SM662PEC-BDST Equivalent & Substitute Parts

Part Overview

The SM662PEC-BDST is a 512Gbit eMMC 3D TLC NAND Flash memory IC manufactured by Silicon Motion, Inc., packaged in a 153-BGA (11.5x13mm) configuration. This component is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and component procurement. The part operates across the industrial temperature range of -40°C to 85°C and complies with ROHS3 standards.

Substiute Parts

SM662PEC-BDST

Silicon Motion, Inc.In Stock: 1169SM662PEC-BDST Datasheet

Current PartRFQ

SM662PEC-BEST

Silicon Motion, Inc.In Stock: 967SM662PEC-BEST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the SM662PEC-BDST are identified based on the following critical parameters that determine functional and physical compatibility:

Core Substitution Criteria:

• Memory Size: 512Gbit (exact match required)
• Memory Organization: 64G x 8 (exact match required)
• Memory Technology: FLASH - NAND (TLC) (exact match required)
• Memory Interface: eMMC (exact match required)
• Base Product Number: SM662 (same silicon platform)
• Operating Temperature Range: -40°C ~ 85°C (exact match required)
• RoHS Status: ROHS3 Compliant (compliance requirement)
• Moisture Sensitivity Level: 3 (168 Hours) (handling requirement)

The SM662PEC-BEST qualifies as a substitute because it maintains identical electrical specifications, memory capacity, interface protocol, and environmental operating conditions. The primary difference is the package configuration (100-BGA vs. 153-BGA), which represents a physical form factor variation while preserving all functional parameters.

Parameter Comparison

Engineering Selection Recommendations

The SM662PEC-BEST is available as an active product with current manufacturing status, whereas the SM662PEC-BDST is obsolete. Both parts maintain identical electrical specifications, memory capacity, interface protocol, and environmental operating conditions. Selection between these parts depends on PCB layout constraints and BGA footprint compatibility. The 153-BGA (11.5x13mm) footprint of the main part differs from the 100-BGA (14x18mm) footprint of the substitute, requiring PCB redesign if substitution is implemented. Both parts comply with ROHS3 standards and maintain equivalent moisture sensitivity handling requirements.

Frequently Asked Questions (FAQ)

Q: Can SM662PEC-BEST directly replace SM662PEC-BDST without PCB modification?

A: No. While both parts are electrically and functionally identical, they use different BGA package configurations (153-BGA vs. 100-BGA). PCB footprint redesign is required for physical compatibility.

Q: Are the electrical specifications identical between these parts?

A: Yes. Both parts share identical memory capacity (512Gbit), organization (64G x 8), technology (FLASH - NAND TLC), interface (eMMC), and operating temperature range (-40°C ~ 85°C).

Q: What is the significance of the product status difference?

A: SM662PEC-BDST is obsolete, meaning it is no longer manufactured. SM662PEC-BEST is active and available for procurement, making it the preferred choice for new designs or ongoing component sourcing.

Q: Do both parts require the same handling procedures?

A: Yes. Both parts have identical Moisture Sensitivity Level (MSL) ratings of 3 (168 Hours), requiring equivalent storage and handling protocols.

Q: What does the base product number SM662 indicate?

A: The base product number identifies the common silicon platform and core memory architecture shared between these variants. Differences exist only in package configuration and product lifecycle status.