SM662PXC-BDST Equivalent & Substitute Parts

Part Overview

The SM662PXC-BDST is a 512Gbit eMMC 3D TLC NAND Flash memory IC manufactured by Silicon Motion, Inc., designed for non-volatile storage applications requiring high-capacity embedded multimedia card interfaces. This component features a 153-BGA (11.5x13mm) package configuration and operates across an industrial temperature range of -25°C to 85°C. The part is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new design implementations.

Substiute Parts

SM662PXC-BDST

Silicon Motion, Inc.In Stock: 930SM662PXC-BDST Datasheet

Current PartRFQ

SM662PXC-BEST

Silicon Motion, Inc.In Stock: 1129SM662PXC-BEST Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM662PXC-BDST is determined by strict equivalence across the following critical parameters:

• Memory capacity: 512Gbit
• Memory organization: 64G x 8
• Memory interface: eMMC protocol compliance
• Technology: NAND TLC architecture
• Operating temperature range: -25°C ~ 85°C
• Manufacturer series: Ferri-eMMC®
• RoHS compliance: ROHS3 Compliant
• Base product number: SM662

The SM662PXC-BEST qualifies as a direct substitute based on identical performance across all functional parameters. The primary distinction lies in package configuration and product status, which may influence procurement and lifecycle considerations.

Parameter Comparison

Engineering Selection Recommendations

The SM662PXC-BEST is the qualified substitute for SM662PXC-BDST applications. Both components maintain identical electrical and functional specifications across memory capacity, interface protocol, technology node, and operating conditions. The substitute part carries Active product status, ensuring continued availability and manufacturing support compared to the obsolete main part.

Both components satisfy ROHS3 compliance requirements and carry equivalent ECCN and HTSUS classifications. The primary design consideration involves package footprint compatibility: the SM662PXC-BEST employs a 100-BGA (14x18mm) configuration versus the original 153-BGA (11.5x13mm) package. PCB layout and mechanical integration must accommodate this dimensional difference.

Frequently Asked Questions (FAQ)

Q: Can SM662PXC-BEST directly replace SM662PXC-BDST in existing designs?

A: Electrical and functional compatibility is complete. Physical integration requires PCB redesign to accommodate the different BGA package footprint (100-BGA versus 153-BGA). The substitute part is electrically interchangeable when layout constraints permit package substitution.

Q: What is the primary reason for substitution?

A: The SM662PXC-BDST is classified as obsolete. The SM662PXC-BEST maintains identical memory specifications and interface characteristics while offering active product status and ongoing manufacturing availability.

Q: Are there compliance differences between these parts?

A: Both components are ROHS3 compliant and share identical ECCN and HTSUS classifications. No regulatory or compliance barriers exist for substitution.

Q: How do the package dimensions affect selection?

A: The SM662PXC-BDST uses a 153-BGA package measuring 11.5x13mm. The SM662PXC-BEST uses a 100-BGA package measuring 14x18mm. Package selection depends on available PCB real estate and mechanical constraints. Both packages are surface-mount BGA configurations.

Q: Is the memory interface identical between parts?

A: Both components implement the eMMC interface protocol with identical memory organization (64G x 8) and 512Gbit capacity. Interface compatibility is complete.