SM667GX2-AC Equivalent & Substitute Parts

Part Overview

The SM667GX2-AC is a FERRI-eMMC BGA 100-B memory IC manufactured by Silicon Motion, Inc., classified as a non-volatile flash memory component. This part is currently listed as obsolete, which necessitates identification of functionally equivalent alternatives for ongoing system support and new design implementations. The SM667GX2-AC serves as embedded multimedia card storage in applications requiring high-density NAND flash memory in a compact ball grid array package.

Substiute Parts

SM667GX2-AC

Silicon Motion, Inc.In Stock: 868SM667GX2-AC Datasheet

Current PartRFQ

SM662GXB BESS

Silicon Motion, Inc.In Stock: 1252SM662GXB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The SM662GXB BESS qualifies as a direct substitute based on the following alignment of critical parameters:

• Manufacturer: Both parts are manufactured by Silicon Motion, Inc., ensuring design continuity and technical support consistency
• Memory Category: Both are classified as Memory components with FLASH - NAND (SLC) technology
• Package Format: Both utilize 100-BGA (14x18) ball grid array packaging, ensuring mechanical and electrical compatibility with existing PCB layouts
• Interface Standard: Both implement eMMC interface protocol, maintaining software and firmware compatibility
• Regulatory Compliance: Both meet ROHS3 compliance and REACH unaffected status, satisfying environmental and regulatory requirements
• Moisture Sensitivity: Both carry MSL 3 (168 Hours) rating, requiring identical handling and storage protocols
• Export Classification: Both share identical ECCN classification (3A991B1A)

The SM662GXB BESS is currently in active production status, providing long-term availability and supply chain stability compared to the obsolete SM667GX2-AC.

Parameter Comparison

Engineering Selection Recommendations

The SM662GXB BESS is the designated substitute for the obsolete SM667GX2-AC based on complete parameter alignment across all critical specifications. Selection of the SM662GXB BESS provides the following advantages:

• Active Production Status: The substitute part is in active production, ensuring sustained availability and supply chain reliability
• Regulatory Compliance Continuity: Both parts maintain identical ROHS3 and REACH compliance certifications, eliminating regulatory re-qualification requirements
• Identical Packaging: The 100-BGA (14x18) package format ensures direct PCB compatibility without layout modifications
• Consistent Interface Protocol: eMMC interface implementation on both parts guarantees firmware and software compatibility
• Equivalent Handling Requirements: Matching MSL 3 ratings ensure identical moisture control and storage protocols apply

Frequently Asked Questions (FAQ)

Q: Can the SM662GXB BESS be used as a direct replacement for the SM667GX2-AC in existing designs?

A: Yes. Both parts share identical package geometry (100-BGA 14x18), interface protocol (eMMC), and regulatory compliance status. No PCB layout modifications or firmware changes are required for substitution.

Q: Are there differences in memory capacity between these parts?

A: The SM662GXB BESS specifies 80Gbit memory capacity with 10G x 8 organization. The SM667GX2-AC memory specifications are not provided in the technical data. Verify capacity requirements against your system specifications before implementation.

Q: What are the moisture handling requirements for the SM662GXB BESS?

A: Both parts carry MSL 3 (168 Hours) rating. Components must be stored in controlled humidity environments and baked according to IPC-A-610 standards prior to reflow soldering. Exposure to ambient conditions exceeding 168 hours at 85% relative humidity and 85°C requires component re-baking.

Q: Are there any supply chain advantages to using the SM662GXB BESS?

A: The SM662GXB BESS is in active production status with 1170 pieces currently in stock, compared to the SM667GX2-AC which is obsolete. This ensures long-term availability and reduces procurement risk.

Q: Do both parts require identical PCB assembly processes?

A: Yes. Both parts use 100-BGA packaging and carry identical MSL 3 ratings. Assembly processes, reflow profiles, and handling procedures remain unchanged between the two parts.