SM668GE4-AC Equivalent & Substitute Parts

Part Overview

The SM668GE4-AC is a 4Gbit eMMC NAND Flash memory IC manufactured by Silicon Motion, Inc., designed for automotive applications with AEC-Q100 qualification. This component is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and production continuity. The part operates across the automotive temperature range of -40°C to 85°C and is packaged in a 100-BGA configuration with ROHS3 compliance.

Substiute Parts

SM668GE4-AC

Silicon Motion, Inc.In Stock: 962SM668GE4-AC Datasheet

Current PartRFQ

SM662GEB BESS

Silicon Motion, Inc.In Stock: 1209SM662GEB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM668GE4-AC is determined by the following critical parameters:

• Memory Interface Compatibility: Both parts must support eMMC interface protocol
• Package Compatibility: Both parts must use 100-BGA packaging to ensure PCB footprint alignment
• Operating Temperature Range: Substitute must support -40°C to 85°C automotive temperature range
• Automotive Grade Compliance: Substitute must maintain AEC-Q100 qualification for automotive applications
• RoHS Compliance: Substitute must maintain ROHS3 compliance status
• Moisture Sensitivity: Substitute must match or exceed MSL rating for handling and storage requirements

The SM662GEB BESS qualifies as a manufacturer-recommended substitute based on these parameters. While the SM662GEB BESS provides increased memory capacity (80Gbit versus 4Gbit), it maintains full compatibility across all critical electrical, mechanical, and environmental specifications required for direct substitution in automotive applications.

Parameter Comparison

Engineering Selection Recommendations

The SM662GEB BESS is the manufacturer-recommended substitute for the obsolete SM668GE4-AC. Both components maintain identical automotive grade classification and AEC-Q100 qualification, ensuring compliance with automotive reliability standards. The substitute part is currently in active production status, providing supply chain continuity for ongoing applications.

The SM662GEB BESS offers increased memory capacity (80Gbit) while preserving all critical electrical and mechanical compatibility parameters. The eMMC interface, operating temperature range, package footprint, RoHS compliance, and moisture sensitivity specifications remain consistent between the main part and substitute, enabling direct functional replacement in automotive memory applications.

Frequently Asked Questions (FAQ)

Q: Can the SM662GEB BESS directly replace the SM668GE4-AC in existing designs?

A: Yes. Both parts share identical eMMC interface specifications, 100-BGA package configuration, automotive temperature range (-40°C to 85°C), AEC-Q100 qualification, ROHS3 compliance, and MSL rating. The increased memory capacity of the substitute does not affect electrical or mechanical compatibility.

Q: What is the primary difference between these two parts?

A: The SM662GEB BESS provides 80Gbit memory capacity compared to the SM668GE4-AC's 4Gbit capacity. Both use identical NAND Flash SLC technology and eMMC interface protocol.

Q: Why is the SM668GE4-AC listed as obsolete?

A: The SM668GE4-AC has reached end-of-life status. The SM662GEB BESS is the active production alternative from Silicon Motion, Inc., ensuring continued availability for new designs and production support.

Q: Are there any handling or storage differences between these parts?

A: Both parts maintain identical Moisture Sensitivity Level (MSL) rating of 3 (168 Hours), requiring the same handling, storage, and reflow procedures during assembly.

Q: Does the substitute part maintain automotive compliance?

A: Yes. The SM662GEB BESS maintains automotive grade classification and AEC-Q100 qualification, meeting all automotive reliability and qualification requirements of the original part.