SM662PEA-AC Equivalent & Substitute Parts

Part Overview

The SM662PEA-AC is a Ferri-eMMC® NAND Flash memory IC in 153-BGA packaging manufactured by Silicon Motion, Inc. This component features MLC (Multi-Level Cell) NAND technology with eMMC 5.0 interface support and operates across the industrial temperature range of -40°C to 85°C. The product is classified as obsolete, necessitating identification of active equivalent alternatives that maintain functional compatibility within the SM662 base product family while meeting current supply chain requirements.

Substiute Parts

SM662PEA-AC

Silicon Motion, Inc.In Stock: 1154SM662PEA-AC Datasheet

Current PartRFQ

SM662PEB BESS

Silicon Motion, Inc.In Stock: 830SM662PEB BESS Datasheet

MFR RecommendedRFQ

SM662PEC BFSS

Silicon Motion, Inc.In Stock: 1525SM662PEC BFSS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM662PEA-AC is determined by the following criteria:

Primary Compatibility Parameters:

• Shared base product number (SM662)
• Identical memory interface (eMMC)
• Identical operating temperature range (-40°C ~ 85°C)
• Identical mounting type (Surface Mount)
• Identical RoHS compliance status (ROHS3)
• Identical moisture sensitivity level (MSL 3)

Acceptable Variations:

• Memory technology: MLC to SLC transition (SLC provides enhanced reliability and endurance)
• Package configuration: 153-BGA variants with identical footprint dimensions (11.5x13)
• Memory capacity: Increased capacity in substitute parts (80Gbit or 160Gbit vs. unspecified in main part)
• Product status: Obsolete to Active transition

Two substitute parts meet these criteria and are manufacturer-recommended alternatives within the SM662 family.

Parameter Comparison

Engineering Selection Recommendations

SM662PEC BFSS is the primary substitute for SM662PEA-AC applications. This part maintains identical package footprint (153-BGA, 11.5x13 dimensions), identical BGA pin count (153), and identical operating specifications. The transition from MLC to SLC technology provides enhanced write endurance and data retention characteristics. The part is currently in active production status with established supply availability. ROHS3 compliance and identical export classification (ECCN 3A991B1A) ensure regulatory continuity.

SM662PEB BESS is an alternative substitute when package footprint flexibility exists. This part differs in BGA configuration (100-BGA, 14x18 dimensions) and pin count (100 vs. 153), requiring PCB layout modification. The reduced memory capacity (80Gbit) and different package geometry necessitate design-level evaluation. This option is suitable only when board redesign is feasible and lower capacity requirements are acceptable.

Selection between these two substitutes depends on PCB layout constraints and memory capacity requirements. SM662PEC BFSS is recommended for direct replacement without design modification.

Frequently Asked Questions (FAQ)

Q: Can SM662PEB BESS directly replace SM662PEA-AC without PCB modification?

A: No. SM662PEB BESS uses a 100-BGA package (14x18mm) versus the 153-BGA package (11.5x13mm) of SM662PEA-AC. The pin count differs (100 vs. 153), requiring PCB layout redesign and re-routing of signal traces.

Q: Can SM662PEC BFSS be used as a drop-in replacement?

A: Yes. SM662PEC BFSS maintains the identical 153-BGA package footprint (11.5x13mm) and pin count. No PCB layout modification is required for physical compatibility.

Q: What is the difference between MLC and SLC technology in these parts?

A: MLC (Multi-Level Cell) stores multiple bits per cell, while SLC (Single-Level Cell) stores one bit per cell. SLC provides superior write endurance, faster write speeds, and improved data retention. The SM662PEC BFSS substitute uses SLC technology.

Q: Are the operating temperature ranges identical across all three parts?

A: Yes. SM662PEA-AC, SM662PEB BESS, and SM662PEC BFSS all operate across -40°C to 85°C, ensuring thermal compatibility in equivalent applications.

Q: Do the substitute parts maintain RoHS3 compliance?

A: Yes. Both SM662PEB BESS and SM662PEC BFSS are ROHS3 compliant, matching the compliance status of SM662PEA-AC.

Q: What is the memory capacity difference between substitutes?

A: SM662PEB BESS provides 80Gbit capacity (10G x 8 organization), while SM662PEC BFSS provides 160Gbit capacity (20G x 8 organization). The main part capacity is not specified in available documentation.

Q: Are moisture sensitivity levels the same across all parts?

A: Yes. All three parts carry MSL 3 (168 Hours) rating, indicating identical moisture handling and storage requirements.

Q: What is the current availability status of these substitutes?

A: SM662PEC BFSS is in active production with 1487 units in stock. SM662PEB BESS is also active with 764 units in stock. SM662PEA-AC is obsolete with 1057 units remaining in inventory.