SM662PED-BDST Equivalent & Substitute Parts

Part Overview

The SM662PED-BDST is a 1Tbit eMMC 3D TLC NAND Flash memory IC manufactured by Silicon Motion, Inc., packaged in a 153-BGA (11.5x13mm) configuration. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, redesigns, and inventory management. The part operates across the industrial temperature range of -40°C to 85°C and complies with ROHS3 standards.

Substiute Parts

SM662PED-BDST

Silicon Motion, Inc.In Stock: 1189SM662PED-BDST Datasheet

Current PartRFQ

SM662PED-BEST

Silicon Motion, Inc.In Stock: 1039SM662PED-BEST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM662PED-BDST is determined by strict alignment of the following critical parameters:

• Memory capacity: 1Tbit (128G x 8 organization)
• Memory interface: eMMC protocol compliance
• Technology: NAND Flash TLC
• Operating temperature range: -40°C to 85°C
• Regulatory compliance: ROHS3 and ECCN classification
• Manufacturer: Silicon Motion, Inc. (Ferri-eMMC® series)

The SM662PED-BEST qualifies as a substitute based on identical memory specifications, interface protocol, and compliance certifications. The primary distinction lies in package configuration and product status, which may affect availability and application suitability.

Parameter Comparison

Engineering Selection Recommendations

The SM662PED-BEST serves as the functional equivalent for the obsolete SM662PED-BDST based on identical memory capacity, organization, interface protocol, and operating specifications. Both components maintain ROHS3 compliance and identical ECCN/HTSUS classifications, ensuring regulatory consistency.

The primary consideration for component selection is package configuration. The SM662PED-BDST utilizes a 153-BGA (11.5x13mm) footprint, while the SM662PED-BEST employs a 100-BGA (14x18mm) footprint. This difference requires PCB layout modification and may impact thermal management characteristics depending on application design.

The SM662PED-BEST holds active product status, ensuring continued availability and supply chain stability compared to the obsolete SM662PED-BDST. Selection of the substitute part necessitates hardware redesign to accommodate the different BGA package geometry.

Frequently Asked Questions (FAQ)

Q: Can SM662PED-BEST directly replace SM662PED-BDST without PCB modification?

A: No. The parts employ different BGA package configurations (153-BGA vs. 100-BGA with different dimensions). PCB layout redesign is required to accommodate the footprint change.

Q: Are the memory specifications identical between these parts?

A: Yes. Both components provide 1Tbit capacity with 128G x 8 organization, eMMC interface, and TLC NAND technology. Memory performance and protocol compliance are equivalent.

Q: What is the significance of the product status difference?

A: SM662PED-BDST is classified as obsolete, indicating discontinued manufacturing and limited availability. SM662PED-BEST maintains active status, ensuring reliable supply and long-term component availability.

Q: Do both parts meet the same regulatory requirements?

A: Yes. Both components are ROHS3 compliant with identical ECCN (3A991B1A) and HTSUS (8542.32.0071) classifications, ensuring equivalent regulatory standing.

Q: Are there thermal or reliability differences between the package types?

A: Package geometry differences may affect thermal dissipation characteristics. The 100-BGA (14x18mm) footprint differs from the 153-BGA (11.5x13mm) configuration. Thermal analysis specific to your application design is necessary to confirm suitability.

Q: What is the MSL rating, and does it apply to both parts?

A: Both components carry MSL 3 rating with a 168-hour floor life. This moisture sensitivity level requires controlled storage and handling conditions prior to assembly.