SM662PXB-ACS Equivalent & Substitute Parts

Part Overview

The SM662PXB-ACS is a FERRI-eMMC BGA 153-B eMMC 5.0 memory IC manufactured by Silicon Motion, Inc. This component is a FLASH - NAND (MLC) non-volatile memory device in a 153-TBGA package (11.5x13mm) designed for embedded multimedia card applications. The part is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new design implementations.

Substiute Parts

SM662PXB-ACS

Silicon Motion, Inc.In Stock: 1193SM662PXB-ACS Datasheet

Current PartRFQ

SM662PXB BEST

Silicon Motion, Inc.In Stock: 1123SM662PXB BEST Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM662PXB-ACS is determined by the following critical parameters:

• Manufacturer: Silicon Motion, Inc. (Ferri-eMMC® series)
• Memory Interface: eMMC protocol compatibility
• Memory Format: FLASH - NAND technology
• Mounting Type: Surface Mount BGA package
• Compliance: ROHS3 and REACH compliance alignment
• Operating Temperature Range: Compatibility with -40°C ~ 85°C specification
• Moisture Sensitivity Level: MSL 3 classification

The SM662PXB BEST is identified as the manufacturer-recommended substitute. Both parts share the same base product number (SM662), manufacturer, memory interface standard, and compliance certifications. The substitute maintains eMMC protocol compatibility and surface mount BGA packaging, enabling direct functional replacement in applications requiring FLASH - NAND memory storage.

Parameter Comparison

Engineering Selection Recommendations

The SM662PXB BEST is the manufacturer-recommended substitute for the obsolete SM662PXB-ACS. Both components are manufactured by Silicon Motion, Inc., and maintain identical compliance certifications (ROHS3 and REACH Unaffected). The substitute is currently in active production status, ensuring availability for procurement and supply chain continuity.

Key considerations for selection:

• Compliance Alignment: Both parts maintain ROHS3 compliance and REACH unaffected status, suitable for regulated applications.
• Production Status: The substitute is active, providing long-term availability compared to the obsolete main part.
• Interface Compatibility: Both components implement the eMMC memory interface standard, ensuring protocol-level compatibility.
• Packaging Differences: The substitute uses a 100-LBGA package (14x18mm) versus the main part's 153-TBGA package (11.5x13mm). PCB layout and footprint modifications are required.
• Operating Temperature Range: The substitute operates from -25°C ~ 85°C, which is narrower than the main part's -40°C ~ 85°C range. Applications requiring operation below -25°C require alternative solutions.

Frequently Asked Questions (FAQ)

Q: Can SM662PXB BEST directly replace SM662PXB-ACS without PCB modifications?

A: No. The packages differ significantly: SM662PXB-ACS uses 153-TBGA (11.5x13mm) while SM662PXB BEST uses 100-LBGA (14x18mm). PCB footprint redesign and layout modifications are required.

Q: Are both parts compatible with eMMC 5.0 specifications?

A: Both components implement the eMMC memory interface standard. The main part is specified as eMMC 5.0; the substitute is specified as eMMC without version designation in the provided data.

Q: What is the difference between MLC and TLC NAND technology?

A: MLC (Multi-Level Cell) stores two bits per cell, while TLC (Triple-Level Cell) stores three bits per cell. This affects memory density, performance characteristics, and endurance. The substitute uses TLC technology.

Q: Is the substitute suitable for applications requiring -40°C operation?

A: No. The substitute operates from -25°C ~ 85°C. Applications requiring -40°C minimum operation temperature require alternative components.

Q: Are moisture sensitivity levels identical between both parts?

A: Yes. Both components are classified as MSL 3 (168 Hours), requiring identical handling and storage protocols.

Q: What is the memory capacity difference between the parts?

A: The substitute SM662PXB BEST specifies 256Gbit capacity with 32G x 8 organization. The main part capacity is not provided in the available data.