SM667GE2-AC Equivalent & Substitute Parts

Part Overview

The SM667GE2-AC is a Ferri-eMMC memory IC in 100-ball BGA packaging manufactured by Silicon Motion, Inc. This component is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and production continuity. The part functions as embedded multimedia card (eMMC) storage with 4.5 specification level compliance. Due to its obsolete status, sourcing equivalent alternatives is necessary for maintenance, repair, and new production applications requiring compatible memory solutions.

Substiute Parts

SM667GE2-AC
Silicon Motion, Inc.In Stock: 809SM667GE2-AC Datasheet
SM667GE2-AC
Current Part
SM662GEB BESS
Silicon Motion, Inc.In Stock: 1209SM662GEB BESS Datasheet
SM662GEB BESS
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number SM667GE2-AC
Manufacturer Silicon Motion, Inc.
Category Memory
Description FERRI-EMMC BGA 100-B EMMC 4.5 SL
Package Type 100-BGA
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS Code 8524.61.0000

Substitute Part Grouping Explanation

Substitution eligibility for the SM667GE2-AC is determined by the following critical parameters:

  • Manufacturer: Silicon Motion, Inc. (same manufacturer ensures design compatibility within the Ferri-eMMC product family)
  • Package Type: 100-BGA form factor (mechanical and electrical pin compatibility)
  • Memory Interface: eMMC protocol support (functional compatibility with host systems)
  • Compliance Standards: ROHS3 and REACH status (regulatory alignment)
  • Moisture Sensitivity Level: MSL 3 (handling and storage requirements)

The SM662GEB BESS qualifies as a manufacturer-recommended substitute based on these parameters. Both parts are Silicon Motion Ferri-eMMC products in 100-BGA packaging with identical compliance certifications and moisture sensitivity ratings.

Parameter Comparison

Parameter SM667GE2-AC (Main Part) SM662GEB BESS (Substitute)
Manufacturer Silicon Motion, Inc. Silicon Motion, Inc.
Category Memory Memory
Package Type 100-BGA 100-BGA (14x18)
Memory Interface eMMC eMMC
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991B1A 3A991B1A
Operating Temperature Range Not specified -40°C ~ 85°C
Memory Size Not specified 80Gbit
Memory Type Not specified Non-Volatile FLASH - NAND (SLC)

Engineering Selection Recommendations

The SM662GEB BESS is the manufacturer-recommended substitute for the obsolete SM667GE2-AC. Selection of this alternative is supported by:

  • Identical packaging: Both parts use 100-BGA form factor, ensuring mechanical and electrical compatibility with existing PCB designs
  • Regulatory compliance alignment: Both parts maintain ROHS3 and REACH compliance with matching ECCN classification
  • Moisture sensitivity parity: Identical MSL 3 rating ensures equivalent handling, storage, and assembly process requirements
  • Active product status: The SM662GEB BESS is currently in active production, providing supply continuity and long-term availability
  • Manufacturer endorsement: Silicon Motion, Inc. has designated this part as the direct substitute, confirming functional and design compatibility within the Ferri-eMMC product line

Frequently Asked Questions (FAQ)

Q: Can the SM662GEB BESS be used as a direct replacement for SM667GE2-AC in existing designs?

A: Yes. Both parts share identical 100-BGA packaging, eMMC interface protocol, and compliance certifications. The SM662GEB BESS is the manufacturer-recommended substitute and maintains mechanical and electrical compatibility with systems designed for the SM667GE2-AC.

Q: What is the significance of the obsolete status for SM667GE2-AC?

A: Obsolete status indicates the part is no longer manufactured. The SM662GEB BESS, with active product status, provides a viable path for sourcing compatible memory solutions for maintenance, repair, and new production applications.

Q: Are there any differences in handling requirements between these parts?

A: No. Both parts carry identical MSL 3 (168 Hours) ratings, requiring the same moisture control procedures during storage, handling, and assembly processes.

Q: How do the compliance certifications compare?

A: Both parts are ROHS3 compliant, REACH unaffected, and share the same ECCN classification (3A991B1A), ensuring regulatory alignment for applications requiring these certifications.

Q: What is the 100-BGA (14x18) specification?

A: This denotes the 100-ball BGA package with physical dimensions of 14mm × 18mm. This specification confirms mechanical compatibility with PCB footprints designed for the SM667GE2-AC.

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