SM662PXB-AC eMMC Memory IC Equivalent & Substitute Parts

Part Overview

The SM662PXB-AC is a Ferri-eMMC® NAND Flash memory IC manufactured by Silicon Motion, Inc., featuring a 153-BGA package configuration (11.5x13mm). This component is classified as a non-volatile FLASH memory device utilizing MLC (Multi-Level Cell) NAND technology with eMMC 5.0 interface protocol. The part is currently marked as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new design implementations.

Substiute Parts

SM662PXB-AC

Silicon Motion, Inc.In Stock: 1074SM662PXB-AC Datasheet

Current PartRFQ

SM662PXB BESS

Silicon Motion, Inc.In Stock: 854SM662PXB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM662PXB-AC is determined by the following critical parameters:

• Manufacturer: Silicon Motion, Inc. (Ferri-eMMC® series)
• Memory Interface: eMMC protocol compatibility
• Package Configuration: 153-TBGA form factor (11.5x13mm)
• Mounting Type: Surface Mount BGA
• Memory Format: FLASH (NAND technology)
• Compliance Standards: ROHS3 and REACH requirements
• Moisture Sensitivity Level: MSL 3 classification

The SM662PXB BESS qualifies as a manufacturer-recommended substitute based on identical package geometry, interface protocol, mounting methodology, and regulatory compliance. Both components share the same base product number (SM662) and are manufactured by Silicon Motion, Inc., ensuring design compatibility at the PCB level.

Parameter Comparison

Engineering Selection Recommendations

The SM662PXB BESS is the manufacturer-recommended substitute for the obsolete SM662PXB-AC. Selection of this alternative is supported by:

• Active Product Status: The substitute maintains current manufacturing and supply chain availability, eliminating obsolescence risk.
• Identical Package Geometry: Both components utilize the 153-TBGA form factor, ensuring direct PCB compatibility without layout modifications.
• Regulatory Compliance: Both parts maintain ROHS3 and REACH compliance with matching ECCN and HTSUS classifications, satisfying procurement and export requirements.
• Consistent MSL Rating: Identical moisture sensitivity classification ensures equivalent handling and storage protocols.
• eMMC Interface Compatibility: Both devices implement the eMMC protocol, maintaining firmware and driver compatibility.

The primary technical difference is the NAND cell technology transition from MLC to SLC in the substitute part. This change does not preclude substitution but represents a design evolution within the Ferri-eMMC® product line. The operating temperature lower bound shifts from -40°C to -25°C; applications requiring operation below -25°C must be evaluated against specific system requirements.

Frequently Asked Questions (FAQ)

Q: Can SM662PXB BESS be used as a direct replacement for SM662PXB-AC in existing designs?

A: Yes. Both components share identical package geometry (153-TBGA, 11.5x13mm), eMMC interface protocol, and surface mount configuration. PCB layout and firmware compatibility are maintained. The operating temperature range difference (-40°C vs -25°C minimum) must be verified against application requirements.

Q: What is the difference between MLC and SLC NAND technology in these parts?

A: MLC (Multi-Level Cell) stores multiple bits per cell, while SLC (Single-Level Cell) stores one bit per cell. This is a technology classification provided in the component specifications. Selection between these technologies depends on system performance and reliability requirements as defined in your application.

Q: Are both parts compliant with RoHS and REACH regulations?

A: Yes. Both SM662PXB-AC and SM662PXB BESS are ROHS3 compliant and REACH unaffected, with identical ECCN (3A991B1A) and HTSUS (8542.32.0071) classifications.

Q: Why is SM662PXB-AC marked as obsolete?

A: Product obsolescence is a manufacturer lifecycle determination. The SM662PXB BESS represents the active continuation within the Ferri-eMMC® product family and is the recommended alternative for new designs and ongoing support.

Q: What is the MSL rating and why does it matter?

A: Both parts carry MSL 3 (168 Hours) classification. This moisture sensitivity level specifies handling, storage, and reflow requirements. Components must be stored in controlled humidity environments and have defined shelf life limits before PCB assembly.

Q: Are there any firmware or driver updates required when switching to SM662PXB BESS?

A: Both components implement the eMMC interface protocol. Firmware and driver compatibility is maintained. Verification against your specific system implementation is recommended as part of standard component qualification procedures.