equivalence)
• RoHS Status: ROHS3 Compliant (regulatory requirement)
• Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements)
• Operating Temperature Range: -40°C ~ 85°C (thermal operating envelope)

The substitute parts SM662GEC BESS and SM662GEC BFSS meet all these criteria and are classified as active products, providing long-term availability compared to the obsolete SM668GEA-AC.

Parameter Comparison

Engineering Selection Recommendations

Both SM662GEC BESS and SM662GEC BFSS are qualified substitutes for the obsolete SM668GEA-AC. Selection between these two active alternatives should be based on:

• Product Availability: Both parts maintain active status with current inventory levels (1161 Pcs for SM662GEC BESS; 1109 Pcs for SM662GEC BFSS), ensuring long-term procurement viability.
• Regulatory Compliance: Both substitutes maintain ROHS3 compliance and identical ECCN classification, satisfying export and environmental requirements.
• Thermal and Mechanical Compatibility: Identical operating temperature range (-40°C ~ 85°C), moisture sensitivity level (MSL 3), and 100-BGA (14x18) package ensure direct mechanical and thermal substitution without design modification.
• Memory Specifications: Both substitutes provide 160Gbit capacity with eMMC interface, maintaining functional equivalence for system integration.

Frequently Asked Questions (FAQ)

Q: Can SM662GEC BESS and SM662GEC BFSS be used interchangeably with SM668GEA-AC?

A: Yes. Both substitute parts share identical package geometry (100-BGA 14x18), operating temperature range (-40°C ~ 85°C), moisture sensitivity level (MSL 3), and eMMC interface specification. They are direct mechanical and electrical substitutes.

Q: What is the primary reason for substitution?

A: The SM668GEA-AC is classified as obsolete. The SM662GEC BESS and SM662GEC BFSS are active products from the same manufacturer, providing assured long-term availability and supply chain continuity.

Q: Are there differences between SM662GEC BESS and SM662GEC BFSS?

A: Both parts are functionally equivalent with identical electrical and mechanical specifications. The designation difference (BESS vs. BFSS) reflects packaging or supplier variants. Selection may depend on inventory availability or supplier preference.

Q: Do the substitute parts maintain regulatory compliance?

A: Yes. Both SM662GEC BESS and SM662GEC BFSS are ROHS3 compliant with identical ECCN classification (3A991B1A) to the original part, maintaining full regulatory equivalence.

Q: What are the critical parameters for substitution compatibility?

A: The following parameters must match for substitution: eMMC interface, 100-BGA (14x18) package, FLASH - NAND (SLC) technology, -40°C ~ 85°C operating temperature, MSL 3 moisture sensitivity, and ROHS3 compliance.