SM662GEC-ACS eMMC Memory IC Equivalent & Substitute Parts

Part Overview

The SM662GEC-ACS is a FLASH-NAND (MLC) Memory IC manufactured by Silicon Motion, Inc., configured as a 100-BGA eMMC 5.0 module with 14x18mm footprint. This component is classified as obsolete, making substitute part identification critical for ongoing system support and new design implementations. The part operates across the industrial temperature range of -40°C to 85°C and maintains ROHS3 compliance with MSL 3 moisture sensitivity rating.

Substiute Parts

SM662GEC-ACS

Silicon Motion, Inc.In Stock: 937SM662GEC-ACS Datasheet

Current PartRFQ

SM662GEB BEST

Silicon Motion, Inc.In Stock: 1067SM662GEB BEST Datasheet

MFR RecommendedRFQ

SM662GEE BFSS

Silicon Motion, Inc.In Stock: 868SM662GEE BFSS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM662GEC-ACS is determined by the following mandatory parameters:

• Manufacturer: Silicon Motion, Inc. (same manufacturer ensures design compatibility)
• Memory Interface: eMMC (electrical and protocol compatibility)
• Package Type: 100-LBGA (14x18mm) (mechanical and thermal compatibility)
• Operating Temperature Range: -40°C ~ 85°C (environmental specification match)
• Mounting Type: Surface Mount (assembly process compatibility)
• RoHS Status: ROHS3 Compliant (regulatory compliance)
• Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements)

The SM662 base product family shares identical package geometry, pin configuration, and interface protocol. Substitute parts within this family differ only in memory technology (MLC, TLC, or SLC) and resulting memory capacity, which do not affect electrical compatibility or physical mounting characteristics.

Parameter Comparison

Engineering Selection Recommendations

Both SM662GEB BEST and SM662GEE BFSS are qualified substitutes for the obsolete SM662GEC-ACS based on identical electrical interface, package geometry, and environmental specifications.

SM662GEB BEST is designated as the manufacturer-recommended primary substitute. This part maintains active product status and provides 256Gbit capacity with TLC technology. It satisfies all mandatory compatibility parameters and is suitable for direct replacement in applications where the original MLC technology is no longer available.

SM662GEE BFSS is an alternative substitute offering 640Gbit capacity with SLC technology. This part also maintains active product status and meets all mandatory compatibility requirements. Selection between SM662GEB BEST and SM662GEE BFSS depends on system memory capacity requirements, as both are electrically and mechanically interchangeable with the original SM662GEC-ACS.

Both substitutes carry ROHS3 compliance, identical MSL ratings, and matching operating temperature specifications, ensuring compatibility with existing assembly and handling procedures.

Frequently Asked Questions (FAQ)

Q: Can SM662GEB BEST and SM662GEE BFSS be used interchangeably with SM662GEC-ACS?

A: Yes. Both parts share identical eMMC interface protocol, 100-LBGA package geometry (14x18mm), operating temperature range (-40°C to 85°C), and RoHS compliance status. Electrical and mechanical compatibility is confirmed across all specified parameters.

Q: What is the difference between MLC, TLC, and SLC technologies in these parts?

A: These designations refer to the memory cell technology used. MLC (Multi-Level Cell) is used in SM662GEC-ACS, TLC (Triple-Level Cell) in SM662GEB BEST, and SLC (Single-Level Cell) in SM662GEE BFSS. From an interface and compatibility perspective, these differences do not affect eMMC protocol operation or package compatibility.

Q: Why is SM662GEB BEST designated as the manufacturer-recommended substitute?

A: SM662GEB BEST is identified as the primary substitute by Silicon Motion, Inc., the component manufacturer. This designation reflects the manufacturer's engineering assessment of direct replacement suitability.

Q: Are there any differences in handling or storage requirements between these parts?

A: All three parts carry identical Moisture Sensitivity Level 3 (168 Hours) ratings, requiring the same handling, storage, and reflow procedures. No additional precautions are necessary when transitioning from SM662GEC-ACS to either substitute.

Q: Can these parts be used in new designs?

A: SM662GEB BEST and SM662GEE BFSS maintain active product status and are suitable for new design implementations. SM662GEC-ACS is obsolete and should not be specified for new designs.