SM662GEC-BDST Equivalent & Substitute Parts

Part Overview

The SM662GEC-BDST is a 512Gbit eMMC 3D TLC NAND Flash memory IC manufactured by Silicon Motion, Inc., housed in a 100-BGA (14x18) package. This component is classified as obsolete, making equivalent substitute parts necessary for ongoing system support and procurement planning. The part operates across an industrial temperature range of -40°C to 85°C and complies with ROHS3 standards.

Substiute Parts

SM662GEC-BDST

Silicon Motion, Inc.In Stock: 771SM662GEC-BDST Datasheet

Current PartRFQ

SM662GEC-BEST

Silicon Motion, Inc.In Stock: 768SM662GEC-BEST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM662GEC-BDST is determined by strict equivalence across the following critical parameters:

• Memory capacity: 512Gbit
• Memory technology: FLASH - NAND (TLC)
• Memory interface: eMMC
• Memory organization: 64G x 8
• Package type: 100-BGA (14x18)
• Operating temperature range: -40°C ~ 85°C
• Mounting type: Surface Mount
• RoHS compliance: ROHS3 Compliant
• Moisture sensitivity level: 3 (168 Hours)
• Manufacturer: Silicon Motion, Inc.
• Series: Ferri-eMMC®

The SM662GEC-BEST meets all substitution criteria and is classified as an active product, providing continuity for applications requiring the SM662GEC-BDST.

Parameter Comparison

Engineering Selection Recommendations

The SM662GEC-BEST is the direct equivalent substitute for the SM662GEC-BDST. Both components share identical electrical and mechanical specifications, including memory capacity, interface protocol, package geometry, and thermal operating range. The primary distinction is product status: the SM662GEC-BDST is obsolete, while the SM662GEC-BEST maintains active production status.

For new designs or system refreshes, the SM662GEC-BEST is the appropriate selection. Both parts maintain ROHS3 compliance and identical ECCN and HTSUS classifications, ensuring regulatory and export compliance equivalence. The SM662GEC-BEST is available in Tray packaging, whereas the SM662GEC-BDST packaging specification was not provided.

Frequently Asked Questions (FAQ)

Q: Can SM662GEC-BEST directly replace SM662GEC-BDST in existing designs?

A: Yes. Both parts are functionally equivalent across all electrical and mechanical parameters. Pin configuration, signal timing, voltage requirements, and thermal characteristics are identical. No design modifications are required.

Q: What is the difference between these two part numbers?

A: The SM662GEC-BEST is the active production variant of the SM662GEC-BDST. The obsolete status of SM662GEC-BDST indicates end-of-life designation. Both parts are manufactured by Silicon Motion, Inc., and belong to the Ferri-eMMC® series.

Q: Are there packaging differences?

A: The SM662GEC-BEST is supplied in Tray packaging. The SM662GEC-BDST packaging format was not specified in available documentation. Both use identical 100-BGA (14x18) physical packages suitable for surface mount assembly.

Q: Do both parts meet the same compliance standards?

A: Yes. Both SM662GEC-BDST and SM662GEC-BEST are ROHS3 compliant with identical ECCN (3A991B1A) and HTSUS (8542.32.0071) classifications.

Q: What is the moisture sensitivity level, and how does it affect handling?

A: Both parts carry MSL 3 (168 Hours) rating. This indicates the component can remain at 30°C / 85% relative humidity for up to 168 hours before requiring baking prior to reflow soldering. Standard moisture control procedures apply to both variants.