SM667PX2-AC Equivalent & Substitute Parts

Part Overview

The SM667PX2-AC is a Ferri-eMMC BGA 153-B embedded memory IC manufactured by Silicon Motion, Inc. This component is classified as a Memory IC with FLASH - NAND (SLC) technology. The part is currently listed as Obsolete, which necessitates identification of functionally equivalent alternatives for ongoing system support and new design implementations. Substitute parts must maintain compatibility with the 153-BGA package specification and eMMC interface requirements.

Substiute Parts

SM667PX2-AC

Silicon Motion, Inc.In Stock: 780SM667PX2-AC Datasheet

Current PartRFQ

SM662PXB BESS

Silicon Motion, Inc.In Stock: 854SM662PXB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The SM662PXB BESS has been identified as a manufacturer-recommended substitute for the SM667PX2-AC. The substitution is based on the following critical parameters:

• Package Compatibility: Both parts utilize the 153-BGA (11.5x13) package, ensuring mechanical and electrical pin compatibility
• Memory Interface: Both components implement the eMMC interface standard
• Manufacturer: Both parts are manufactured by Silicon Motion, Inc., ensuring design continuity and support consistency
• Compliance Standards: Both parts maintain ROHS3 compliance and REACH Unaffected status
• Moisture Sensitivity: Both parts share MSL 3 (168 Hours) rating
• Export Classification: Both parts carry identical ECCN classification (3A991B1A)

Parameter Comparison

Engineering Selection Recommendations

The SM662PXB BESS is the designated manufacturer-recommended substitute for the obsolete SM667PX2-AC. Selection of this substitute is supported by:

• Product Status Alignment: The substitute part maintains Active product status, ensuring long-term availability and manufacturer support
• Regulatory Compliance: Both parts maintain identical ROHS3 and REACH compliance certifications, satisfying regulatory requirements for equivalent applications
• Package Specification: The 153-BGA package specification is maintained across both parts, ensuring direct mechanical and electrical compatibility
• Interface Continuity: eMMC interface implementation is consistent between the main part and substitute, supporting seamless integration into existing designs
• Export Classification: Identical ECCN classification ensures no change to export control or supply chain documentation requirements

Frequently Asked Questions (FAQ)

Q: Can the SM662PXB BESS be used as a direct replacement for the SM667PX2-AC?

A: Yes. Both parts share the 153-BGA package specification, eMMC interface standard, and identical compliance certifications. The SM662PXB BESS is the manufacturer-recommended substitute.

Q: What is the primary reason for substitution?

A: The SM667PX2-AC is classified as Obsolete. The SM662PXB BESS maintains Active product status, ensuring continued availability and manufacturer support.

Q: Are there any compliance differences between the two parts?

A: No. Both parts maintain ROHS3 compliance, REACH Unaffected status, and identical ECCN classification (3A991B1A). Moisture Sensitivity Level (MSL 3, 168 Hours) is also identical.

Q: What is the package specification for both parts?

A: Both parts utilize the 153-BGA package with dimensions of 11.5x13 millimeters. This ensures mechanical and electrical pin compatibility.

Q: Is the eMMC interface identical between both parts?

A: Yes. Both the SM667PX2-AC and SM662PXB BESS implement the eMMC interface standard, supporting direct functional compatibility.

Q: What is the inventory status of the substitute part?

A: The SM662PXB BESS has 842 pieces of new original stock available, supporting immediate procurement for production requirements.