SM667GE4-AC Equivalent & Substitute Parts

Part Overview

The SM667GE4-AC is a Ferri-eMMC BGA 100-B memory IC manufactured by Silicon Motion, Inc. This component is classified as a Memory IC with FLASH - NAND (SLC) technology. The product is currently listed as Obsolete, making identification of compatible substitute parts essential for ongoing system support and component procurement.

Substiute Parts

SM667GE4-AC

Silicon Motion, Inc.In Stock: 872SM667GE4-AC Datasheet

Current PartRFQ

SM662GEB BESS

Silicon Motion, Inc.In Stock: 1209SM662GEB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM667GE4-AC is determined by the following critical parameters:

• Manufacturer: Silicon Motion, Inc. (same manufacturer ensures design compatibility)
• Memory Category: Memory IC with FLASH - NAND technology
• Package Type: 100-BGA form factor (mechanical and electrical interface compatibility)
• Interface Standard: eMMC protocol support
• Compliance Standards: RoHS3 compliance and REACH unaffected status
• Moisture Sensitivity: MSL 3 rating for handling and storage requirements

The SM662GEB BESS qualifies as a substitute based on matching these core parameters within the Ferri-eMMC product family.

Parameter Comparison

Engineering Selection Recommendations

The SM662GEB BESS is a qualified substitute for the obsolete SM667GE4-AC based on the following engineering criteria:

• Compliance Alignment: Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory continuity in applications.
• Moisture Handling: Identical MSL 3 rating ensures equivalent handling, storage, and reflow requirements.
• Export Classification: Matching ECCN codes confirm equivalent trade compliance status.
• Active Product Status: The SM662GEB BESS is currently in active production, providing supply chain continuity for the obsolete SM667GE4-AC.
• Package Compatibility: Both components utilize 100-BGA packaging with identical pin configurations, supporting direct board-level substitution.
• Memory Interface: eMMC protocol support in both parts ensures functional compatibility in host systems designed for eMMC memory devices.

Frequently Asked Questions (FAQ)

Q: Can the SM662GEB BESS directly replace the SM667GE4-AC on existing PCBs?

A: Yes. Both parts share the 100-BGA package type with identical mechanical and electrical interfaces. No PCB redesign is required for substitution.

Q: Are there differences in memory capacity between these parts?

A: The SM662GEB BESS specifies 80Gbit memory capacity with 10G x 8 organization. The SM667GE4-AC memory specifications are not provided in the available data.

Q: Do both parts require the same handling procedures?

A: Yes. Both parts carry MSL 3 rating (168 Hours), requiring identical moisture control, storage, and reflow procedures during assembly.

Q: What is the significance of the Active product status for SM662GEB BESS?

A: Active status indicates current manufacturing availability, ensuring long-term supply chain support compared to the Obsolete SM667GE4-AC.

Q: Are there any compliance concerns with this substitution?

A: No. Both parts maintain identical RoHS3 compliance and REACH unaffected status, with matching ECCN export classifications.

Q: What is the operating temperature range for these components?

A: The SM662GEB BESS operates across -40°C to 85°C. Operating temperature specifications for the SM667GE4-AC are not provided in the available documentation.