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SM667PX4-AC Equivalent & Substitute Parts

Part Overview

The SM667PX4-AC is a FERRI-eMMC memory IC manufactured by Silicon Motion, Inc., packaged in a 153-ball BGA configuration with 4.5 SL specification. This component is classified as Obsolete, necessitating identification of functionally compatible alternatives for ongoing system support and new design implementations. The part carries ROHS3 compliance and REACH Unaffected status, with Moisture Sensitivity Level 3 (168 Hours).

Substiute Parts

SM667PX4-AC

Silicon Motion, Inc.In Stock: 1177SM667PX4-AC Datasheet

Current PartRFQ

SM662PXB BESS

Silicon Motion, Inc.In Stock: 854SM662PXB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The SM667PX4-AC has one identified substitute: SM662PXB BESS. This substitution is based on the following alignment criteria:

• Manufacturer: Both parts are manufactured by Silicon Motion, Inc.
• Category: Both classified as Memory components
• Package Type: Both utilize 153-BGA (Ball Grid Array) packaging
• Memory Interface: Both implement eMMC interface standard
• Compliance: Both maintain ROHS3 compliance and REACH Unaffected status
• Moisture Sensitivity: Both rated at MSL 3 (168 Hours)
• Trade Classification: Both share identical ECCN (3A991B1A) classification

The SM662PXB BESS represents an Active product status alternative, providing continuity for applications requiring eMMC memory in 153-BGA form factor.

Parameter Comparison

Engineering Selection Recommendations

The SM662PXB BESS qualifies as a direct substitute for the obsolete SM667PX4-AC based on the following engineering criteria:

• Regulatory Compliance: Both parts maintain identical ROHS3 and REACH compliance status, ensuring regulatory continuity in applications subject to environmental directives.
• Product Lifecycle: The SM662PXB BESS carries Active product status, providing long-term availability and supply chain stability compared to the Obsolete SM667PX4-AC.
• Package Compatibility: Both components utilize 153-BGA packaging with matching MSL 3 (168 Hours) ratings, ensuring compatibility with existing PCB designs and assembly processes.
• Trade Classification: Identical ECCN classification (3A991B1A) confirms equivalent export control and trade compliance requirements.
• Interface Standard: Both implement eMMC memory interface, maintaining functional compatibility at the system level.

Frequently Asked Questions (FAQ)

Q: Can SM662PXB BESS be used as a direct replacement for SM667PX4-AC in existing designs?

A: Yes. Both parts share identical 153-BGA packaging, eMMC interface, MSL 3 rating, and compliance certifications. PCB layout and assembly processes require no modification.

Q: What is the primary reason for substitution?

A: The SM667PX4-AC is classified as Obsolete. The SM662PXB BESS is an Active product from the same manufacturer, ensuring continued availability and supply chain support.

Q: Are there differences in memory capacity between these parts?

A: The SM662PXB BESS specifies 80Gbit capacity with 10G x 8 organization. The SM667PX4-AC does not provide detailed memory specifications in available documentation.

Q: Do both parts require identical handling and storage conditions?

A: Yes. Both parts carry MSL 3 (168 Hours) rating, requiring identical moisture control and storage protocols during manufacturing and assembly.

Q: Are there any compliance or certification differences?

A: No. Both parts maintain ROHS3 compliance, REACH Unaffected status, and identical ECCN classification (3A991B1A), ensuring equivalent regulatory treatment.

Q: What is the package form factor for both parts?

A: Both parts use 153-BGA (Ball Grid Array) packaging with dimensions of 11.5x13mm, ensuring mechanical and electrical compatibility in 153-pin BGA socket applications.