SM662PX8-AC eMMC Memory IC Equivalent & Substitute Parts

Part Overview

The SM662PX8-AC is a FLASH-NAND (MLC) Memory IC manufactured by Silicon Motion, Inc., configured as an eMMC 5.0 module in 153-BGA packaging (11.5x13mm). This component is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and component procurement.

The necessity to identify equivalent parts stems from the product's obsolete status, which restricts availability through standard distribution channels. Substitute parts must maintain compatibility across the eMMC interface, BGA package specification, and thermal operating range to ensure functional equivalence in target applications.

Substiute Parts

SM662PX8-AC

Silicon Motion, Inc.In Stock: 946SM662PX8-AC Datasheet

Current PartRFQ

SM662PXB BESS

Silicon Motion, Inc.In Stock: 854SM662PXB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the SM662PX8-AC are identified based on the following critical parameters that determine functional compatibility:

• Memory Interface: eMMC protocol compatibility
• Package Specification: 153-TBGA (11.5x13mm) form factor
• Mounting Type: Surface Mount configuration
• Manufacturer: Silicon Motion, Inc. (same manufacturer ensures design continuity)
• Series: Ferri-eMMC® product line
• RoHS & Compliance: ROHS3 Compliant, REACH Unaffected status
• Moisture Sensitivity Level: MSL 3 (168 Hours)

The SM662PXB BESS qualifies as a substitute part because it maintains identical package geometry, eMMC interface specification, mounting type, and compliance certifications. While the substitute employs FLASH-NAND (SLC) technology instead of MLC, both technologies operate within the eMMC 5.0 protocol framework and are compatible with the same socket and interface requirements.

Parameter Comparison

Engineering Selection Recommendations

The SM662PXB BESS is the designated manufacturer-recommended substitute for the obsolete SM662PX8-AC. Selection of this substitute is supported by the following engineering criteria:

• Product Status: The SM662PXB BESS maintains Active status, ensuring continued availability and manufacturing support, whereas the original part is Obsolete.
• Compliance Certifications: Both parts maintain identical ROHS3 Compliant and REACH Unaffected status, ensuring regulatory compatibility in target applications.
• Package & Interface Compatibility: Identical 153-TBGA (11.5x13mm) package and eMMC interface specification enable direct socket compatibility without PCB redesign.
• Thermal Operating Range: The substitute operates across -25°C to 85°C. Applications requiring operation below -25°C must evaluate thermal requirements against the narrower low-temperature specification.
• Moisture Sensitivity: Identical MSL 3 (168 Hours) rating ensures equivalent handling and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can the SM662PXB BESS be used as a direct replacement for the SM662PX8-AC without PCB modifications?

A: Yes. Both parts share identical 153-TBGA (11.5x13mm) package specifications, eMMC interface protocols, and surface mount configuration. No PCB redesign is required for physical or electrical compatibility.

Q: What is the difference between MLC and SLC NAND technology in these parts?

A: The original SM662PX8-AC uses MLC (Multi-Level Cell) technology, while the substitute SM662PXB BESS uses SLC (Single-Level Cell) technology. Both operate within the eMMC 5.0 protocol framework. SLC technology typically offers different performance and endurance characteristics compared to MLC, but both are compatible with eMMC interface requirements.

Q: Are there any thermal operating range limitations when substituting the SM662PXB BESS?

A: The substitute part operates across -25°C to 85°C, compared to the original part's -40°C to 85°C range. Applications requiring operation below -25°C must evaluate whether the narrower low-temperature specification is acceptable for the target system environment.

Q: Do both parts require identical handling and storage procedures?

A: Yes. Both parts maintain identical Moisture Sensitivity Level (MSL) 3 (168 Hours) ratings, requiring equivalent handling, storage, and reflow procedures during assembly.

Q: Is the SM662PXB BESS the only available substitute?

A: Based on the provided manufacturer data, the SM662PXB BESS is the designated manufacturer-recommended substitute. It is the only part listed in the substitute parts database for the SM662PX8-AC.