SM662PEC-ACS Equivalent & Substitute Parts

Part Overview

The SM662PEC-ACS is a Ferri-eMMC® NAND Flash memory IC in 169-BGA packaging, implementing eMMC 5.0 interface technology with MLC (Multi-Level Cell) architecture. This component is classified as obsolete, necessitating identification of active equivalent parts for ongoing design requirements and production continuity. The part operates across the industrial temperature range of -40°C to 85°C and maintains ROHS3 compliance with MSL 3 moisture sensitivity rating.

Substiute Parts

SM662PEC-ACS

Silicon Motion, Inc.In Stock: 1059SM662PEC-ACS Datasheet

Current PartRFQ

SM662PEC BESS

Silicon Motion, Inc.In Stock: 1033SM662PEC BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM662PEC-ACS is determined by the following critical parameters:

• Manufacturer Consistency: Equivalent parts must originate from Silicon Motion, Inc., ensuring design validation and supply chain reliability
• Base Product Family: The SM662 base product number establishes the functional platform; substitutes must maintain this designation
• Memory Interface: eMMC interface compatibility is mandatory for system-level integration
• Operating Temperature Range: -40°C to 85°C industrial range must be maintained
• Compliance Standards: ROHS3 compliance and MSL 3 rating are non-negotiable for manufacturing and storage requirements

The substitute SM662PEC BESS shares all critical parameters with the main part while offering active product status and different memory cell technology (SLC vs. MLC) and packaging configuration (100-LBGA vs. 169-BGA).

Parameter Comparison

Engineering Selection Recommendations

The SM662PEC BESS qualifies as a functional equivalent based on shared manufacturer origin, identical base product family designation, matching eMMC interface specification, and aligned operating temperature parameters. Both parts maintain ROHS3 compliance and MSL 3 moisture sensitivity classification, ensuring manufacturing process compatibility.

The transition from SM662PEC-ACS (obsolete) to SM662PEC BESS (active) is supported by active product status of the substitute, providing supply chain continuity and ongoing manufacturer support. The shift from MLC to SLC technology and the change from 169-BGA to 100-LBGA packaging represent design-level considerations that must be evaluated within the context of specific application requirements and PCB layout constraints.

Frequently Asked Questions (FAQ)

Q: Can SM662PEC BESS directly replace SM662PEC-ACS in existing designs?

A: Both parts share the same manufacturer, base product number, eMMC interface, and operating temperature range. However, the package change from 169-BGA to 100-LBGA requires PCB layout modification. The memory cell technology transition from MLC to SLC must be evaluated for application-specific performance and capacity requirements.

Q: What is the significance of the MLC to SLC technology difference?

A: MLC (Multi-Level Cell) and SLC (Single-Level Cell) represent different NAND Flash architectures. This parameter difference is provided in the component specifications and must be assessed against application requirements.

Q: Are both parts suitable for industrial temperature applications?

A: Both SM662PEC-ACS and SM662PEC BESS operate across -40°C to 85°C, meeting industrial temperature specifications. Both maintain MSL 3 rating for moisture sensitivity.

Q: What does the change from 169-BGA to 100-LBGA packaging mean?

A: BGA (Ball Grid Array) packaging differs in ball count and physical dimensions. The 169-BGA contains 169 connection points, while 100-LBGA contains 100 connection points. This requires PCB redesign and cannot be accommodated through board layout adjustment alone.

Q: Are compliance certifications maintained across both parts?

A: Both parts maintain ROHS3 compliance and carry identical ECCN and HTSUS classifications, ensuring regulatory and export compliance consistency.