SM662PE8-AC eMMC Memory IC Equivalent & Substitute Parts

Part Overview

The SM662PE8-AC is a Ferri-eMMC® NAND Flash memory IC manufactured by Silicon Motion, Inc., configured as a 153-BGA (11.5x13mm) package. This component is classified as obsolete, necessitating identification of active equivalent parts for ongoing design support and procurement. The part operates across the industrial temperature range of -40°C to 85°C and maintains ROHS3 compliance with MSL 3 rating.

Substiute Parts

SM662PE8-AC

Silicon Motion, Inc.In Stock: 1009SM662PE8-AC Datasheet

Current PartRFQ

SM662PEB BESS

Silicon Motion, Inc.In Stock: 830SM662PEB BESS Datasheet

MFR RecommendedRFQ

SM662PEB BEST

Silicon Motion, Inc.In Stock: 817SM662PEB BEST Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM662PE8-AC is determined by the following criteria:

Common Base Product Number: All substitute parts share the SM662 base product number, indicating they are part of the same Ferri-eMMC® product family from Silicon Motion, Inc.

Shared Electrical Interface: All parts maintain eMMC memory interface compatibility, enabling functional replacement in eMMC-based system designs.

Compliance Alignment: Substitute parts maintain identical RoHS3 compliance, MSL 3 rating, and operating temperature range (-40°C ~ 85°C), ensuring environmental and regulatory compatibility.

Package Variation: Substitute parts utilize 100-BGA (14x18mm) packaging, which differs from the original 153-BGA (11.5x13mm) configuration. This represents a physical footprint change requiring PCB layout modification.

Technology Variants: Substitute parts employ different NAND Flash technologies (SLC and TLC) compared to the original MLC technology, resulting in different memory density and performance characteristics.

Parameter Comparison

Engineering Selection Recommendations

SM662PEB BESS (80Gbit SLC): This substitute part is recommended for applications requiring single-level cell (SLC) technology characteristics. The part maintains active product status with confirmed availability. The transition from 153-BGA to 100-BGA packaging requires PCB layout redesign. SLC technology provides different performance and endurance profiles compared to the original MLC configuration.

SM662PEB BEST (256Gbit TLC): This substitute part is recommended for applications requiring higher memory density through triple-level cell (TLC) technology. The part maintains active product status with confirmed availability. The transition from 153-BGA to 100-BGA packaging requires PCB layout redesign. TLC technology provides different performance and endurance profiles compared to the original MLC configuration.

Both substitute parts maintain full compliance with RoHS3 standards, MSL 3 moisture sensitivity rating, and the specified operating temperature range. Selection between these options depends on specific memory capacity and technology requirements of the target application.

Frequently Asked Questions (FAQ)

Q: Can SM662PEB BESS or SM662PEB BEST be used as direct pin-for-pin replacements for SM662PE8-AC?

A: No. While all parts share the same eMMC memory interface and base product number, the package change from 153-BGA (11.5x13mm) to 100-BGA (14x18mm) requires PCB layout modification. Pin mapping must be verified against detailed datasheets before implementation.

Q: What is the primary reason for substituting the SM662PE8-AC?

A: The SM662PE8-AC is classified as obsolete. SM662PEB BESS and SM662PEB BEST are active products from the same manufacturer and product family, ensuring ongoing availability and support.

Q: How do the NAND Flash technologies differ between these parts?

A: SM662PE8-AC uses MLC (Multi-Level Cell) technology. SM662PEB BESS uses SLC (Single-Level Cell) technology with 80Gbit capacity. SM662PEB BEST uses TLC (Triple-Level Cell) technology with 256Gbit capacity. These technologies have different performance, endurance, and reliability characteristics.

Q: Are there any compliance or environmental differences between these parts?

A: No. All three parts maintain identical RoHS3 compliance, MSL 3 rating, and operating temperature range of -40°C to 85°C.

Q: What is the memory capacity difference between the substitute parts?

A: SM662PEB BESS provides 80Gbit capacity (10G x 8 organization). SM662PEB BEST provides 256Gbit capacity (32G x 8 organization). The original SM662PE8-AC memory capacity is not specified in available documentation.