SM662GXD-BDST Equivalent & Substitute Parts

Part Overview

The SM662GXD-BDST is a FLASH - NAND (TLC) Memory IC manufactured by Silicon Motion, Inc., with a capacity of 1Tbit organized as 128G x 8. This component operates via eMMC interface in a 100-BGA (14x18) package and is rated for operating temperatures from -25°C to 85°C. The part is currently classified as Obsolete, making identification of compatible substitutes essential for ongoing system support and component procurement.

Substiute Parts

SM662GXD-BDST

Silicon Motion, Inc.In Stock: 979SM662GXD-BDST Datasheet

Current PartRFQ

SM662GXD-BEST

Silicon Motion, Inc.In Stock: 1092SM662GXD-BEST Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM662GXD-BDST is determined by strict equivalence across the following critical parameters:

• Memory Technology: FLASH - NAND (TLC)
• Memory Capacity: 1Tbit
• Memory Organization: 128G x 8
• Memory Interface: eMMC
• Package Type: 100-BGA (14x18)
• Operating Temperature Range: -25°C ~ 85°C
• Mounting Type: Surface Mount
• RoHS Compliance: ROHS3 Compliant

The substitute part SM662GXD-BEST meets all these criteria and is manufactured by the same supplier, Silicon Motion, Inc., within the Ferri-eMMC® series. The primary distinction is product status: SM662GXD-BEST is Active, whereas the original part is Obsolete.

Parameter Comparison

Engineering Selection Recommendations

SM662GXD-BEST is the direct substitute for SM662GXD-BDST. Both parts are ROHS3 Compliant and manufactured by Silicon Motion, Inc. The substitute part maintains identical electrical and mechanical specifications, including memory capacity, interface protocol, package dimensions, and operating temperature range. The primary advantage of SM662GXD-BEST is its Active product status, ensuring continued availability and manufacturer support. Both parts carry the same ECCN (3A991B1A) and HTSUS (8542.32.0071) classifications.

Frequently Asked Questions (FAQ)

Q: Can SM662GXD-BEST be used as a direct replacement for SM662GXD-BDST?

A: Yes. Both parts are electrically and mechanically equivalent. They share identical memory capacity (1Tbit), organization (128G x 8), interface (eMMC), package type (100-BGA 14x18), and operating temperature range (-25°C ~ 85°C).

Q: What is the difference between these two part numbers?

A: The primary difference is product status. SM662GXD-BDST is Obsolete, while SM662GXD-BEST is Active. The packaging designation differs (BDST vs. BEST), but the underlying component specifications remain identical.

Q: Are there any compliance or certification differences?

A: No. Both parts are ROHS3 Compliant and carry identical ECCN and HTSUS classifications. Both have Moisture Sensitivity Level 3 (168 Hours).

Q: Is the 100-BGA (14x18) package compatible with existing PCB designs?

A: Yes. Both parts use the same 100-LBGA package with identical footprint dimensions (14x18mm). PCB designs do not require modification.

Q: What is the operating temperature range for both parts?

A: Both SM662GXD-BDST and SM662GXD-BEST operate across -25°C to 85°C.