SM662PXC-ACS eMMC Flash Memory - Equivalent & Substitute Parts

Part Overview

The SM662PXC-ACS is a 64Gbit eMMC NAND flash memory IC manufactured by Silicon Motion, Inc., designed for automotive-grade applications. This part features MLC (Multi-Level Cell) technology with an 8G x 8 memory organization and operates across the -40°C to 85°C temperature range. The SM662PXC-ACS holds Obsolete product status, making identification of functionally compatible alternatives essential for ongoing system support and procurement planning.

Substiute Parts

SM662PXC-ACS

Silicon Motion, Inc.In Stock: 1404SM662PXC-ACS Datasheet

Current PartRFQ

SM662PXC BEST

Silicon Motion, Inc.In Stock: 1074SM662PXC BEST Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM662PXC-ACS is determined by the following critical parameters:

Interface Compatibility: Both the main part and substitute must support the eMMC interface standard to ensure protocol-level compatibility with host controllers.

Manufacturer Consistency: Silicon Motion, Inc. maintains the SM662 base product family across multiple configurations, ensuring design continuity and firmware compatibility.

Memory Organization: The substitute part must support 8-bit data width (x 8 organization) to maintain electrical and logical compatibility with existing circuit designs.

Automotive Qualification: AEC-Q100 certification and automotive-grade temperature range (-40°C to 85°C) are mandatory for applications requiring automotive reliability standards.

Compliance Standards: RoHS3 compliance and REACH unaffected status must be maintained to satisfy regulatory and supply chain requirements.

Package Type: Surface mount BGA packaging is required for compatibility with existing PCB layouts and assembly processes.

The SM662PXC BEST substitute meets these core substitution criteria while offering enhanced memory capacity and active product status.

Parameter Comparison

Engineering Selection Recommendations

The SM662PXC BEST serves as a direct substitute for the obsolete SM662PXC-ACS based on shared eMMC interface protocol, identical memory organization (8G x 8), and common manufacturer platform. Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements.

Key considerations for selection:

Product Status: The SM662PXC BEST holds Active product status with confirmed inventory availability (965 Pcs), whereas the SM662PXC-ACS is Obsolete. This transition is necessary for long-term supply chain sustainability.

Package Footprint: The substitute uses a 100-BGA (14x18) package compared to the 169-BGA of the main part. PCB layout redesign is required to accommodate the different ball grid array configuration and pin count.

Operating Temperature Range: The SM662PXC BEST supports -25°C to 85°C, which is narrower than the main part's -40°C to 85°C range. Applications requiring operation below -25°C require verification against actual system requirements.

Automotive Qualification: The main part carries explicit AEC-Q100 qualification and automotive grade designation. The substitute's automotive suitability must be confirmed through Silicon Motion documentation or application engineering review.

Memory Capacity: The substitute provides 512Gbit capacity versus 64Gbit in the main part, offering increased storage density if system architecture supports larger memory configurations.

Frequently Asked Questions (FAQ)

Q: Can the SM662PXC BEST directly replace the SM662PXC-ACS without PCB modifications?

A: No. The substitute uses a 100-BGA package versus the main part's 169-BGA package. Different ball grid array configurations require PCB layout redesign and re-routing of signal traces. Mechanical and electrical compatibility cannot be achieved through socket-level substitution.

Q: What is the significance of the different NAND technologies (MLC vs. TLC)?

A: MLC (Multi-Level Cell) stores two bits per cell, while TLC (Triple-Level Cell) stores three bits per cell. This affects data retention characteristics, write cycle endurance, and error correction requirements. The eMMC interface abstracts these differences, but firmware and controller implementations may differ between parts.

Q: Is the SM662PXC BEST suitable for automotive applications?

A: The SM662PXC BEST does not carry explicit AEC-Q100 qualification or automotive grade designation in the provided specifications. Automotive application suitability must be confirmed through Silicon Motion technical documentation or direct manufacturer consultation.

Q: Why does the substitute have a narrower operating temperature range?

A: The SM662PXC BEST operates from -25°C to 85°C, compared to the main part's -40°C to 85°C. Applications requiring operation below -25°C must verify compatibility with actual system thermal requirements and confirm whether the narrower range is acceptable for the intended use case.

Q: Are there any compliance or regulatory differences between these parts?

A: Both parts maintain ROHS3 compliance and REACH unaffected status. No regulatory compliance differences are indicated in the provided specifications. However, automotive-specific certifications differ, requiring application-level verification.

Q: What inventory status should influence procurement decisions?

A: The SM662PXC-ACS (Obsolete) has 1361 Pcs in stock, while the SM662PXC BEST (Active) has 965 Pcs available. The Active status of the substitute ensures long-term availability and ongoing manufacturer support, making it the preferred choice for new designs and ongoing production.